JPH01101854U - - Google Patents
Info
- Publication number
- JPH01101854U JPH01101854U JP1987197860U JP19786087U JPH01101854U JP H01101854 U JPH01101854 U JP H01101854U JP 1987197860 U JP1987197860 U JP 1987197860U JP 19786087 U JP19786087 U JP 19786087U JP H01101854 U JPH01101854 U JP H01101854U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- heat sink
- iron
- submount
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000003491 array Methods 0.000 claims 2
- 229910000976 Electrical steel Inorganic materials 0.000 claims 1
- 229910000640 Fe alloy Inorganic materials 0.000 claims 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 claims 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Dot-Matrix Printers And Others (AREA)
Description
第１図は本考案実施例の光プリンタヘツドの斜
視図で、第２図はその要部断面図である。
１……放熱板、２，２……発光ダイオードアレ
イ、３，３……サブマウント、４……導電性接着
剤、５，５……駆動素子、６……回路基板。
FIG. 1 is a perspective view of an optical printer head according to an embodiment of the present invention, and FIG. 2 is a sectional view of a main part thereof. DESCRIPTION OF SYMBOLS 1... Heat sink, 2, 2... Light emitting diode array, 3, 3... Submount, 4... Conductive adhesive, 5, 5... Drive element, 6... Circuit board.
Claims (1)
放熱板の平面部にニツケル鉄、ニツケルコバルト
鉄もしくは珪素鋼の鉄合金からなるサブマウント
を介して発光部が整列するように載置固着された
複数の発光ダイオードアレイとを具備した事を特
徴とする光プリンタヘツド。 (2) 前記サブマウントは薄板状をなし、前記放
熱板の平面部に設けられた帯状電極上に複数枚敷
設された事を特徴とする実用新案登録請求の範囲
第１項記載の光プリンタヘツド。[Claims for Utility Model Registration] (1) A heat sink made of metal having a flat part, and a light emitting part mounted on the flat part of the heat sink via a submount made of an iron alloy of nickel iron, nickel cobalt iron, or silicon steel. 1. An optical printer head comprising: a plurality of light emitting diode arrays mounted and fixed so that the light emitting diode arrays are aligned. (2) The optical printer head according to claim 1, wherein the submount is in the form of a thin plate, and a plurality of submounts are laid on a strip-shaped electrode provided on the flat surface of the heat sink. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987197860U JPH01101854U (en) | 1987-12-25 | 1987-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987197860U JPH01101854U (en) | 1987-12-25 | 1987-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01101854U true JPH01101854U (en) | 1989-07-10 |
Family
ID=31488393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987197860U Pending JPH01101854U (en) | 1987-12-25 | 1987-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01101854U (en) |
-
1987
- 1987-12-25 JP JP1987197860U patent/JPH01101854U/ja active Pending
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