JPS618146U - optical printer head - Google Patents

optical printer head

Info

Publication number
JPS618146U
JPS618146U JP1984092140U JP9214084U JPS618146U JP S618146 U JPS618146 U JP S618146U JP 1984092140 U JP1984092140 U JP 1984092140U JP 9214084 U JP9214084 U JP 9214084U JP S618146 U JPS618146 U JP S618146U
Authority
JP
Japan
Prior art keywords
substrate
printer head
optical printer
light emitting
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984092140U
Other languages
Japanese (ja)
Other versions
JPH0518147Y2 (en
Inventor
俊男 井上
茂 坂口
Original Assignee
三洋電機株式会社
鳥取三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社, 鳥取三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP1984092140U priority Critical patent/JPS618146U/en
Publication of JPS618146U publication Critical patent/JPS618146U/en
Application granted granted Critical
Publication of JPH0518147Y2 publication Critical patent/JPH0518147Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Electronic Switches (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Laser Beam Printer (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】 第１図は本考案実施例の光プリンタヘッドの分解斜視図
、第２図はそのプリンタヘッドの組立ての１工程を示す
正面図である。 １・・・・・・基板、２，２・・・・・・導電パターン
、３，３・・・・・・発光ダイオード、４・・・・・・
放熱板、５・・・・・・ｖ字溝、６，６・・・・・・Ｕ
字溝、７，７・・・・・・ビス穴。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of an optical printer head according to an embodiment of the present invention, and FIG. 2 is a front view showing one step of assembling the printer head. 1...Substrate, 2,2...Conductive pattern, 3,3...Light emitting diode, 4...
Heat sink, 5...V-shaped groove, 6,6...U
Shape groove, 7, 7...screw hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 長尺の基板と、基板の長手力向に沿って整列され基板上
に載置された発光ダイオードと、基板の裏面に配置され
た基板より面積の大きい放熱板を具備し、前記放熱板の
表面には前記発光ダイオードの整列方向に対し位置目安
となるＶ字溝が設けてある事を特徴とする光プリンタヘ
ッド。A long substrate, light emitting diodes arranged along the longitudinal direction of the substrate and mounted on the substrate, and a heat sink having a larger area than the substrate and arranged on the back side of the substrate, the surface of the heat sink being arranged on the back side of the substrate. An optical printer head characterized in that a V-shaped groove is provided as a position guide in the alignment direction of the light emitting diodes.
JP1984092140U 1984-06-20 1984-06-20 optical printer head Granted JPS618146U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984092140U JPS618146U (en) 1984-06-20 1984-06-20 optical printer head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984092140U JPS618146U (en) 1984-06-20 1984-06-20 optical printer head

Publications (2)

Publication Number Publication Date
JPS618146U true JPS618146U (en) 1986-01-18
JPH0518147Y2 JPH0518147Y2 (en) 1993-05-14

Family

ID=30648666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984092140U Granted JPS618146U (en) 1984-06-20 1984-06-20 optical printer head

Country Status (1)

Country Link
JP (1) JPS618146U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04130858U (en) * 1991-05-22 1992-12-01 ローム株式会社 scanning head
JP2003124528A (en) * 2001-08-09 2003-04-25 Matsushita Electric Ind Co Ltd Led illumination device and card led illumination light source

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04130858U (en) * 1991-05-22 1992-12-01 ローム株式会社 scanning head
JP2003124528A (en) * 2001-08-09 2003-04-25 Matsushita Electric Ind Co Ltd Led illumination device and card led illumination light source

Also Published As

Publication number Publication date
JPH0518147Y2 (en) 1993-05-14

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