JP2611891B2 - Wire bonding apparatus and method - Google Patents
Wire bonding apparatus and methodInfo
- Publication number
- JP2611891B2 JP2611891B2 JP3228518A JP22851891A JP2611891B2 JP 2611891 B2 JP2611891 B2 JP 2611891B2 JP 3228518 A JP3228518 A JP 3228518A JP 22851891 A JP22851891 A JP 22851891A JP 2611891 B2 JP2611891 B2 JP 2611891B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- wire
- discharge electrode
- short
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体デバイスの組立
工程において、第１ボンディング点、例えば半導体チッ
プ上の電極と第２ボンディング点、例えばリードフレー
ムに配設された外部リードとをワイヤを用いて接続する
ワイヤボンディング装置及びその方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for assembling a semiconductor device by using a wire at a first bonding point, for example, an electrode on a semiconductor chip, and a second bonding point, for example, an external lead provided on a lead frame. And a wire bonding apparatus for performing connection.
【０００２】[0002]
【従来の技術】従来、金線又は銅、アルミニウムなどの
ワイヤを用いて第１ボンディング点となる半導体チップ
上の電極と第２ボンディング点となるリードとを接続す
る装置として、図２に示すような回路を有するワイヤボ
ンディング装置が知られている。2. Description of the Related Art FIG. 2 shows a conventional apparatus for connecting an electrode on a semiconductor chip serving as a first bonding point and a lead serving as a second bonding point using a gold wire or a wire such as copper or aluminum. A wire bonding apparatus having a simple circuit is known.
【０００３】図２に示す装置は、高電圧を発生する直流
電源回路１１と、この直流電源回路１１と接続され定電
流を発生する定電流回路１２と、スイッチング回路１３
と、このスイッチング回路１３を一定時間オン／オフす
るタイマ１４と、前記スイッチング回路１３と接続され
たスパーク放電安定用の抵抗Ｒよりなる安定器１５と、
放電電極２１と、前記スイッチング回路１３と安定器１
５間に一端が接続され、他端が前記直流電源回路１１と
クランパ１８との間で接続された分割整合器２０と、該
分割整合器２０と接続されたショート検出回路１７と、
キャピラリ２０と、このキャピラリ２０に挿通されたワ
イヤ１９とで構成されている。前記分割整合器２０は、
分割抵抗で構成され、また、クランパ１８は接地されて
いる。The device shown in FIG. 2 includes a DC power supply circuit 11 for generating a high voltage, a constant current circuit 12 connected to the DC power supply circuit 11 for generating a constant current, and a switching circuit 13.
A timer 14 for turning on / off the switching circuit 13 for a certain period of time, a ballast 15 comprising a spark discharge stabilizing resistor R connected to the switching circuit 13,
Discharge electrode 21, switching circuit 13 and ballast 1
5, a split matching device 20 having one end connected between the DC power supply circuit 11 and the clamper 18 at the other end, a short detection circuit 17 connected to the split matching device 20,
It is composed of a capillary 20 and a wire 19 inserted through the capillary 20. The split matching device 20 includes:
It is composed of a divided resistor, and the clamper 18 is grounded.
【０００４】上記構成よりなる装置を用いて放電電極２
１とワイヤ１９とが接触しているかどうかのショート検
出を行うには、トリガ信号Ｔｒの指令に基づいてタイマ
１４が駆動され、このタイマ１４の駆動によりスイッチ
ング回路１３のスイッチがオンされ、安定器１５を介し
て放電電極２１に高電圧が印加される。この時、放電電
極２１とワイヤ１９とが接触していない時、すなわちシ
ョートしていない場合には、分割整合器１６の分割抵抗
により放電電圧が分圧された電圧が検出され、ショート
検出回路１７により放電電極２１とワイヤ１９とがショ
ートしておらず正常であると判定される。しかし、逆に
放電電極２１とワイヤ１９とが接触している時には、分
割整合器１６には低い電圧が得られ、ショート検出回路
１７により放電電極２１とワイヤ１９とがショートして
いるものと判定される。[0004] The discharge electrode 2 is
In order to detect whether or not the wire 1 is in contact with the wire 19, the timer 14 is driven based on the command of the trigger signal Tr. A high voltage is applied to the discharge electrode 21 via 15. At this time, when the discharge electrode 21 is not in contact with the wire 19, that is, when there is no short circuit, the voltage obtained by dividing the discharge voltage by the divisional resistance of the division matching unit 16 is detected, and the short detection circuit 17 Therefore, it is determined that the discharge electrode 21 and the wire 19 are normal without being short-circuited. On the contrary, when the discharge electrode 21 and the wire 19 are in contact with each other, a low voltage is obtained in the split matching device 16 and the short-circuit detection circuit 17 determines that the discharge electrode 21 and the wire 19 are short-circuited. Is done.
【０００５】[0005]
【発明が解決しようとする課題】ところで、従来の装置
では、定電流回路１２により定電流制御がなされている
ため、放電電極２１とワイヤ１９間には一定の電流とな
るように制御されているが、ワイヤ１９の先端に形成す
るボールの径やワイヤ径などを変える場合などには、定
電流回路１２の電流設定値を変えて行う。この電流設定
値が変わると、放電電極２１とワイヤ１９間がショート
状態の時に分割整合器１６で得られる電圧値が変わるた
め、前記電流設定値に応じたショート検出値のレベルを
変えなければならず、それに要する時間も多くかかる欠
点がある。また、従来の装置では、放電時にショート検
出かどうかの判定を行うためショート検出である時は不
完全なボールが形成され、装置の信頼性が損なわれると
いう欠点がある。By the way, in the conventional device, since the constant current control is performed by the constant current circuit 12, the constant current is controlled between the discharge electrode 21 and the wire 19. However, when changing the diameter of the ball formed at the tip of the wire 19, the wire diameter, or the like, the current setting value of the constant current circuit 12 is changed. When the current set value changes, the voltage value obtained by the split matching device 16 changes when the discharge electrode 21 and the wire 19 are in a short-circuit state. Therefore, the level of the short-circuit detection value according to the current set value must be changed. In addition, there is a disadvantage that it takes a lot of time. Further, in the conventional device, there is a drawback that an imperfect ball is formed when short-circuit detection is performed because it is determined whether or not short-circuit detection is performed during discharge, and the reliability of the device is impaired.
【０００６】そこで、本発明は上記従来技術の欠点に鑑
みてなされたもので、電流設定値を可変した場合であっ
ても、ショート検出を確実に行うことのできるワイヤボ
ンディング装置及びその方法を提供することを目的とす
る。Accordingly, the present invention has been made in view of the above-mentioned drawbacks of the prior art, and provides a wire bonding apparatus and a method thereof capable of reliably detecting a short circuit even when a current set value is varied. The purpose is to do.
【０００７】[0007]
【課題を解決するための手段】本発明は、キャピラリ先
端から突出したワイヤの先端と放電電極との間に高電圧
を印加することによって放電を起こさせ、その放電エネ
ルギーによりワイヤの先端部を溶融してボールを形成す
るワイヤボンディング装置において、放電電極に高電圧
を供給する直流電源回路と、該直流電源回路と別個に設
けられた補助電源と、前記直流電源回路と放電電極間に
一端が接続され、他端が補助電源と接続されたショート
検出回路とを備え、前記ショート検出回路により前記放
電電極とワイヤとのショートを該放電電極に高電圧が印
加される前に検出できるように構成したものである。ま
た、本発明は、前記放電電極に高電圧が印加される前
に、補助電源を用いてショート検出回路により放電電極
とワイヤとのショート検出を行うようにしたものであ
る。According to the present invention, a discharge is caused by applying a high voltage between a tip of a wire protruding from the tip of a capillary and a discharge electrode, and the tip of the wire is melted by the discharge energy. A DC power supply circuit for supplying a high voltage to a discharge electrode, an auxiliary power supply provided separately from the DC power supply circuit, and one end connected between the DC power supply circuit and the discharge electrode. A short detection circuit connected to an auxiliary power supply at the other end, so that the short detection circuit can detect a short circuit between the discharge electrode and the wire before a high voltage is applied to the discharge electrode. Things. Further, in the present invention, before a high voltage is applied to the discharge electrode, a short circuit between the discharge electrode and the wire is detected by a short detection circuit using an auxiliary power supply.
【０００８】[0008]
【実施例】次に、本発明に係るワイヤボンディング装置
について説明する。なお、図２に示す従来の装置と同一
或は対応する部分については同じ参照符号を用いて説明
する。Next, a wire bonding apparatus according to the present invention will be described. Parts that are the same as or correspond to those of the conventional apparatus shown in FIG. 2 will be described using the same reference numerals.
【０００９】図１に示すように、直流電源回路１１は、
約−１２００Ｖ程度の高電圧を発生する。この直流電源
回路１１と接続され、定電流制御を行う定電流回路１２
は、後段のスイッチング回路１３と接続されている。こ
のスイッチング回路１３は、タイマ１４により一定時間
オン／オフされる。なお、このタイマ１４の時間は可変
設定できる構成となっている。また、タイマ１４は、マ
イクロコンピュータ等よりなる図示せぬ制御手段から出
力されるトリガ信号Ｔｒにより駆動される。As shown in FIG. 1, a DC power supply circuit 11
A high voltage of about -1200V is generated. A constant current circuit 12 connected to the DC power supply circuit 11 and performing constant current control.
Are connected to the switching circuit 13 at the subsequent stage. The switching circuit 13 is turned on / off for a predetermined time by a timer 14. The time of the timer 14 can be set variably. The timer 14 is driven by a trigger signal Tr output from control means (not shown) such as a microcomputer.
【００１０】前記スイッチング回路１３は安定器４の一
入力となると共にショート検出回路１にも入力されてい
る。このショート検出回路１は、ダイオードＤ1 と、一
端がダイオードＤ1 のカソードと接続され、他端がショ
ート検出用の補助電源２と接続された抵抗Ｒと、該ダイ
オードＤ1 のカソード側と抵抗Ｒ間に接続されたダイオ
ードＤ2 とで構成されている。The switching circuit 13 serves as one input of the ballast 4 and is also input to the short detection circuit 1. The short detection circuit 1 includes a diode D 1 , a resistor R having one end connected to the cathode of the diode D 1 , and the other end connected to an auxiliary power supply 2 for short detection, and a resistor connected to the cathode of the diode D 1. It is constituted by a diode connected D 2 and between R.
【００１１】前記ダイオードＤ2 のアノードは、判定回
路３と接続され、この判定回路３は、前記ショート検出
回路１で出力される電圧値によりショートしているかど
うかの判定を行う。また、この判定回路３は、前記タイ
マ１４がトリガ信号Ｔｒにより駆動される前にショート
検出を判定できるように前記制御手段（図示せず）によ
り制御される。したがって、判定回路３により放電電極
２１とワイヤ１９とがショートしているものと判定され
た場合には、図示せぬ告知手段により警報若しくは外部
の表示器などを介して告知され、その告知により装置の
運転を手動又は自動的に停止させる。なお、この告知手
段の構成並びに装置の運転を手動又は自動により停止さ
せるかどうかは適宜採択することができる。The anode of the diode D 2 is connected to a judging circuit 3, which judges whether or not a short circuit has occurred based on a voltage value output from the short detecting circuit 1. The determination circuit 3 is controlled by the control means (not shown) so that short-circuit detection can be determined before the timer 14 is driven by the trigger signal Tr. Therefore, when it is determined by the determination circuit 3 that the discharge electrode 21 and the wire 19 are short-circuited, a notification unit (not shown) notifies the user via a warning or an external display, and the device is notified by the notification. Operation is stopped manually or automatically. The configuration of the notification means and whether the operation of the apparatus is stopped manually or automatically can be appropriately adopted.
【００１２】また、スイッチング回路１３は、安定器４
を介して放電電極２１と接続されている。この安定器３
は、コイルＬで構成され、放電電流の減少分に相当する
電圧を誘起させて放電を安定させる。The switching circuit 13 includes the ballast 4
Is connected to the discharge electrode 21 via the. This ballast 3
Is composed of a coil L, and induces a voltage corresponding to a decrease in the discharge current to stabilize the discharge.
【００１３】また、直流電源回路１１の他端（図１では
陽極）と補助電源２の他端（図１では陽極）とは、共に
クランパ１８と接続されている。このクランパ１８は、
キャピラリ２０に挿通されたワイヤ１９をクランプする
構成となっている。また、補助電源２は、本実施例では
装置が運転されている間電源がオンされ動作状態となっ
ているが、ショート検出を行う場合のみオンされる構成
としてもよい。The other end (the anode in FIG. 1) of the DC power supply circuit 11 and the other end (the anode in FIG. 1) of the auxiliary power supply 2 are both connected to the clamper 18. This clamper 18
The configuration is such that the wire 19 inserted into the capillary 20 is clamped. Further, in this embodiment, the auxiliary power supply 2 is turned on while the apparatus is operating and is in an operating state, but may be turned on only when a short circuit is detected.
【００１４】上記構成よりなる装置を用いてショート検
出を行う場合について説明する。A description will be given of a case where short-circuit detection is performed using the apparatus having the above configuration.
【００１５】まず、図示せぬ制御手段からの指令によ
りショート検出かどうかの指令が出されると、判定回路
３は、放電電極２１とワイヤ１９とが接触している時、
すなわちショートしている時は、本実施例では例えば０
Ｖ近くの電圧を検出してショートしているものと判定す
る。逆に、ショート状態でないときは、補助電源２、抵
抗Ｒ及びダイオードＤ1 間での所定の電圧が出力されて
ショートでないものと判定する。したがって、判定回路
３は、該判定結果を前記制御手段に出力することによっ
て、放電電極２１とワイヤ１９間でショートしている時
は前記告知手段により警報若しくは表示器に表示させて
告知を行い、必要に応じて装置の運転を手動若しくは自
動により停止させる。First, when a command is issued as to whether or not a short circuit is detected by a command from control means (not shown), the determination circuit 3 determines whether the discharge electrode 21 and the wire 19 are in contact with each other.
That is, when a short circuit occurs, for example, 0 in this embodiment.
By detecting a voltage near V, it is determined that a short circuit has occurred. Conversely determines, when not short-circuited state, the auxiliary power supply 2, as predetermined voltage between the resistor R and the diode D 1 is not a short circuit is output. Therefore, the judgment circuit 3 outputs the judgment result to the control means, and when a short circuit occurs between the discharge electrode 21 and the wire 19, makes the alarm means or a display display on the alarm means to notify. The operation of the device is stopped manually or automatically as necessary.
【００１６】次に、ショート検出がなされて判定回路
３により正常であると判定された場合には、前記制御手
段から出力されたトリガ信号Ｔｒによりタイマ１４を駆
動してスイッチング回路１３のスイッチをオンにする。
これによってスイッチング回路１３から安定器３を介し
て放電電極２１には定電流高電圧が印加されて、放電電
極２１とワイヤ１９の先端との間で放電が開始され、そ
の放電エネルギーによりワイヤの先端を溶融してボール
が形成される。Next, when a short circuit is detected and the determination circuit 3 determines that the circuit is normal, the timer 14 is driven by the trigger signal Tr output from the control means to turn on the switch of the switching circuit 13. To
As a result, a constant current high voltage is applied to the discharge electrode 21 from the switching circuit 13 via the ballast 3, and a discharge is started between the discharge electrode 21 and the tip of the wire 19, and the discharge energy causes the tip of the wire 19 to be discharged. Is melted to form a ball.
【００１７】[0017]
【発明の効果】以上説明したように本発明によれば、シ
ョートしているかどうかの検出を放電がなされる前に行
うことができ、電流設定値が変えられた場合であっても
何らの設定を行わなくても確実に検出することができる
効果がある。また、本発明によれば、放電前にショート
検出かどうかの判定を行うので、不完全なボールが形成
されることがなく、装置の信頼性が向上するという効果
がある。As described above, according to the present invention, it is possible to detect whether or not a short-circuit has occurred before discharging is performed. There is an effect that the detection can be surely performed without performing. Further, according to the present invention, since it is determined whether or not a short circuit is detected before discharging, an incomplete ball is not formed, and the reliability of the device is improved.
【図１】図１は、本発明に係るワイヤボンディング装置
の回路の構成を示す図である。FIG. 1 is a diagram showing a circuit configuration of a wire bonding apparatus according to the present invention.
【図２】図２は、従来のワイヤボンディング装置の回路
の構成を示す図である。FIG. 2 is a diagram showing a circuit configuration of a conventional wire bonding apparatus.
１ ショート検出回路 ２ 補助電源 ３ 判定回路 ４ 安定器 １１ 直流電源回路 １９ 放電電極 DESCRIPTION OF SYMBOLS 1 Short detection circuit 2 Auxiliary power supply 3 Judgment circuit 4 Ballast 11 DC power supply circuit 19 Discharge electrode
Claims (2)
端と放電電極との間に高電圧を印加することによって放
電を起こさせ、その放電エネルギーによりワイヤの先端
部を溶融してボールを形成するワイヤボンディング装置
において、 前記放電電極に高電圧を供給する直流電源回路と、該直
流電源回路と別個に設けられた補助電源と、前記直流電
源回路と放電電極間に一端が接続され、他端が補助電源
と接続されたショート検出回路とを備え、 前記ショート検出回路により前記放電電極とワイヤとの
ショートを該放電電極に高電圧が印加される前に検出で
きるように構成したことを特徴とするワイヤボンディン
グ装置。1. A wire bonding in which a high voltage is applied between a tip of a wire protruding from a tip of a capillary and a discharge electrode to generate a discharge, and the discharge energy melts the tip of the wire to form a ball. In the apparatus, a DC power supply circuit for supplying a high voltage to the discharge electrode, an auxiliary power supply provided separately from the DC power supply circuit, one end is connected between the DC power supply circuit and the discharge electrode, and the other end is an auxiliary power supply. And a short detection circuit connected to the discharge electrode, wherein the short detection circuit detects a short circuit between the discharge electrode and the wire before a high voltage is applied to the discharge electrode. apparatus.
端と放電電極との間に高電圧を印加することによって放
電を起こさせ、その放電エネルギーによりワイヤの先端
部を溶融してボールを形成するワイヤボンディング装置
であって、 前記放電電極に高電圧が印加される前に、補助電源を用
いてショート検出回路により放電電極とワイヤとのショ
ート検出を行うようにしたことを特徴とするワイヤボン
ディング方法。2. A wire bonding in which a high voltage is applied between a tip of a wire protruding from a tip of a capillary and a discharge electrode to generate a discharge, and the discharge energy melts the tip of the wire to form a ball. A wire bonding method, wherein a short circuit between a discharge electrode and a wire is detected by a short detection circuit using an auxiliary power supply before a high voltage is applied to the discharge electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3228518A JP2611891B2 (en) | 1991-08-15 | 1991-08-15 | Wire bonding apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3228518A JP2611891B2 (en) | 1991-08-15 | 1991-08-15 | Wire bonding apparatus and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0547826A JPH0547826A (en) | 1993-02-26 |
| JP2611891B2 true JP2611891B2 (en) | 1997-05-21 |
Family
ID=16877683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3228518A Expired - Fee Related JP2611891B2 (en) | 1991-08-15 | 1991-08-15 | Wire bonding apparatus and method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2611891B2 (en) |
-
1991
- 1991-08-15 JP JP3228518A patent/JP2611891B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0547826A (en) | 1993-02-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3003673B2 (en) | Consumable electrode type pulse arc welding method | |
| JP2617351B2 (en) | Wire connection failure detection method | |
| US3999028A (en) | Method and apparatus for electrical discharge machining | |
| JP2611891B2 (en) | Wire bonding apparatus and method | |
| JPS59172260A (en) | Control of bonding wire ball formation | |
| JPH07245187A (en) | Strobe device | |
| US5872347A (en) | Method and device for controlling discharging current slope of wire cut electrical discharge machine | |
| JP2000176641A (en) | Tig welding equipment | |
| US4687897A (en) | Flame-off limited circuit for wire bonding ball forming apparatus | |
| JP3323457B2 (en) | Electric discharge machining method and power supply device for electric discharge machining | |
| JP2568140B2 (en) | Wire bonding apparatus and method | |
| US20040000537A1 (en) | Micro-welder | |
| JPH06289087A (en) | Circuit for intelligent power switch | |
| JP3335043B2 (en) | Semiconductor device state determination method and state determination apparatus | |
| JP2904618B2 (en) | Ball forming device for wire bonder | |
| JP2764664B2 (en) | Ball forming apparatus and method for wire bonder | |
| JPH0521501A (en) | Device and method for detecting high frequency in wire bonding device | |
| JP3060852B2 (en) | Wire bonding method | |
| JP2757237B2 (en) | Ball forming device for wire bonder | |
| JP2520765B2 (en) | Drive circuit | |
| JP2676438B2 (en) | Wire bonding apparatus and method | |
| JPH0158868B2 (en) | ||
| JP3264741B2 (en) | Filler wire supply TIG welding equipment | |
| JPH0453646B2 (en) | ||
| JPH0521500A (en) | Ball forming device for wire bonder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090227 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100227 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110227 Year of fee payment: 14 |
|
| LAPS | Cancellation because of no payment of annual fees |