JP2657688B2 - Method for detecting wire bonding state of light emitting device - Google Patents

Method for detecting wire bonding state of light emitting device

Info

Publication number
JP2657688B2
JP2657688B2 JP33245088A JP33245088A JP2657688B2 JP 2657688 B2 JP2657688 B2 JP 2657688B2 JP 33245088 A JP33245088 A JP 33245088A JP 33245088 A JP33245088 A JP 33245088A JP 2657688 B2 JP2657688 B2 JP 2657688B2
Authority
JP
Japan
Prior art keywords
light emitting
wire
emitting element
state
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP33245088A
Other languages
Japanese (ja)
Other versions
JPH02178944A (en
Inventor
豊 奥山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Mechatronics Co Ltd
Original Assignee
Toshiba Mechatronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Mechatronics Co Ltd filed Critical Toshiba Mechatronics Co Ltd
Priority to JP33245088A priority Critical patent/JP2657688B2/en
Publication of JPH02178944A publication Critical patent/JPH02178944A/en
Application granted granted Critical
Publication of JP2657688B2 publication Critical patent/JP2657688B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、発光ダイオード、半導体レーザ等の発光素
子ワイヤボンディング状態検出方法に関する。Description: TECHNICAL FIELD The present invention relates to a method for detecting a wire bonding state of a light emitting element such as a light emitting diode and a semiconductor laser.

［従来の技術］ リードフレームのアイランド部に固着されている発光
素子と、リードフレームのリード端子とを、電気的に接
続する手段としてワイヤボンディング装置が用いられて
いる。ワイヤボンディング装置は、ワイヤの一端を発光
素子の電極端子に接合し、更にワイヤの中途部をリード
端子に接合後、この接合部でワイヤをカットする。[Prior Art] A wire bonding apparatus is used as a means for electrically connecting a light emitting element fixed to an island portion of a lead frame and a lead terminal of the lead frame. A wire bonding apparatus joins one end of a wire to an electrode terminal of a light emitting element, and further joins an intermediate portion of the wire to a lead terminal, and cuts the wire at this joint.

従来、上述のワイヤの一端が発光素子の電極端子に接
合されたか否かを検出するワイヤボンディング状態検出
方法として、ワイヤとリードフレームのアイランド部と
の間に電圧を印加し、これによるワイヤの通電状態を電
流検出器にて検出するものがある。Conventionally, as a wire bonding state detecting method for detecting whether or not one end of the above-mentioned wire is joined to the electrode terminal of the light emitting element, a voltage is applied between the wire and the island portion of the lead frame, and the current is applied to the wire. In some cases, the state is detected by a current detector.

［発明が解決しようとする課題］ 然しながら、上記従来のワイヤボンディング状態検出
方法は、ワイヤの一端が発光素子の電極端子に単に接合
されたか否かを検出するものであるにすぎない。即ち、
上記従来の方法では、ワイヤの一端と上記電極端子との
接合状態が不完全で比較的大きな接触抵抗損がある場合
にも、ワイヤには電流が流れるため、この電流の流れを
検出して上記両者が接合されたことの判定を下すことと
なる。従って、上記両者の接合状態が不完全であって、
接触抵抗損の存在により、ワイヤに通電しても発光素子
が発光しない場合にも、これを検出することができな
い。[Problems to be Solved by the Invention] However, the above-described conventional wire bonding state detection method merely detects whether one end of the wire is simply bonded to the electrode terminal of the light emitting element. That is,
In the above-described conventional method, even when the bonding state between one end of the wire and the electrode terminal is incomplete and there is a relatively large contact resistance loss, a current flows through the wire. It will be determined that both have been joined. Therefore, the joining state of the two is incomplete,
Due to the presence of the contact resistance loss, even when the light emitting element does not emit light even when the wire is energized, it cannot be detected.

本発明は、ワイヤの一端と発光素子の電極端子との接
合状態が、発光素子を発光させ得るに足る程度に完全で
あるか否かを確実且つ容易に検出することを目的とす
る。An object of the present invention is to reliably and easily detect whether or not the bonding state between one end of a wire and an electrode terminal of a light emitting element is complete enough to allow the light emitting element to emit light.

［課題を解決するための手段］ 本発明は、導電性基板に固着されている発光素子の電
極端子にワイヤの一端を接合した後、ワイヤと導電性基
板との間に通電し、この通電による発光素子の発光状態
を検出することにより、発光素子とワイヤとの接合性の
良否を判定するようにしたものである。[Means for Solving the Problems] According to the present invention, after joining one end of a wire to an electrode terminal of a light emitting element fixed to a conductive substrate, a current is supplied between the wire and the conductive substrate. By detecting the light emitting state of the light emitting element, it is determined whether or not the bonding property between the light emitting element and the wire is good.

［作用］ 本発明によれば、導電性基板に固着されている発光素
子の電極端子にワイヤの一端を接合した状態で、ワイヤ
と導電性基板との間に通電するものである。従って、上
記通電状態下で、発光素子の発光状態を検出し、発光
すれば、ワイヤの一端と発光素子の接続端子との接合状
態が、発光させ得るに足る程度に完全であることが、逆
に、発光しなければ、上記接合状態が完全でないこと
が、それぞれ確実且つ容易に検出されることになる。[Operation] According to the present invention, a current flows between the wire and the conductive substrate while one end of the wire is joined to the electrode terminal of the light emitting element fixed to the conductive substrate. Accordingly, if the light emitting state of the light emitting element is detected and the light is emitted under the above-mentioned energized state, it is concluded that the bonding state between one end of the wire and the connection terminal of the light emitting element is complete enough to emit light. If no light is emitted, it is possible to reliably and easily detect that the bonding state is not perfect.

［実施例］ 第１図は本発明に基づく検出システムを示す模式図、
第２図は上記検出システムの動作を示す時間線図、第３
図は発光検出状態を示す模式図である。Embodiment FIG. 1 is a schematic diagram showing a detection system based on the present invention,
FIG. 2 is a time chart showing the operation of the detection system, and FIG.
The figure is a schematic diagram showing a light emission detection state.

第１図のワイヤボンディング装置10において、11はリ
ードフレーム、11Aはアイランド部、11Bはリード端子、
12は発光ダイオード等の発光素子、13はワイヤスプー
ル、14はワイヤ、15はキャピラリー、16は電気トーチで
ある。発光素子12はリードフレーム11のアイランド部11
Aに電気手に導通される状態で固着されている。In the wire bonding apparatus 10 of FIG. 1, 11 is a lead frame, 11A is an island portion, 11B is a lead terminal,
12 is a light emitting element such as a light emitting diode, 13 is a wire spool, 14 is a wire, 15 is a capillary, and 16 is an electric torch. The light emitting element 12 is an island portion 11 of the lead frame 11.
It is fixed to A in a state where it is conducted to the electric hand.

即ち、ワイヤボンディング装置10にあっては、キャピ
ラリー15から導出されたワイヤ14の一端を電気トーチ16
のスパークにより加熱し、該ワイヤ14の一端に溶融ボー
ルを形成し、第２図Ａに示す如くキャピラリー15を下降
し上記ワイヤ14の一端に形成した溶融ボールを第１ボン
ディング点としての発光素子12の電極端子に押し付けて
接合する（第１ボンド）。この第１ボンドの終了時、第
２図Ａに示す如くキャピラリー15を上昇させ、更に第１
ボンドと同様にしてキャピラリー15を再び下降し上記ワ
イヤ14の中途部を第２ボンディング点としてのリード端
子11Bに接合し（第２ボンド）、この接合部でワイヤ14
をカットするものである。That is, in the wire bonding apparatus 10, one end of the wire 14 led out of the capillary 15 is connected to the electric torch 16
2A, a molten ball is formed at one end of the wire 14, and the molten ball formed at one end of the wire 14 is moved down the capillary 15 as shown in FIG. (The first bond). At the end of the first bond, the capillary 15 is raised as shown in FIG.
Similarly to the bond, the capillary 15 is lowered again, and the middle part of the wire 14 is joined to the lead terminal 11B as a second bonding point (second bond).
Is to cut.

而して、ワイヤボンディング装置10は、第１図、第３
図に示す如くのワイヤボンディング状態検出装置20を有
している。検出装置20において、21はスイッチ、22A、2
2Bは接点、23A、23Bは直流電源、24は抵抗、25はITVカ
メラ等の発光状態検出センサ、26は制御装置である。Thus, the wire bonding apparatus 10 is similar to that shown in FIGS.
It has a wire bonding state detecting device 20 as shown in the figure. In the detection device 20, 21 is a switch, 22A, 2
2B is a contact, 23A and 23B are DC power supplies, 24 is a resistor, 25 is a light emitting state detection sensor such as an ITV camera, and 26 is a control device.

即ち、検出装置20において、スイッチ21の固定端は抵
抗24を介してワイヤ14に接続され、スイッチ21の可動端
は第１図に示すオフ状態から電源23Aの接点22Aと電源23
Bの接点22Bのいずれか一方にオンできるように構成され
ている。尚、リードフレーム11のアイランド部11Aが接
触する不図示のガイドレール、電源23A、23Bのアース端
子のそれぞれは、ボンディング装置10の共通の架台を介
して電気的に接続される。又、電源23Aにおける接点22A
の側の極性と電源23Bにおける接点22Bの側の極性とは逆
極性であり、スイッチ21は、今回ボンディングされる発
光素子12における電極端子の極性に対応する接点22A、2
2Bとの間でオン／オフされ、結果として発光素子12とリ
ードフレーム11のアイランド部11Aとの間に通電し、ひ
いては発光素子12に導通できることとしている。That is, in the detection device 20, the fixed end of the switch 21 is connected to the wire 14 via the resistor 24, and the movable end of the switch 21 is switched from the OFF state shown in FIG.
It is configured such that either one of the contact points 22B of B can be turned on. The guide rail (not shown) with which the island portion 11A of the lead frame 11 contacts and the ground terminals of the power supplies 23A and 23B are electrically connected via a common base of the bonding apparatus 10. Also, contact 22A in power supply 23A
Is opposite to the polarity of the contact 22B on the power supply 23B, and the switch 21 is connected to the contacts 22A, 2 corresponding to the polarities of the electrode terminals of the light emitting element 12 to be bonded this time.
The light emitting element 12 is turned on / off between the light emitting element 2B and the light emitting element 12 and the island portion 11A of the lead frame 11, and as a result, the light emitting element 12 can be electrically connected.

又、検出センサ25は、スイッチ21のオンによって上述
の如くに通電されることとなる発光素子12の発光状態を
検出する。Further, the detection sensor 25 detects the light emitting state of the light emitting element 12 to be energized as described above when the switch 21 is turned on.

更に、制御装置26は、上記検出センサ25の検出結果を
取込み、スイッチ21のオン時に発光素子12が発光するか
否かにより、発光素子12とワイヤ14との接合性の良否を
判定する。尚、制御装置26は、以下に説明する如く、第
２図Ｂに示すスイッチ21のオン／オフタイミングにより
スイッチ21を駆動でき、第２図Ｃに示す発光タイミング
により検出センサ25による検出結果を取込む。Further, the control device 26 takes in the detection result of the detection sensor 25 and determines whether or not the bonding property between the light emitting element 12 and the wire 14 is good based on whether the light emitting element 12 emits light when the switch 21 is turned on. As described below, the control device 26 can drive the switch 21 at the on / off timing of the switch 21 shown in FIG. 2B, and obtains the detection result by the detection sensor 25 at the light emission timing shown in FIG. 2C. Put in.

以下、上記ワイヤボンディング装置10における発光素
子12のワイヤボンディング状態検出動作について説明す
る。Hereinafter, the operation of detecting the wire bonding state of the light emitting element 12 in the wire bonding apparatus 10 will be described.

電気トーチ16によりワイヤ14の一端に溶融ボールを形
成し、第２図Ａに示す如く、キャピラリー15を下降し、
このワイヤ14の一端を発光素子12の電極端子に接合する
（第１ボンド）。A molten ball is formed at one end of the wire 14 by the electric torch 16, and the capillary 15 is lowered as shown in FIG.
One end of the wire 14 is joined to the electrode terminal of the light emitting element 12 (first bond).

上記第１ボンド時点で、第２図Ｂに示す如く、スイッ
チ21が今回の発光素子12の電極端子極性に対応する、い
ずれか一方の電源23A、23Bの接点22A、22Bにオンされ
る。これにより、ワイヤ14とアイランド部11Aとの間、
従って発光素子12に通電される。At the time of the first bond, as shown in FIG. 2B, the switch 21 is turned on to the contacts 22A and 22B of one of the power supplies 23A and 23B corresponding to the current electrode terminal polarity of the light emitting element 12. Thereby, between the wire 14 and the island portion 11A,
Therefore, the light emitting element 12 is energized.

上記第１ボンドが終了し、キャピラリー15が上昇する
過程で、第２図Ｃに示ぐ如く、検出センサ25により発光
素子12の発光状態を検出する。In the process in which the first bond is completed and the capillary 15 is raised, the light emitting state of the light emitting element 12 is detected by the detection sensor 25 as shown in FIG. 2C.

その後、キャピラリー15を下降し、ワイヤ14の中途部
を第２ボンディング点としてのリード端子11Bに接合す
る（第２ボンド）前に、スイッチ21をオフする。Thereafter, the switch 21 is turned off before descending the capillary 15 and joining the middle part of the wire 14 to the lead terminal 11B as the second bonding point (second bond).

以上が発光素子12のワイヤボンディング状態検出動作
であるが、上記の発光検出のタイミングを第２ボンド
前とする理由は以下のとおりである。即ち、第２ボンド
後には、ワイヤ14に流れる電流は、インピーダンスの小
さいリードフレーム11の本体部を通ってしまい、インピ
ーダンスの大きい発光素子12には流れず、結果として発
光素子12の発光状態に基づく本発明の検出動作を行なう
に至らない。The above is the operation of detecting the wire bonding state of the light emitting element 12. The reason why the timing of the above light emission detection is set before the second bonding is as follows. That is, after the second bond, the current flowing through the wire 14 passes through the main body of the lead frame 11 having a small impedance and does not flow to the light emitting element 12 having a large impedance. The detection operation of the present invention is not performed.

又、上記において、第２ボンド前にスイッチ21をオ
フする理由は、第２ボンド後までワイヤ14に通電するこ
とが本発明の検出動作において無意味だからである。In the above description, the reason why the switch 21 is turned off before the second bond is that it is meaningless in the detection operation of the present invention that the wire 14 is energized until after the second bond.

次に、上記実施例の作用について説明する。 Next, the operation of the above embodiment will be described.

上記実施例によれば、リードフレーム11のアイランド
部11Aに固着されている発光素子12の電極端子にワイヤ1
4の一端を接合した状態で、ワイヤ14とアイランド部11A
との間に通電するものである。従って、上記通電状態下
で、発光素子12の発光状態を検出し、発光すれば、ワ
イヤ14の一端と発光素子12の接続端子との接合状態が、
発光させ得るに足る程度に完全であることが、逆に、
発光しない場合には、上記接合状態が完全でないこと
が、それぞれ確実且つ容易に検出されることになる。According to the above embodiment, the wire 1 is connected to the electrode terminal of the light emitting element 12 fixed to the island portion 11A of the lead frame 11.
4 with one end joined, wire 14 and island 11A
And electricity is supplied between them. Therefore, under the energized state, if the light emitting state of the light emitting element 12 is detected and light is emitted, the joining state between one end of the wire 14 and the connection terminal of the light emitting element 12 is
On the contrary, being complete enough to be able to emit light,
When no light is emitted, it is possible to reliably and easily detect that the bonding state is not perfect.

尚、上記実施例によれば、発光素子12そのものの品質
欠陥に起因する発光不良状態をも検出できる。Note that, according to the above embodiment, a light emission failure state caused by a quality defect of the light emitting element 12 itself can be detected.

［発明の効果］ 以上のように本発明によれば、ワイヤの一端と発光素
子の電極端子との接合状態が、発光素子を発光させ得る
に足る程度に完全であるか否かを確実且つ容易に検出す
ることができる。[Effects of the Invention] As described above, according to the present invention, it is possible to reliably and easily determine whether or not the bonding state between one end of a wire and an electrode terminal of a light emitting element is sufficient to allow the light emitting element to emit light. Can be detected.

【図面の簡単な説明】[Brief description of the drawings]

第１図は本発明に基づく検出システムを示す模式図、第
２図は上記検出システムの動作を示す時間線図、第３図
は発光検出状態を示す模式図である。 10……ワイヤボンディング装置、 11……リードフレーム（基板）、 12……発光素子、 14……ワイヤ、 20……検出装置、 21……スイッチ、 23A、23B……電源、 25……検出センサ。FIG. 1 is a schematic diagram showing a detection system based on the present invention, FIG. 2 is a time diagram showing the operation of the detection system, and FIG. 3 is a schematic diagram showing a light emission detection state. 10 Wire bonding device, 11 Lead frame (substrate), 12 Light emitting element, 14 Wire, 20 Detection device, 21 Switch, 23A, 23B Power supply, 25 Detection sensor .

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】導電性基板に固着されている発光素子の電
極端子にワイヤの一端を接合した後、ワイヤと導電性基
板との間に通電し、この通電による発光素子の発光状態
を検出することにより、発光素子とワイヤとの接合性の
良否を判定する、発光素子のワイヤボンディング状態検
出方法。An electric wire is applied between one end of a wire and an electrode terminal of a light emitting element fixed to the conductive substrate, and then a current is applied between the wire and the conductive substrate to detect a light emitting state of the light emitting element due to the electric current. Thus, a method for detecting a wire bonding state of a light emitting element, which determines whether bonding property between the light emitting element and a wire is good or not.
JP33245088A 1988-12-29 1988-12-29 Method for detecting wire bonding state of light emitting device Expired - Lifetime JP2657688B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33245088A JP2657688B2 (en) 1988-12-29 1988-12-29 Method for detecting wire bonding state of light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33245088A JP2657688B2 (en) 1988-12-29 1988-12-29 Method for detecting wire bonding state of light emitting device

Publications (2)

Publication Number Publication Date
JPH02178944A JPH02178944A (en) 1990-07-11
JP2657688B2 true JP2657688B2 (en) 1997-09-24

Family

ID=18255119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33245088A Expired - Lifetime JP2657688B2 (en) 1988-12-29 1988-12-29 Method for detecting wire bonding state of light emitting device

Country Status (1)

Country Link
JP (1) JP2657688B2 (en)

Also Published As

Publication number Publication date
JPH02178944A (en) 1990-07-11

Similar Documents

Publication Publication Date Title
JPS59165430A (en) Lead wire bond trial detector
US5058797A (en) Detection method for wire bonding failures
JP2657688B2 (en) Method for detecting wire bonding state of light emitting device
JP3384442B2 (en) Bonding wire defect detection method
JPH11243119A (en) Method and device for wire bonding
JPH05283748A (en) Detecting circuit for failure of discontinuity and short circuit of light-emitting diode
KR100250133B1 (en) Apparatus for detecting wire break
JPS6384132A (en) Method and apparatus for inspecting wire bonding
JPS5988842A (en) Method for detecting failure of wire bonding
JPH0254944A (en) Wire bonder
JPS6096370A (en) Weld point detector
JPH0237098B2 (en)
JPH10321665A (en) Adaptability judging method of ball for wire bonding
JP2611891B2 (en) Wire bonding apparatus and method
JP3253049B2 (en) Ball diameter detecting method and ball diameter detecting device in wire bonding apparatus
JPS6234465B2 (en)
JPH0235419Y2 (en)
JPH01219574A (en) Method and device for measuring characteristic of laser diode
JPS617650A (en) Socket for ic
JP3108150B2 (en) Photoelectric switch
JPH0210573B2 (en)
JPH11176868A (en) Wire bonding device
JP3264325B2 (en) Semiconductor device manufacturing equipment
JPS62168068A (en) Inspection device for printed circuit board
JPS6255942A (en) Bonding method