JPH0154874B2 - - Google Patents
Info
- Publication number
- JPH0154874B2 JPH0154874B2 JP54169268A JP16926879A JPH0154874B2 JP H0154874 B2 JPH0154874 B2 JP H0154874B2 JP 54169268 A JP54169268 A JP 54169268A JP 16926879 A JP16926879 A JP 16926879A JP H0154874 B2 JPH0154874 B2 JP H0154874B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- thickness
- plating
- conductor
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16926879A JPS5694684A (en) | 1979-12-27 | 1979-12-27 | Thin film fine pattern and method of manufacturing same |
| US06/219,155 US4392013A (en) | 1979-12-27 | 1980-12-22 | Fine-patterned thick film conductor structure and manufacturing method thereof |
| NLAANVRAGE8006987,A NL183380C (nl) | 1979-12-27 | 1980-12-22 | Van een patroon voorziene en een dikke laag omvattende geleiderconstructie en werkwijze voor het vervaardigen daarvan. |
| GB8041120A GB2066583B (en) | 1979-12-27 | 1980-12-23 | Thick film conductor |
| DE3048740A DE3048740C2 (de) | 1979-12-27 | 1980-12-23 | Verfahren zum Herstellen einer feingerasterten Dickfilm-Leiterbahnenanordnung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16926879A JPS5694684A (en) | 1979-12-27 | 1979-12-27 | Thin film fine pattern and method of manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5694684A JPS5694684A (en) | 1981-07-31 |
| JPH0154874B2 true JPH0154874B2 (en:Method) | 1989-11-21 |
Family
ID=15883350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16926879A Granted JPS5694684A (en) | 1979-12-27 | 1979-12-27 | Thin film fine pattern and method of manufacturing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5694684A (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015199116A1 (ja) * | 2014-06-26 | 2015-12-30 | 住友電工プリントサーキット株式会社 | プリント配線板、電子部品及びプリント配線板の製造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0620019B2 (ja) * | 1986-12-16 | 1994-03-16 | 富士電機株式会社 | 微細線材コイルの取出し保持装置 |
| JP5231863B2 (ja) * | 2008-05-16 | 2013-07-10 | 東京応化工業株式会社 | 導電層を有する三次元構造物及び三次元金属構造物の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5243976A (en) * | 1975-10-03 | 1977-04-06 | Sumitomo Bakelite Co | Method of producing printed circuit board |
-
1979
- 1979-12-27 JP JP16926879A patent/JPS5694684A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015199116A1 (ja) * | 2014-06-26 | 2015-12-30 | 住友電工プリントサーキット株式会社 | プリント配線板、電子部品及びプリント配線板の製造方法 |
| US10111330B2 (en) | 2014-06-26 | 2018-10-23 | Sumitomo Electric Printed Circuits, Inc. | Printed circuit board, electronic component, and method for producing printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5694684A (en) | 1981-07-31 |
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