JPH0157493B2 - - Google Patents
Info
- Publication number
- JPH0157493B2 JPH0157493B2 JP57173270A JP17327082A JPH0157493B2 JP H0157493 B2 JPH0157493 B2 JP H0157493B2 JP 57173270 A JP57173270 A JP 57173270A JP 17327082 A JP17327082 A JP 17327082A JP H0157493 B2 JPH0157493 B2 JP H0157493B2
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- ion
- extraction electrode
- ion extraction
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 150000002500 ions Chemical class 0.000 claims description 116
- 238000000605 extraction Methods 0.000 claims description 63
- 239000012212 insulator Substances 0.000 claims description 32
- 238000010884 ion-beam technique Methods 0.000 claims description 17
- 230000005684 electric field Effects 0.000 claims description 6
- 239000000284 extract Substances 0.000 claims description 4
- 239000000470 constituent Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 32
- 239000000463 material Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010849 ion bombardment Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007737 ion beam deposition Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electron Sources, Ion Sources (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57173270A JPS5963729A (ja) | 1982-10-04 | 1982-10-04 | イオンシヤワ装置 |
| DE8383305202T DE3376921D1 (en) | 1982-09-10 | 1983-09-07 | Ion shower apparatus |
| EP83305202A EP0106497B1 (en) | 1982-09-10 | 1983-09-07 | Ion shower apparatus |
| US06/530,424 US4450031A (en) | 1982-09-10 | 1983-09-08 | Ion shower apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57173270A JPS5963729A (ja) | 1982-10-04 | 1982-10-04 | イオンシヤワ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5963729A JPS5963729A (ja) | 1984-04-11 |
| JPH0157493B2 true JPH0157493B2 (cs) | 1989-12-06 |
Family
ID=15957333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57173270A Granted JPS5963729A (ja) | 1982-09-10 | 1982-10-04 | イオンシヤワ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5963729A (cs) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6127053A (ja) * | 1984-07-13 | 1986-02-06 | Nissin Electric Co Ltd | 電子ビ−ム源 |
| US7495241B2 (en) | 2004-02-26 | 2009-02-24 | Tdk Corporation | Ion beam irradiation apparatus and insulating spacer for the same |
| US8603591B2 (en) * | 2009-04-03 | 2013-12-10 | Varian Semiconductor Ewuipment Associates, Inc. | Enhanced etch and deposition profile control using plasma sheath engineering |
| JP6598243B2 (ja) * | 2015-08-20 | 2019-10-30 | 国立研究開発法人産業技術総合研究所 | イオンビーム源装置及び該装置を用いてイオンビーム電流密度を制御する方法 |
-
1982
- 1982-10-04 JP JP57173270A patent/JPS5963729A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5963729A (ja) | 1984-04-11 |
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