JPH0158868B2 - - Google Patents
Info
- Publication number
- JPH0158868B2 JPH0158868B2 JP19940182A JP19940182A JPH0158868B2 JP H0158868 B2 JPH0158868 B2 JP H0158868B2 JP 19940182 A JP19940182 A JP 19940182A JP 19940182 A JP19940182 A JP 19940182A JP H0158868 B2 JPH0158868 B2 JP H0158868B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- pellet
- detector
- switch
- ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 238000007599 discharging Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
Description
【発明の詳細な説明】
本発明はワイヤボンダにおけるワイヤの接続不
良検出方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for detecting poor connection of wires in a wire bonder.
従来、ワイヤの接続不良検出方法として、例え
ば特開昭51−120175号公報、特開昭53−94178号
公報に示す方法が知られている。この方法はペレ
ツトにワイヤが接続された状態でワイヤに電流を
流し、ワイヤがペレツトに接続されているか否か
を検出器によつて検出している。このようにペレ
ツトの電極に直接電流を流すので、この検出電流
は半導体特性の破壊限度以下の微少電流を加えな
ければならない。そこで、前記検出器は前記微少
電流又は微少電圧の変化を検出するように設計さ
れている。 BACKGROUND ART Conventionally, as a method for detecting a poor connection of a wire, methods disclosed in, for example, Japanese Patent Laid-Open Nos. 51-120175 and 53-94178 are known. In this method, a current is applied to the wire while it is connected to the pellet, and a detector detects whether or not the wire is connected to the pellet. Since the current is passed directly to the electrodes of the pellet in this way, it is necessary to apply a minute current below the destructive limit of the semiconductor characteristics. Therefore, the detector is designed to detect changes in the minute current or voltage.
一方、ワイヤボンデイングにおいては、ワイヤ
をペレツトに接続する前に、ワイヤの先端を溶融
させてボールが形成される。このボール形成方法
として、一般にバーナトーチ又は電気トーチによ
る方法が用いられている。 On the other hand, in wire bonding, the tip of the wire is melted to form a ball before the wire is connected to the pellet. As a method for forming this ball, a method using a burner torch or an electric torch is generally used.
バーナトーチによる方法はワイヤを単に火炎で
溶融させるのみであるので、前記ワイヤの接続不
良検出用の検出器には何ら悪影響を及ぼさない。
しかしながら、電気トーチによる方法は電気トー
チの高電圧による放電によつてボールを形成する
ので、この放電時にワイヤに高電圧がかかる。前
記のように、ワイヤの接続不良検出用の検出器は
微少電流又は微少電圧を検出するように設計され
ているので、放電時にワイヤに高電圧がかかる
と、これによつて検出器が破損するという欠点を
有する。 Since the method using a burner torch simply melts the wire with a flame, it does not have any adverse effect on the detector for detecting poor connection of the wire.
However, in the method using an electric torch, the ball is formed by a high voltage discharge from the electric torch, and a high voltage is applied to the wire during this discharge. As mentioned above, the detector for detecting poor wire connections is designed to detect minute currents or minute voltages, so if high voltage is applied to the wire during discharge, this will damage the detector. It has the following drawback.
このため、従来、ワイヤがペレツトに接続され
た状態でワイヤの接続不良を検出する方法におい
ては、ボールの形成にはバーナトーチが用いられ
ている。しかしながら、バーナトーチによる方法
はボールが正常に形成されているか否か検出でき
ない欠点を有する。これに対し、電気トーチによ
る方法は、例えば特公昭54−35065号公報及び特
開昭54−9576号公報に示すように、放電時にワイ
ヤに電流が流れるので、これを検出することによ
りボールが正常に形成されたか否か検出できる。
しかしながら、この方法は前記したようにワイヤ
がペレツトに接続された状態でワイヤの接続不良
を検出できないという欠点を有する。 For this reason, in the conventional method of detecting a poor connection of a wire in a state where the wire is connected to a pellet, a burner torch is used to form the ball. However, the method using a burner torch has the disadvantage that it cannot be detected whether the ball is formed normally. On the other hand, in the method using an electric torch, as shown in Japanese Patent Publication No. 54-35065 and Japanese Patent Application Laid-Open No. 54-9576, a current flows through the wire during discharge, and by detecting this, the ball is in normal condition. It is possible to detect whether or not it has been formed.
However, this method has the disadvantage that it is not possible to detect poor connection of the wire while the wire is connected to the pellet, as described above.
本発明は上記従来技術の欠点に鑑みなされたも
ので、ボールを電気トーチによつて形成する方法
において、ワイヤがペレツトに接続された状態で
ワイヤの接続不良を検出することができるワイヤ
の接続不良検出方法を提供することを目的とす
る。 The present invention has been made in view of the above-mentioned drawbacks of the prior art, and is capable of detecting a poor connection of a wire in a state where the wire is connected to a pellet in a method of forming a ball using an electric torch. The purpose is to provide a detection method.
以下、本発明の一実施例を図により説明する。
第１図は本発明の方法に用いる回路ブロツク図で
ある。ペレツト１が固着されたリードフレーム２
は試料台３に位置決め固定されている。ペレツト
１とリードフレーム２に接続されるワイヤ４は、
スプール５に巻回されており、一端はキヤピラリ
６に挿通され、他端は端子７に接続されている。
またキヤピラリ６の近傍にはワイヤ４の先端を溶
融してボール４ａを形成する電気トーチ８が設け
られている。前記端子７はリードリレー等よりな
るスイツチ９のコモン接点９ａに接続され、スイ
ツチ９の常時閉接点９ｂはアースされている。前
記スイツチ９の常時開接点９ｃは検出器１０及び
抵抗１１に接続されており、抵抗１１はスイツチ
１２によつて２個の直流電源１３，１４に選択的
に接続されるようになつている。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a circuit block diagram used in the method of the present invention. Lead frame 2 to which pellet 1 is fixed
is positioned and fixed on the sample stage 3. The wire 4 connected to the pellet 1 and lead frame 2 is
It is wound around a spool 5, one end of which is inserted into a capillary 6, and the other end of which is connected to a terminal 7.
Further, an electric torch 8 is provided near the capillary 6 to melt the tip of the wire 4 to form a ball 4a. The terminal 7 is connected to a common contact 9a of a switch 9 such as a reed relay, and a normally closed contact 9b of the switch 9 is grounded. A normally open contact 9c of the switch 9 is connected to a detector 10 and a resistor 11, and the resistor 11 is selectively connected to two DC power sources 13 and 14 by a switch 12.
第２図はキヤピラリ６の上下動及びスイツチ９
の切換えタイミングを示し、スイツチ９の切換え
タイミングは第３図に示すボンデイング状態で行
われる。 Figure 2 shows the vertical movement of the capillary 6 and the switch 9.
The switching timing of the switch 9 is performed in the bonding state shown in FIG.
次に作用について説明する。スイツチ１２は、
ペレツト１の電極が順送りの場合はプラス電圧が
かかるように直流電源１３に接続しておき、逆送
りの場合はマイナス電圧がかかるように直流電源
１４に接続しておく。まず、キヤピラリ６の下端
より延在したワイヤ４の先端に電気トーチ８の放
電によつてボール４ａが形成される。この時、ワ
イヤ４には放電による高電流が流れるが、スイツ
チ９はアースされている常時閉接点９ｂに接続さ
れているので、検出器１０には何ら悪影響を及ぼ
さない。 Next, the effect will be explained. The switch 12 is
When the electrodes of the pellet 1 are fed forward, they are connected to a DC power source 13 so that a positive voltage is applied, and when they are fed backwards, they are connected to a DC power source 14 so that a negative voltage is applied. First, a ball 4a is formed at the tip of the wire 4 extending from the lower end of the capillary 6 by electric discharge from the electric torch 8. At this time, a high current flows through the wire 4 due to the discharge, but since the switch 9 is connected to the grounded normally closed contact 9b, it does not have any adverse effect on the detector 10.
次に第２図に示すサイクルに従つてキヤピラリ
６が下降し、ワイヤ４はペレツト１に第１ボンド
される。その後キヤピラリ６は上昇し、第２ボン
ド点の上方に移動し、再び下降する。この間にス
イツチ９の切換信号がオンとなり、スイツチ９は
常時開接点９ｃに接続される。この場合、ワイヤ
４がペレツト１に接続されていると、直流電源１
３又は１４よりスイツチ１２、抵抗１１、スイツ
チ９、端子７を通つてワイヤ４に微少電流（例え
ば0.5ｍＡ）が流れ、検出器１０には電流が流れ
ない。もし、ワイヤ４がペレツト１に接続されて
いないと、ワイヤ４には電流が流れなく、検出器
１０に電流が流れ、検出器１０よりワイヤ接続不
良信号１０ａが出力される。 Next, the capillary 6 is lowered according to the cycle shown in FIG. 2, and the wire 4 is first bonded to the pellet 1. Thereafter, the capillary 6 rises, moves above the second bond point, and falls again. During this time, the switching signal of the switch 9 is turned on, and the switch 9 is connected to the normally open contact 9c. In this case, when wire 4 is connected to pellet 1, DC power source 1
A small current (for example, 0.5 mA) flows from switch 3 or 14 through switch 12, resistor 11, switch 9, and terminal 7 to wire 4, but no current flows to detector 10. If the wire 4 is not connected to the pellet 1, no current flows through the wire 4, current flows through the detector 10, and the detector 10 outputs a wire connection failure signal 10a.
ワイヤ接続が正常であると、キヤピラリ６は下
降を続け、第２ボンド点にワイヤ４が接続され
る。その後キヤピラリ６は上昇及び図示しないク
ランパでワイヤ４は第２ボンド点の付根より切断
される。これによりボンデイングの１サイクルが
終了する。 If the wire connection is normal, the capillary 6 continues to descend and the wire 4 is connected to the second bond point. Thereafter, the capillary 6 is raised and the wire 4 is cut from the base of the second bonding point by a clamper (not shown). This completes one cycle of bonding.
なお、上記実施例において、９ｂを常時開接点
に、９ｃを常時閉接点にし、電気トーチ８による
放電時には接点９ｂに接続されるようにしてもよ
い。 In the embodiment described above, 9b may be a normally open contact, and 9c may be a normally closed contact, and when the electric torch 8 discharges, it may be connected to the contact 9b.
このように、電気トーチ８の放電時にはワイヤ
４と検出器１０との接続はオフとなるので、放電
時にワイヤ４に高電流が流れても検出器１０には
何ら悪影響を及ぼさない。 In this way, the connection between the wire 4 and the detector 10 is turned off when the electric torch 8 is discharging, so even if a high current flows through the wire 4 during discharging, the detector 10 is not adversely affected at all.
以上の説明から明らかな如く、本発明によれ
ば、電気トーチによる放電でボールを形成する方
法において、ワイヤがペレツトに接続された状態
でワイヤの接続不良を検出できる。 As is clear from the above description, according to the present invention, in a method of forming a ball by electric discharge using an electric torch, a poor connection of the wire can be detected while the wire is connected to the pellet.
第１図は本発明の方法に用いる回路の一実施例
を示すブロツク図、第２図のキヤピラリの上下動
及びスイツチの切換のタイミング図、第３図はス
イツチの切換タイミング時のボンデイング状態の
説明図である。
１……ペレツト、２……リードフレーム、４…
…ワイヤ、４ａ……ボール、８……電気トーチ、
９……スイツチ、１０……検出器、１１……抵
抗、１３，１４……直流電源。
Fig. 1 is a block diagram showing an embodiment of the circuit used in the method of the present invention, Fig. 2 is a timing diagram of the vertical movement of the capillary and switching of the switch, and Fig. 3 is an explanation of the bonding state at the timing of switching the switch. It is a diagram. 1...Pellet, 2...Lead frame, 4...
...Wire, 4a...Ball, 8...Electric torch,
9...Switch, 10...Detector, 11...Resistor, 13, 14...DC power supply.
Claims (1)
ルを形成し、その後前記ボールをペレツトにボン
デイングし、ワイヤがペレツトに接続された状態
で前記ワイヤに微少電流を流してワイヤがペレツ
トに接続されているか否かを検出器によつて検出
する方法であつて、前記電気トーチの放電時には
前記検出器と前記ワイヤとの接続をオフにするこ
とを特徴とするワイヤの接続不良検出方法。1. Form a ball at the tip of the wire by discharging an electric torch, then bond the ball to the pellet, and test whether the wire is connected to the pellet by passing a small current through the wire while the wire is connected to the pellet. 1. A method for detecting a poor connection of a wire using a detector, the method comprising: turning off the connection between the detector and the wire when the electric torch is discharging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57199401A JPS5988842A (en) | 1982-11-13 | 1982-11-13 | Method for detecting failure of wire bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57199401A JPS5988842A (en) | 1982-11-13 | 1982-11-13 | Method for detecting failure of wire bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5988842A JPS5988842A (en) | 1984-05-22 |
| JPH0158868B2 true JPH0158868B2 (en) | 1989-12-13 |
Family
ID=16407170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57199401A Granted JPS5988842A (en) | 1982-11-13 | 1982-11-13 | Method for detecting failure of wire bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5988842A (en) |
-
1982
- 1982-11-13 JP JP57199401A patent/JPS5988842A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5988842A (en) | 1984-05-22 |
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