JPH0160559U - - Google Patents
Info
- Publication number
- JPH0160559U JPH0160559U JP1987155339U JP15533987U JPH0160559U JP H0160559 U JPH0160559 U JP H0160559U JP 1987155339 U JP1987155339 U JP 1987155339U JP 15533987 U JP15533987 U JP 15533987U JP H0160559 U JPH0160559 U JP H0160559U
- Authority
- JP
- Japan
- Prior art keywords
- side frame
- resin sealing
- tie bar
- light emitting
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は発光ダイオード素子の樹脂封止用リー
ドフレームの要部を示す裏面図であり、第２図は
該リードフレームと樹脂封止装置の要部を示す縦
断側面図であり、第３図は樹脂封止成形後におけ
る該リードフレームの要部拡大裏面図であり、第
４図は第３図の―線における端面図である。
（符号の説明）１…サイドフレーム、２……外
部リード、３…タイバー、４…延長片、５…エア
ベント用溝部、６…タイバー、７…補助タイバー
、８…延長片、９…エアベント用溝部、１０…係
合孔、１１…発光ダイオード素子、１２…リード
線。
FIG. 1 is a back view showing the main parts of a lead frame for resin sealing of a light emitting diode element, FIG. 2 is a vertical side view showing main parts of the lead frame and the resin sealing device, and FIG. 4 is an enlarged back view of the main part of the lead frame after resin sealing molding, and FIG. 4 is an end view taken along the line - - in FIG. 3. (Explanation of symbols) 1... Side frame, 2... External lead, 3... Tie bar, 4... Extension piece, 5... Air vent groove, 6... Tie bar, 7... Auxiliary tie bar, 8... Extension piece, 9... Air vent groove , 10... Engaging hole, 11... Light emitting diode element, 12... Lead wire.
Claims (1)
せた外部リードと、該外部リード間を連結させた
タイバーとを備えた発光ダイオード素子の樹脂封
止用リードフレームにおいて、上記タイバーに上
記サイドフレーム方向の延長片を連続して一体に
形成し、且つ、該延長片にエアベント用の溝部を
形成して構成したことを特徴とする発光ダイオー
ド素子の樹脂封止用リードフレーム。 In a lead frame for resin sealing of a light emitting diode element, which includes a side frame, an external lead connected to the side frame, and a tie bar connected between the external leads, the tie bar has an extension piece extending in the direction of the side frame. 1. A lead frame for resin sealing of a light emitting diode element, characterized in that the extension pieces are formed continuously and integrally, and a groove for an air vent is formed in the extension piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987155339U JPH0639463Y2 (en) | 1987-10-09 | 1987-10-09 | Lead frame for resin sealing of light emitting diode element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987155339U JPH0639463Y2 (en) | 1987-10-09 | 1987-10-09 | Lead frame for resin sealing of light emitting diode element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0160559U true JPH0160559U (en) | 1989-04-17 |
| JPH0639463Y2 JPH0639463Y2 (en) | 1994-10-12 |
Family
ID=31432879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987155339U Expired - Lifetime JPH0639463Y2 (en) | 1987-10-09 | 1987-10-09 | Lead frame for resin sealing of light emitting diode element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0639463Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63287045A (en) * | 1987-05-19 | 1988-11-24 | Sharp Corp | Manufacture of optical semiconductor device |
-
1987
- 1987-10-09 JP JP1987155339U patent/JPH0639463Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63287045A (en) * | 1987-05-19 | 1988-11-24 | Sharp Corp | Manufacture of optical semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0639463Y2 (en) | 1994-10-12 |