JPH0144215Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention is directed to a soldering device used for loading objects to be soldered, such as integrated circuit components, into a soldering fixture and, conversely, for unloading them from a soldering fixture. This invention relates to an accessory transfer device.

[Technical background of the invention]

As a conventional device of this type, the
As shown in Publication No. 57270, a large number of integrated circuit components (hereinafter referred to as ICs) are placed between a storage member provided on a tilting base and a fixture for soldering, through a guide interposed between them. , there is one that can be moved by sliding depending on the inclination of the base. The IC loaded from the storage member to the fixture by this device is supplied to the soldering line, the lead frame of the IC is covered with a solder film, and the IC is unloaded from the fixture to the storage member by this device. be done.

[Problems with background technology]

As described above, this type of device is indispensable for soldering IC lead frames using fixtures, but conventionally, when the fixture is mounted on or removed from a tilting base, In order to prevent the fixture side member from contacting and interfering with the guide, the fixture body had to be mounted on the base with a slight distance from the end face of the guide. For this reason, for example, there is a distance of 10mm between the IC insertion port and the guide end surface of the fixture above.
If there is a gap of , the IC must have a total length of 20 mm or more or it will not be able to smoothly transfer from the guide to the fixture or in the opposite direction, and there is a risk that it will fall into the gap and become stuck.

[Purpose of invention]

The purpose of the present invention is to enable the fixture to be easily attached and detached without interfering with the guide, and to prevent the IC from getting stuck when moving between the guides.

[Summary of the idea]

The present invention provides a soldering object transfer device for transferring a large number of objects to be soldered between a storage member provided on a tilting base and a soldering fixture via a guide, the fixture comprising:
The movable plate is positioned and supported above the movable plate that is movable in the direction toward and away from the guide along the tilting base, and the movable plate is fixed at a position away from the guide and at a position where it approaches the guide. A plate fixing mechanism is provided between the movable plate and the tilting base.

Then, the movable plate is fixed at a position away from the guide, the fixture is positioned and supported on the movable plate, and then the movable plate is moved to a position close to the guide and fixed, thereby separating the fixture and the guide. When the fixture is brought into close contact with the guide and the fixture is removed from the movable plate, the movable plate is returned to a position away from the guide and fixed.

[Example of idea]

Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.

As shown in FIGS. 1 and 2, a pair of bearings 2 are mounted on the upper part of the device main body 1 containing a built-in pneumatic source, etc.
is attached, and a shaft support 5 on the lower surface of the center of the tilting base 4 is rotatably supported by the bearing 2 via a support shaft 3. The base 4 consists of three plate-like members, and the three members are connected to two connecting plates 6.
The three bases 4 are connected to the support shaft 3 by one air cylinder 7 interposed between the lower surface of one of the connecting plates 6 and the lower part of the device main body 1.
are simultaneously rotated around.

Furthermore, on the upper surfaces of the three tilting bases 4, there are respectively a stand 12 that supports an IC magazine 11 as a storage member for soldering objects, a guide 13 that guides the sliding of objects to be soldered, and a guide 13 for guiding the sliding of objects to be soldered. Slide mechanism 15 supporting fixture 14
are provided in sequence. As a result, three sets of the IC magazines 11 and fixtures 14 can be provided.

The IC magazine 11 stores a large number of integrated circuit components (hereinafter referred to as ICs) A as objects to be soldered in a plurality of rows. Therefore, it is fixed on the stand 12. The guide 13 also includes a lower guide member 20 for guiding the ICA, as shown in FIG.
and an upper guide member 21, and a stopper 2 that is moved up and down by a pair of air cylinders 22 at one end.
3, and a gate 25 that is moved up and down by a pair of air cylinders 24 is provided at the other end. The stopper 23 and the gate 25 are provided with each IC column.
A number of pins are provided for locking each IC.

Then, the air cylinder 7 moves the base 4 so that the guide 13 is lower than the IC magazine 11.
When the ICA of each row in the magazine 11 is rotated,
The first half of each IC row is dropped into the guide 13 by sliding down the slope by its own weight with its back side down and the lead frame B facing up. At this time, the stopper 23 was raised.
The ICs in each row are stopped by each pin of the gate 25, and then the stopper 2
After the ICs in the center of each IC row are pressed and locked by the pins 3, the gate 25 is opened, and the IC group in the front half of the stopper 23 is inserted into the fixture 14. In this way, each IC row in the magazine 11 is divided into two parts by the guide 13 into the first half and the second half, and inserted into the respective fixtures 14.

As shown in FIG. 5, the fixture 14 has a plurality of rods 29 stretched from the periphery of the insertion opening 28 at one end of the frame-like body to the plate member (not shown) at the other end. A plurality of sets of IC holding parts 30 are provided corresponding to each IC row, and an opening/closing plate 31 is provided in front of the insertion slot 28.
The above opening/closing plate 3 is attached so that it can be moved up and down.
1, pins 33 are loosely fitted into elongated holes 32 at both ends.

Therefore, as shown in FIG. 5, when the fixture 14 is placed in the opposite direction to that used during soldering, the opening/closing plate 31 is lowered by its own weight and the insertion port 28 is opened naturally. From the magazine 11 to this fixture 14 via the guide 13
The ICA is inserted into the IC holding part 30 of the IC holding part 30 by sliding it from the back. This back sliding system is highly stable.

The slide mechanism 15 moves the fixture 14 toward and away from the guide 13, and as shown in FIGS. 1 and 2, a pair of rails 36 are fixed to the lower surface of the tilting base 4. A V-shaped pulley 38 rotatably supported on the lower surface of the movable plate 37 located above the base 4 is fitted inside the pair of rails 36.
With this structure, the fixture 14, which is formed on the movable plate 37 via the positioning member 39, can be moved forward and backward relative to the guide 13.

An iron piece 41 is attached to the end face of the movable plate 37, and a magnetic catch 42 is attached to the end of the base 4 opposite to the iron piece 41, and the iron piece 41 is attracted by the magnetic catch 42. This allows the movable plate 37 to move toward the guide 13.
so that it is fixed in a fixed position away from the In addition, there is a push latch 4 at the center of the end of the movable plate 37.
3 is attached, and the bar 45 that engages with the engaging pawl 44 of this push latch 43 is fixed onto the U-shaped cut groove 46 of the base 4, and the pawl 44 is moved from the outside of the bar 45 to the inside. At this stage, the pawl 44 is raised against the spring by the action of the inclined surface that comes into contact with the bar 45, and then is projected into the groove 46 and engaged with the bar 45, so that the movable plate 37 is guided. 13 so that it is fixed in a fixed position approaching 13. 47 is this Pushuratsuchi 43
By pressing this button 47, the engagement is released and the movable plate 37 can be returned to its original position.

In this way, the iron piece 41 and the magnetic catch 42 form a mechanism for fixing the movable plate at a position away from the guide 13, and the push latch 43 and bar 45 form a mechanism for fixing the movable plate at a position close to the guide 13. A plate fixing mechanism is formed. Therefore, the fixture 1 for the movable plate 37
4, by fixing the movable plate 37 in a position where it is separated from the guide 13, there is no possibility that the fixture 14 will interfere with the guide 13 at the time of attachment and detachment, so that attachment and detachment can be easily performed. . When driving this device, by fixing the movable plate 37 in a position close to the guide 13, the insertion opening 28 of the fixture 14 is brought into close contact with the end surface of the guide 13, and the IC is removed from the guide 13 during the above driving. To enable smooth movement into the fixture 14.

Although the above embodiment relates to loading, the present invention can also be used for unloading when a soldered IC in the fixture 14 is returned to the empty magazine 11. For this purpose, the magazine 11 and the fixture 14 may be arranged in opposite directions.

[Effect of idea]

According to the present invention, the fixture is positioned and supported by the movable plate which is provided so as to be movable between the fixed position away from the guide and the fixed position close to the guide, so the fixture is placed on the movable plate. When attaching and detaching, by fixing the movable plate in a position that separates it from the guide, there is no risk of the fixture interfering with the guide during attachment and detachment.
It is easy to attach and detach, and when tilting this device, by fixing the movable plate in a position close to the guide, the end face of the fixture can be kept in close contact with the end face of the guide, and the IC can be easily attached to the guide. It can be moved smoothly between the station and the fixture, and there are no problems such as IC getting stuck in between.

[Brief explanation of the drawing]

FIG. 1 is a front view showing an embodiment of the device of the present invention;
2 is a side view thereof, FIG. 3 is a plan view of a portion thereof, FIG. 4 is a sectional view taken along the line -- in FIG. 1, and FIG. 5 is a perspective view showing the transfer operation. 4...Tilt base, 11...As a storage member
IC magazine, 13... Guide, 14... Fixture, 37... Movable plate, 42... Magnetic catch of movable plate fixing mechanism, 43... Push latch of movable plate fixing mechanism.

Claims (1)

[Claims for Utility Model Registration] (1) In a soldering object transfer device that transfers a large number of soldering objects between a storage member provided on a tilting base and a soldering fixture via a guide. , the fixture is positioned and supported above a movable plate provided along the tilting base so as to be movable toward and away from the guide, and the movable plate is positioned at a position away from the guide and a position at which it approaches the guide. 1. A device for transferring objects to be soldered, characterized in that a movable plate fixing mechanism for fixing the movable plate and the tilting base is provided between the movable plate and the tilting base. (2) The object to be soldered is an integrated circuit component, and the integrated circuit component is placed between the housing member and the fixture via the guide, with the back side of the component facing down and the lead frame facing up. The device for transferring objects to be soldered according to claim 1, characterized in that the device slides the object to be soldered.