JPH0158957U - - Google Patents
Info
- Publication number
- JPH0158957U JPH0158957U JP15341387U JP15341387U JPH0158957U JP H0158957 U JPH0158957 U JP H0158957U JP 15341387 U JP15341387 U JP 15341387U JP 15341387 U JP15341387 U JP 15341387U JP H0158957 U JPH0158957 U JP H0158957U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- chip
- resin part
- connection pins
- inner ends
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例斜視図である。
１……樹脂部、Ｃｉ……絶縁層、Ｐｉ……接続
ピン、ｌｉ……外部リード。
ピン、ｌｉ……外部リード。
Claims (1)
- アイランドに載置されたＩＣチツプと、該ＩＣ
チツプに内部端が電気的に接続し外部端が接続ピ
ンとなる一体構造の複数のリードと、前記ＩＣチ
ツプ及び前記内部端を含んで封止する樹脂部とを
有する集積回路において、前記樹脂部及び前記接
続ピンの間の外部リードの表面が絶縁層に覆われ
ていることを特徴とする集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15341387U JPH0158957U (ja) | 1987-10-06 | 1987-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15341387U JPH0158957U (ja) | 1987-10-06 | 1987-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0158957U true JPH0158957U (ja) | 1989-04-13 |
Family
ID=31429230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15341387U Pending JPH0158957U (ja) | 1987-10-06 | 1987-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0158957U (ja) |
-
1987
- 1987-10-06 JP JP15341387U patent/JPH0158957U/ja active Pending