JPH0151054B2 - - Google Patents

Info

Publication number
JPH0151054B2
JPH0151054B2 JP58212454A JP21245483A JPH0151054B2 JP H0151054 B2 JPH0151054 B2 JP H0151054B2 JP 58212454 A JP58212454 A JP 58212454A JP 21245483 A JP21245483 A JP 21245483A JP H0151054 B2 JPH0151054 B2 JP H0151054B2
Authority
JP
Japan
Prior art keywords
semiconductor substrate
etching
etching solution
heat treatment
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58212454A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60105225A (ja
Inventor
Kazuto Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58212454A priority Critical patent/JPS60105225A/ja
Publication of JPS60105225A publication Critical patent/JPS60105225A/ja
Publication of JPH0151054B2 publication Critical patent/JPH0151054B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P30/20—

Landscapes

  • Weting (AREA)
JP58212454A 1983-11-14 1983-11-14 半導体基板処理方法 Granted JPS60105225A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58212454A JPS60105225A (ja) 1983-11-14 1983-11-14 半導体基板処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58212454A JPS60105225A (ja) 1983-11-14 1983-11-14 半導体基板処理方法

Publications (2)

Publication Number Publication Date
JPS60105225A JPS60105225A (ja) 1985-06-10
JPH0151054B2 true JPH0151054B2 (esLanguage) 1989-11-01

Family

ID=16622886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58212454A Granted JPS60105225A (ja) 1983-11-14 1983-11-14 半導体基板処理方法

Country Status (1)

Country Link
JP (1) JPS60105225A (esLanguage)

Also Published As

Publication number Publication date
JPS60105225A (ja) 1985-06-10

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