JPH0147911B2 - - Google Patents
Info
- Publication number
- JPH0147911B2 JPH0147911B2 JP55086606A JP8660680A JPH0147911B2 JP H0147911 B2 JPH0147911 B2 JP H0147911B2 JP 55086606 A JP55086606 A JP 55086606A JP 8660680 A JP8660680 A JP 8660680A JP H0147911 B2 JPH0147911 B2 JP H0147911B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- solder
- electrical component
- width
- shaped electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 32
- 238000005476 soldering Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 15
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8660680A JPS5712597A (en) | 1980-06-27 | 1980-06-27 | Method of soldering circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8660680A JPS5712597A (en) | 1980-06-27 | 1980-06-27 | Method of soldering circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5712597A JPS5712597A (en) | 1982-01-22 |
JPH0147911B2 true JPH0147911B2 (nl) | 1989-10-17 |
Family
ID=13891663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8660680A Granted JPS5712597A (en) | 1980-06-27 | 1980-06-27 | Method of soldering circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5712597A (nl) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58115284A (ja) * | 1981-12-28 | 1983-07-08 | 株式会社 サタケ | 乾燥機 |
JPH01130484A (ja) * | 1987-11-13 | 1989-05-23 | Matsushita Electric Ind Co Ltd | セラミックチップ部品 |
-
1980
- 1980-06-27 JP JP8660680A patent/JPS5712597A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5712597A (en) | 1982-01-22 |
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