JPH0210573B2 - - Google Patents

Info

Publication number
JPH0210573B2
JPH0210573B2 JP57111133A JP11113382A JPH0210573B2 JP H0210573 B2 JPH0210573 B2 JP H0210573B2 JP 57111133 A JP57111133 A JP 57111133A JP 11113382 A JP11113382 A JP 11113382A JP H0210573 B2 JPH0210573 B2 JP H0210573B2
Authority
JP
Japan
Prior art keywords
wire
discharge
section
signal
control section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57111133A
Other languages
Japanese (ja)
Other versions
JPS592332A (en
Inventor
Katsumi Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP57111133A priority Critical patent/JPS592332A/en
Publication of JPS592332A publication Critical patent/JPS592332A/en
Publication of JPH0210573B2 publication Critical patent/JPH0210573B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009Pre-treatment of the connector or the bonding area
    • H01L2224/8503Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512Aligning
    • H01L2224/85148Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518Translational movements
    • H01L2224/85181Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19043Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 この発明は、IC等の半導体素子の端子電極部
に対してボンデイングワイヤを接続する作業で、
ワイヤ異常を検出させるようにしたワイヤボンデ
イング装置のワイヤクランプ抜け検出装置に関す
る。
[Detailed Description of the Invention] This invention relates to the work of connecting bonding wires to terminal electrodes of semiconductor devices such as ICs.
The present invention relates to a wire clamp disconnection detection device for a wire bonding device that detects wire abnormalities.

IC等の半導体素子の端子電極に対して、金線
でなるボンデイングワイヤをボンデイングするワ
イヤボンド装置にあつては、自動的にワイヤを供
給すると共にこのワイヤの先端部をトーチ棒との
間での放電によつて溶解して、連続して供給され
る半導体素子の所定の端子部とフレームとの間の
配線を連続的に行なうものである。この場合、ボ
ンデイングワイヤの供給が正確に行なわれ、ボン
デイング作業が円滑に実行されていることを常に
監視する必要がある。また、このワイヤボンド作
業の進行状態を監視し、全体のシステムを制御す
るCPU等制御装置より信号を供給する必要があ
る。
A wire bonding device that bonds a bonding wire made of gold wire to the terminal electrode of a semiconductor device such as an IC automatically supplies the wire and connects the tip of the wire with a torch rod. The wires are melted by electric discharge and are continuously connected between predetermined terminal portions of semiconductor devices that are continuously supplied and the frame. In this case, it is necessary to constantly monitor that the bonding wire is being supplied accurately and that the bonding operation is being carried out smoothly. It is also necessary to monitor the progress of this wire bonding work and supply signals from a control device such as a CPU that controls the entire system.

第1図は、従来のワイヤボンド装置におけるワ
イヤの異常を検知する手段を説明する構成図を示
すもので、ボンデイングワイヤの先端を放電溶解
してボールを形成する時の放電電流を利用する手
段に係るものである。すなわち、スイツチング部
11からの指令に対応して高圧部12で放電用の
パルス状の高電圧信号を発生し、この高電圧信号
は電流制限抵抗13を介して放電ギヤツプ部14
に供給する。
Figure 1 shows a configuration diagram illustrating a means for detecting wire abnormalities in a conventional wire bonding device. This is related. That is, a pulse-like high voltage signal for discharging is generated in the high voltage section 12 in response to a command from the switching section 11, and this high voltage signal is passed through the current limiting resistor 13 to the discharge gap section 14.
supply to.

ここで、ワイヤボンド部は、第2図に示すよう
に金線でなるワイヤ15をクランプ16で保持設
定し、このワイヤ15の先端とトーチ棒17とを
小間隔で対設して、ワイヤ15とトーチ棒17と
の間に放電を生じさせて、その放電エネルギーに
よつてワイヤ15の先端にボール18を形成させ
るようにしている。この場合、例えばワイヤ15
の先端にクランプ16を介して負極性の電圧を、
トーチ棒17を正極性にして、電流制限抵抗13
を介した高電圧を印加する。
Here, as shown in FIG. 2, the wire bonding part is made by holding and setting a wire 15 made of gold wire with a clamp 16, and arranging the tip of this wire 15 and a torch rod 17 oppositely at a small distance. An electric discharge is generated between the wire 15 and the torch rod 17, and a ball 18 is formed at the tip of the wire 15 by the electric discharge energy. In this case, for example, the wire 15
A negative polarity voltage is applied to the tip of the
Set the torch rod 17 to positive polarity and connect the current limiting resistor 13.
Apply a high voltage via.

このような放電ギヤツプ部14において、放電
電流の一部をフオトカプラ19の一次側ダイオー
ドに流すようにして、二次側のトランジスタをオ
ンさせて放電動作を検知し、その検知信号を
CPU等を含むワイヤボンド制御部20に供給す
る。この制御部20は、フオトカプラ19から放
電検知信号が送出された時に、ボール18が正常
に形成されたと判断して、ボンデイング動作を続
行させる指令を発生する。また、スイツチング1
1で高圧部12の動作指令が発せられるタイミン
グで、上記放電検知信号の得られない時は、制御
部20はボール18が成形されなかつたと判断し
て、装置の停止を指令する。
In such a discharge gap section 14, a part of the discharge current is passed through the primary side diode of the photocoupler 19, the secondary side transistor is turned on to detect the discharge operation, and the detection signal is output.
The signal is supplied to the wire bond control section 20 including a CPU and the like. When the photocoupler 19 sends out the discharge detection signal, the control section 20 determines that the ball 18 has been formed normally and issues a command to continue the bonding operation. Also, switching 1
If the discharge detection signal is not obtained at the timing when the operation command for the high voltage section 12 is issued in step 1, the control section 20 determines that the ball 18 has not been formed and instructs the apparatus to stop.

ここで、例えば第3図に示すようにワイヤ15
がクランプ16から外れて、クランプ16がワイ
ヤ15を引張り切断する作用を果さなかつた場合
には、ワイヤ15がワーク21に二重に接続され
たワイヤ異常が発生する。
Here, for example, as shown in FIG.
If the wire 15 comes off from the clamp 16 and the clamp 16 does not perform the action of pulling and cutting the wire 15, a wire abnormality occurs in which the wire 15 is doubly connected to the workpiece 21.

このようなワイヤ異常が発生した場合、トーチ
棒17が放電可能位置にある状態でワイヤ15は
トーチ棒17と点22で接触するようになる。し
たがつて、このような状態で電流制限抵抗13を
介して高圧が印加されると、ワイヤ15とトーチ
棒17との間で短絡電流が流れる。この短絡電流
は、前記放電電流と同じタイミングで且つ同じ大
きさであるため、フオトカプラ19の一次側ダイ
オードに電流が流れ、制御部20に対して正常な
ボール18が成形されたと同様の指令信号を与え
るようになる。
When such a wire abnormality occurs, the wire 15 comes into contact with the torch rod 17 at a point 22 while the torch rod 17 is in the dischargeable position. Therefore, when a high voltage is applied through the current limiting resistor 13 in this state, a short circuit current flows between the wire 15 and the torch bar 17. Since this short-circuit current has the same timing and magnitude as the discharge current, a current flows through the primary side diode of the photocoupler 19 and sends the same command signal to the control unit 20 as if a normal ball 18 had been formed. Start giving.

すなわち、正常な放電によつてボール18が成
形されないワイヤ異常の状態にもかかわらず、制
御部20は正常と判断し、ボンデイング作業を継
続する状態となる。したがつて、ワイヤ異常のま
まボンデイングされる状態となり、ワークは不良
となつてしまう。
That is, even though the wire is in an abnormal state in which the ball 18 is not formed due to normal discharge, the control unit 20 determines that the wire is normal and continues the bonding work. Therefore, the wire is bonded with the wire abnormal, and the workpiece becomes defective.

この発明は上記のような点に鑑みなされたもの
で、ワイヤがクランプから外れる等のワイヤ異常
が発生したような場合、これを速やかに検知して
ワイヤボンド制御部に対して装置停止指令等が発
せられるようにするワイヤクランプ抜け検出装置
を提供しようとするものである。
This invention was made in view of the above points, and when a wire abnormality such as a wire coming off a clamp occurs, this is promptly detected and a device stop command is issued to the wire bond control section. It is an object of the present invention to provide a wire clamp disconnection detection device that enables the wire clamp to be released.

すなわち、この発明に係るワイヤクランプ抜け
検出装置は、ワイヤとトーチ棒との間の放電検知
信号を、インタフエース回路を介してワイヤボン
ド制御部に供給すると共に、この放電作用よりも
速いタイミングで発生するワイヤとトーチ棒との
接触による電流を検知し、この電流検知に対応し
て特定される時間幅で上記制御部に対する信号を
断つようにインタフエース回路を制御するもので
ある。
That is, the wire clamp disconnection detection device according to the present invention supplies a discharge detection signal between the wire and the torch bar to the wire bond control unit via the interface circuit, and also generates the signal at a timing faster than this discharge action. The interface circuit is controlled to detect a current caused by the contact between the wire and the torch rod, and to cut off the signal to the control unit in a time period specified in response to the detection of the current.

この発明にあつては、ワイヤクランプ抜け発生
時においてワイヤとトーチ棒とが接触する点に着
目し、またこの接触タイミングが本来の放電タイ
ミングより速い現象に着目した。この接触タイミ
ングが放電タイミングより速い現象は、トーチ棒
17の動きから理解できる。すなわち、トーチ棒
17は第4図のAに示すように角度15度の往復運
動をしているもので、正常放電動作時には、トー
チ棒17が角度15度最大に振り切つた所で、23
で示す位置で放電する。しかし、ワイヤクランプ
抜け発生時には、ワイヤ15が第3図で示したよ
うにワーク21部まで接続されている状態にある
ため、第4図のBに示すようにトーチ棒17の側
面に24で示すようにワイヤと接触するようにな
る。すなわち、トーチ棒17が角度15度を振り切
る前に、14度付近でワイヤと接触する状態とな
り、正常の場合と約1度の角度差でワイヤ異常の
時に速いタイミングで接触する。
In this invention, we focused on the point where the wire and the torch rod come into contact when the wire clamp comes loose, and we also focused on the phenomenon that this contact timing is faster than the original discharge timing. This phenomenon in which the contact timing is faster than the discharge timing can be understood from the movement of the torch bar 17. That is, the torch rod 17 is reciprocating at an angle of 15 degrees as shown in A in FIG.
Discharge occurs at the position shown. However, when the wire clamp comes loose, the wire 15 is connected to the workpiece 21 as shown in FIG. 3, so as shown in FIG. so that it comes into contact with the wire. That is, before the torch rod 17 swings through the angle of 15 degrees, it comes into contact with the wire at around 14 degrees, and there is an angle difference of about 1 degree from the normal case, and the contact occurs at a faster timing when the wire is abnormal.

トーチ棒17の放電部幅は1.2mmであり、正常
の放電時にはこの放電部幅の中央部付近23で放
電する。しかし、ワイヤ異常の時にはトーチ棒1
7の放電部の手前側面部24でワイヤと接触し、
このため約0.6mmを移動する分のタイミング差が
生ずる。
The width of the discharge portion of the torch rod 17 is 1.2 mm, and during normal discharge, the discharge occurs near the center 23 of the width of the discharge portion. However, if the wire is abnormal, the torch bar 1
Contact with the wire at the front side surface part 24 of the discharge part 7,
Therefore, a timing difference occurs due to a movement of approximately 0.6 mm.

以下図面を参照してこの発明の一実施例を説明
する。第5図はその構成を示したもので、第1図
で示した場合と同様に、スイツチング部11から
の指令に対応して高圧部12でパルス状高電圧信
号を発生し、この高電圧信号は電流制限抵抗13
を介して放電ギヤツプ部14に印加し、放電部に
流れる電流はフオトカプラ19で検知されるよう
にする。そして、このような回路部に対して、さ
らにワイヤ異常検出制御部25を設けるもので、
この検出制御部25はセンサ部26、タイマー部
27およびインタフエース回路28からなり、フ
オトカプラ19からの検出信号は、このインタフ
エース回路28を介して制御部20に供給される
ようにしてなる。
An embodiment of the present invention will be described below with reference to the drawings. FIG. 5 shows its configuration. Similar to the case shown in FIG. 1, a pulsed high voltage signal is generated in the high voltage section 12 in response to a command from the switching section 11, is the current limiting resistor 13
The current is applied to the discharge gap section 14 through the discharge section, and the current flowing through the discharge section is detected by a photocoupler 19. Further, a wire abnormality detection control section 25 is further provided for such a circuit section,
The detection control section 25 includes a sensor section 26, a timer section 27, and an interface circuit 28, and the detection signal from the photocoupler 19 is supplied to the control section 20 via the interface circuit 28.

第6図は上記ワイヤ異常検出制御部25をさら
に具体的に示したもので、センサ部26はシリコ
ンダイオードD、抵抗R1、コンデンサC1から
なり、定常時は「+12V」にプルアツプされた電
圧信号を次段のタイマー部27に与える。しか
し、ワイヤとトーチ棒とが接触する状態の時は、
「+12V」がダイオードDおよび電流制御抵抗1
3を介して接地ライン(GND)に流れるように
なり、放電部に電流が流れることを検出するよう
になる。
FIG. 6 shows the wire abnormality detection control section 25 in more detail. The sensor section 26 is composed of a silicon diode D, a resistor R1, and a capacitor C1, and receives a voltage signal pulled up to "+12V" during normal operation. It is given to the timer section 27 at the next stage. However, when the wire and torch rod are in contact,
"+12V" is diode D and current control resistor 1
3 to the ground line (GND), and it is detected that the current flows to the discharge section.

タイマー部27は、例えば入力特性が電源電圧
の1/3以下となつた時にトリガされ動作状態とな
るICによるタイマー回路29(例えばNE555)
と、抵抗R2、コンデンサC2の積分回路、さら
にコンデンサC3からなる。そして、上記センサ
部26からの検出信号は、タイマー回路29に供
給する。
The timer section 27 includes a timer circuit 29 (for example, NE555) using an IC that is triggered and becomes operational when the input characteristic becomes 1/3 or less of the power supply voltage, for example.
, an integrating circuit consisting of a resistor R2, a capacitor C2, and a capacitor C3. The detection signal from the sensor section 26 is then supplied to a timer circuit 29.

さらに、インターフエース回路28は一次側ダ
イオードおよび二次側トランジスタからなるフオ
トカプラPCと、これにダーリントン接続したト
ランジスタTr、さらに電源を供給する抵抗R3
および発光素子LEDからなる。
Furthermore, the interface circuit 28 includes a photocoupler PC consisting of a primary side diode and a secondary side transistor, a transistor Tr connected to this by Darlington, and a resistor R3 for supplying power.
and a light emitting element LED.

すなわち、上記のようなワイヤ異常検出制御部
25において、静止状態の場合にはタイマー回路
29の入力ピンNo.2のレベルは、抵抗R1によつ
て約12(V)にプルアツプされている。このタイ
マー回路29は前述したように電源電圧に対して
1/3以下になつた時にトリガされるものであるた
め、この12(V)(入力電源電圧)の状態ではタイ
マー動作はしない。したがつて、この時のタイマ
ー回路29の出力ピンNo.3のレベルはローレベル
となり、フオトカプラPCの一次側ダイオードに
電流が流れ、発光素子LEDが発光表示すると共
にダーリントン接続されたトランジスタTrがオ
ンの状態となる。したがつて、放電を検知するフ
オトカプラ19よりの放電検知信号は、インタフ
エース回路28を介して制御部20に送られる。
すなわち、第7図のaにAで示すようにパルス状
高電圧信号が発生し、ワイヤ15とトーチ棒17
との間で放電された時に、同図のdに示すような
信号が制御部20に送出され、ボンデイングが正
常に行なわれていることを指示するようになる。
That is, in the above-described wire abnormality detection control section 25, in a stationary state, the level of input pin No. 2 of the timer circuit 29 is pulled up to about 12 (V) by the resistor R1. As described above, this timer circuit 29 is triggered when the power supply voltage becomes 1/3 or less, so the timer does not operate in this state of 12 (V) (input power supply voltage). Therefore, at this time, the level of output pin No. 3 of the timer circuit 29 becomes low level, current flows through the primary side diode of the photocoupler PC, the light emitting element LED emits light, and the transistor Tr connected to Darlington is turned on. The state will be as follows. Therefore, a discharge detection signal from the photocoupler 19 that detects discharge is sent to the control section 20 via the interface circuit 28.
That is, a pulsed high voltage signal is generated as shown by A in FIG.
When discharge occurs between the two, a signal as shown in d in the figure is sent to the control section 20, indicating that bonding is being performed normally.

これに対して、ワイヤ15がクランプ16から
外れている場合には、第7図のaに示す正常の放
電タイミングに対して、同図のbに示すようにや
や速いタイミングでワイヤ15とトーチ棒17と
が接触する。このようにワイヤ15とトーチ棒1
7とが接触すると、電流制限抵抗13および放電
ギヤツプ14を介して抵抗R1が接地される状態
となり、入力電圧12Vは抵抗R1と流れた電流の
積の電圧降下を起こし、タイマー回路29の入力
ピンNo.2の電位は入力電圧の1/3以下となる。し
たがつて、タイマー回路29はトリガされ、抵抗
R2、コンデンサC2による積分回路の時定数に
よつて、第7図のcに示すように一定時間(例え
ば330ms)の範囲で出力ピンNo.3のレベルはハイ
レベルとなる。したがつて、フオトカプラPCの
一次側ダイオードに流れる電流は遮断され、発光
素子LEDは消灯し、トランジスタTrがオフ状態
となつて、フオトカプラ19と制御部20との回
路を遮断するようになる。
On the other hand, when the wire 15 is detached from the clamp 16, the wire 15 and the torch rod are connected to each other at a slightly faster timing as shown in FIG. 7b, compared to the normal discharge timing shown in FIG. 7a. 17 comes into contact. In this way, wire 15 and torch rod 1
7, the resistor R1 is grounded via the current limiting resistor 13 and the discharge gap 14, and the input voltage of 12V causes a voltage drop equal to the product of the resistor R1 and the flowing current, and the input pin of the timer circuit 29 The potential of No. 2 is less than 1/3 of the input voltage. Therefore, the timer circuit 29 is triggered, and the output pin No. 3 is activated within a certain period of time (for example, 330 m s ) as shown in FIG. The level of is high level. Therefore, the current flowing through the primary side diode of the photocoupler PC is cut off, the light emitting element LED is turned off, the transistor Tr is turned off, and the circuit between the photocoupler 19 and the control section 20 is cut off.

すなわち、スイツチング部11からの指令で、
第7図のaで示すような放電指令信号が発生し、
接触したワイヤ15とトーチ棒17を介して、放
電の場合と同じような信号がフオトカプラ19で
検知されたとしても、その信号は誤放電信号と判
別されて、制御部20への送出がカツトされるよ
うになる。
That is, with a command from the switching section 11,
A discharge command signal as shown by a in Fig. 7 is generated,
Even if the photocoupler 19 detects a signal similar to that in the case of electric discharge through the wire 15 and the torch rod 17 that are in contact, the signal is determined to be an erroneous electric discharge signal and is not sent to the control unit 20. Become so.

その他、ダイオードDは放電時に印加される高
電圧をカツトし、コンデンサC1,C2はノイズ
吸収の作用をするようになり、さらに抵抗R3は
電流制限抵抗として作用する。
In addition, the diode D cuts off the high voltage applied during discharge, the capacitors C1 and C2 function as noise absorbers, and the resistor R3 functions as a current limiting resistor.

尚、タイマー回路29としても入力特性の電源
電圧の1/3以下の電圧でトリガするものとしたの
は、次のような理由による。すなわち、電流制限
抵抗13を通してスイツチングすると、タイマー
回路の入力ピンの電圧は零とはならず数(V)の
電圧が発生する状態となる。したがつて、一般の
デイスクリート素子やICでは、正常なスイツチ
ング動作はしない。また、タイマー回路を放電ギ
ヤツプ14に対して直接接続する状態とすると、
ノイズに対して誤動作を生じ易くなり、これらの
点を満足させるためにタイマー回路29の入力特
性を、電源電圧の1/3以下の電圧でトリガされる
素子で構成するようにしたものである。
The reason why the timer circuit 29 is also triggered by a voltage that is 1/3 or less of the power supply voltage of the input characteristic is as follows. That is, when switching is performed through the current limiting resistor 13, the voltage at the input pin of the timer circuit does not become zero, but a voltage of several (V) is generated. Therefore, ordinary discrete elements and ICs do not perform normal switching operations. Furthermore, if the timer circuit is connected directly to the discharge gap 14,
Malfunctions are likely to occur due to noise, and in order to satisfy these points, the input characteristics of the timer circuit 29 are configured with elements that are triggered by a voltage of 1/3 or less of the power supply voltage.

上記実施例においては、ワイヤクランプ抜けに
対応する誤放電信号の遮断を、フオトカプラ19
と制御部20との間のインタフエース回路28を
断とすることにより実現した。しかし、高圧部や
ワークの特性によつては、放電ギヤツプに短絡電
流が流れては不都合な場合がある。このような時
には、インタフエース回路28のトランジスタ
Trからの信号によつて、スイツチング部11を
カツト状態にするか、あるいはリセツト状態とな
るインタフエース回路によつてスイツチング部1
1に指令信号を送出し、高圧部12に対する指令
を断つようにすれば、ワイヤ15とトーチ棒17
とが接触してもそこには短絡電流が流れることな
く、結果として制御部20に対する誤放電信号を
遮断することになり、ワイヤボンド装置の停止制
御が実行されるようになる。
In the above embodiment, the photocoupler 19 blocks the erroneous discharge signal corresponding to the disconnection of the wire clamp.
This was realized by disconnecting the interface circuit 28 between the controller 20 and the controller 20. However, depending on the characteristics of the high-voltage part and the workpiece, it may be inconvenient if a short-circuit current flows through the discharge gap. In such a case, the transistor of the interface circuit 28
The switching unit 11 is set to the cut state by a signal from the Tr, or the switching unit 1 is set to the reset state by the interface circuit.
If a command signal is sent to the wire 15 and the command to the high voltage section 12 is cut off, the wire 15 and the torch rod 17
Even if they come into contact, no short-circuit current will flow there, and as a result, the erroneous discharge signal to the control unit 20 will be cut off, and the wire bonding device will be controlled to stop.

以上のようにこの発明によれば、ワイヤクラン
プ抜けによる不良率(この不良率はクランプ抜け
に限らず、ワイヤとトーチ棒が接触することによ
り発生する不良をも含む)は、従来の0.5%以下
とすることができ、ワイヤボンド装置の制御に大
きな効果を発揮することができる。
As described above, according to the present invention, the defective rate due to wire clamp coming off (this defective rate is not limited to missing clamps, but also includes defects caused by contact between the wire and the torch bar) is 0.5% or less compared to the conventional method. This can be very effective in controlling the wire bonding device.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のワイヤボンド装置を説明する構
成図、第2図および第3図はそれぞれワイヤボン
ドの放電部の状態を説明する図、第4図は上記放
電部のトーチ棒とワイヤとの関係を説明する図、
第5図はこの発明の一実施例に係るワイヤボンド
装置を説明する構成図、第6図は上記装置のワイ
ヤ異常検出制御部を示す回路図、第7図は上記装
置の作用を説明する図である。 11…スイツチング部、12…高圧部、13…
電流制限抵抗、14…放電ギヤツプ、15…ワイ
ヤ、16…クランプ、17…トーチ棒、18…ボ
ール、19…フオトカプラ、20…ワイヤボンド
制御部、25…ワイヤ異常検出制御部、26…セ
ンサ部、27…タイマー部、28…インタフエー
ス回路。
FIG. 1 is a configuration diagram explaining a conventional wire bonding device, FIGS. 2 and 3 are diagrams each explaining the state of the discharge section of the wire bond, and FIG. 4 shows the relationship between the torch rod and the wire in the discharge section. A diagram explaining the relationship,
FIG. 5 is a block diagram illustrating a wire bonding device according to an embodiment of the present invention, FIG. 6 is a circuit diagram showing a wire abnormality detection control section of the device, and FIG. 7 is a diagram illustrating the operation of the device. It is. 11... Switching section, 12... High pressure section, 13...
Current limiting resistor, 14...Discharge gap, 15...Wire, 16...Clamp, 17...Torch bar, 18...Ball, 19...Photocoupler, 20...Wire bond control section, 25...Wire abnormality detection control section, 26...Sensor section, 27...Timer section, 28...Interface circuit.

Claims (1)

【特許請求の範囲】[Claims] 1 ワイヤボンド装置におけるワイヤクランプ抜
けを検出する装置において、ワイヤボンド装置稼
動中、ワイヤクランプ部からワイヤが外れた場合
にボンデイングワイヤとトーチ棒との接触により
流れる電流を検知する手段と、この電流検知に対
応して特定される時間の範囲で放電信号をワイヤ
ボンド制御部に供給するインタフエース回路を制
御し放電検知信号がワイヤボンド制御部に供給さ
れることがないようにする手段とを具備したこと
を特徴とするワイヤクランプ抜け検出装置。
1. In a device for detecting wire clamp disconnection in a wire bonding device, means for detecting a current flowing due to contact between a bonding wire and a torch bar when a wire comes off from a wire clamp portion during operation of the wire bonding device, and a means for detecting this current. means for controlling an interface circuit that supplies a discharge signal to the wire bond control section within a time range specified in accordance with the above, and preventing the discharge detection signal from being supplied to the wire bond control section. A wire clamp disconnection detection device characterized by:
JP57111133A 1982-06-28 1982-06-28 Detection device for wire clamp coming-off of wire bonding device Granted JPS592332A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57111133A JPS592332A (en) 1982-06-28 1982-06-28 Detection device for wire clamp coming-off of wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57111133A JPS592332A (en) 1982-06-28 1982-06-28 Detection device for wire clamp coming-off of wire bonding device

Publications (2)

Publication Number Publication Date
JPS592332A JPS592332A (en) 1984-01-07
JPH0210573B2 true JPH0210573B2 (en) 1990-03-08

Family

ID=14553282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57111133A Granted JPS592332A (en) 1982-06-28 1982-06-28 Detection device for wire clamp coming-off of wire bonding device

Country Status (1)

Country Link
JP (1) JPS592332A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5929390A (en) * 1994-09-14 1999-07-27 Ishida Co., Ltd. Load cell weighing apparatus using the same

Also Published As

Publication number Publication date
JPS592332A (en) 1984-01-07

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