JP4254980B2 - Wafer transfer equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wafer transfer apparatus, for example, when transferring a wafer between first and second wafer storage cases having different functions, shapes, etc., such as a wafer shipping case and a process case. The present invention relates to a wafer transfer apparatus used.
[0002]
[Prior art]
Semiconductor wafers are stored and handled in wafer storage cases such as a wafer case, a wafer rack, and a wafer basket that can store a plurality of wafers in a semiconductor wafer manufacturing process, transfer between processes, shipping, and the like.
An example of a wafer storage case such as the wafer case is shown in FIG. 6. In the wafer storage case 70, a plurality of groove-shaped guides 71a for holding a wafer (not shown) at the periphery are arranged at predetermined intervals. The frame portion 71 is provided and a loading / unloading portion 72 for loading and unloading the wafer. And, as described above, the transfer operation from one wafer storage case in which the wafer is stored to another wafer storage case having different functions, shapes, etc. It is often done. In the conventional transfer operation between the wafer storage cases, the wafer diameter is small, and it is general to transfer the wafers one by one using a vacuum chuck or the like.
However, in recent years, with the trend toward larger wafer diameters, it has become difficult to perform suction transfer using a vacuum chuck, and in order to solve this problem and improve operational efficiency, a wafer capable of transferring a large number of wafers at once. A transfer device has been proposed.
[0003]
For example, in Japanese Patent Laid-Open No. 7-263521, a wafer storage case in which wafers are stored vertically in parallel at a predetermined pitch is disposed below the wafer holder, and in a comb shape according to the arrangement pitch of the wafers. A so-called vertical transfer type wafer transfer device is shown in which a wafer transfer tool having a formed upper surface portion and formed so as to be movable up and down is disposed below the wafer storage case.
In this wafer transfer apparatus, the wafer transfer tool is lifted from the bottom of the wafer storage case to push the wafer up to the position where the wafer holding unit is disposed and held by the holder, and then the wafer transfer tool is temporarily moved. After lowering and placing another case in place of the previous case, the wafer transfer tool is raised again, the wafer held by the holder is released, and placed on the wafer transfer tool Then, the wafer transfer tool is lowered to transfer the wafers to the other wafer storage case at once.
[0004]
Japanese Patent Application Laid-Open No. 7-240454 discloses that a wafer feeding side case and a wafer receiving side case are arranged on a wafer storage case mounting table of an apparatus main body so that wafer inlet / outlet portions are opposed to each other, and a wafer is placed thereon. A wafer transfer apparatus of the so-called horizontal mounting transfer type is shown, in which a wafer transfer block in which a wafer transfer plate is transferred in a comb shape at a predetermined interval is used to place the wafers and transfer them collectively by horizontal transfer. ing.
[0005]
Further, Japanese Patent Laid-Open No. 2-14546 discloses a horizontal transfer type wafer transfer apparatus similar to the above-mentioned horizontal direction transfer type wafer transfer apparatus, in order to abut and push the wafer edge. A wafer transfer device of the so-called wafer push type horizontal transfer type comprising a movable arm having a comb-shaped member on the front surface and a tooth portion formed on the comb-shaped member so as to correspond to the arrangement interval of the wafers is shown. Has been.
In this wafer transfer device, instead of placing and transferring the wafer on a wafer receiving plate or the like, the arm edge is moved horizontally by engaging and contacting the edge of the wafer to the concave portion of the tooth portion, The wafer is transferred between cases.
[0006]
[Problems to be solved by the invention]
Among the wafer transfer apparatuses as described above, in the so-called wafer pushing type horizontal transfer type wafer transfer apparatus, the wafer is transferred by pushing the rear edge of the wafer, so that the center of gravity of the wafer is the wafer storage case. When passing the tip (support point) of the guide of the wafer, the tip of the wafer is lowered. If the transfer of the wafer is continued in this state, the leading edge of the wafer may be caught by the guide of the wafer storage case on the receiving side, which may make the transfer impossible. Further, there is a risk of damaging the wafer and the wafer transfer device. In particular, as the diameter of the wafer increases from, for example, 8 inches to 12 inches, the degree of lowering of the tip of the wafer increases, and the above-described adverse effects are likely to occur.
[0007]
In order to solve this inconvenience, the front edge of the wafer is placed on the guide of the wafer storage case on the receiving side before the center of gravity of the wafer passes through the front end portion (support point) of the guide of the wafer storage case. In this way, it is conceivable that the entrance / exit part of the wafer storage case on the sending side and the entrance / exit part of the wafer storage case on the receiving side are arranged close to each other.
However, wafer storage cases such as wafer cases, baskets, racks, etc. currently do not have a uniform standard for shape and dimensions, and are not necessarily uniform in shape and dimension among manufacturers. There are dimensions and shapes. Therefore, the entrance / exit part of the wafer storage case on the sending side and the entrance / exit part of the wafer storage case on the receiving side may not be arranged close to each other.
[0008]
In order to solve this inconvenience, it is conceivable to adjust the height level between the guides of the two wafer storage cases. For this purpose, a mechanism for adjusting the installation height between the wafer storage cases is provided on the mounting table. It is necessary to provide it.
However, the structure of the wafer transfer device is complicated and expensive due to the adjustment mechanism, and there is a new problem that it requires complicated work that requires skill for adjustment at the time of operation and that adjustment setting takes time. Which is undesirable.
[0009]
The present invention has been made in order to solve the above technical problem of the conventional wafer transfer apparatus, and provides an expensive and complicated special adjustment mechanism or requires a complicated and skillful adjustment operation. Accordingly, an object of the present invention is to provide a wafer transfer apparatus that can reliably transfer wafers between storage cases without hindrance.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, a wafer transfer apparatus according to the present invention moves a plurality of wafers stored in a first wafer storage case in parallel by a pressing member, and the wafers are collectively moved to a second position. In the wafer transfer apparatus for transferring to the wafer storage case, the wafer storage case for mounting the first and second wafer storage cases with the wafer inlet / outlet portions of the first and second wafer storage cases facing each other. A base plate having a mounting portion and a base plate side end portion on which the first wafer storage case is mounted are provided so as to be slidable toward the second wafer storage case, and abuts against the edge of the wafer. a wafer pushing member having a wafer contact portion, formed in said wafer contact portion of the wafer push member, and a plurality of grooves consisting of horizontal and inclined surfaces, and the horizontal surface of the groove, those It is characterized in that it is formed in the lower position than the transfer surface of the wafer to be.
[0011]
In the present invention, since a plurality of grooves are formed in the wafer contact portion of the push member, an expensive and complicated special adjustment mechanism is not required, or a complicated and skillful adjustment operation is not required. Thus, the transfer of the wafer from the sending-side wafer storage case to the receiving-side wafer storage case can be reliably achieved without any trouble. In particular, the wafer can be reliably transferred from the sending-side wafer storage case to the receiving-side wafer storage case without lowering the tip of the wafer.
In particular, it is desirable that the horizontal surface of the groove is formed at a position lower than the wafer transfer surface that abuts. Thus, since the height of the horizontal plane of the groove is formed at a position lower than the wafer to be in contact with, the wafer is transferred in a state where the rear edge of the wafer is in contact with the inclined surface of the groove. As a result, troubles such as catching on the receiving case guide due to lowering of the tip of the wafer are avoided, and smooth transfer of the wafer is achieved.
[0012]
In addition, a wafer transfer apparatus according to the present invention, which has been made to achieve the above object, moves a plurality of wafers stored in a first or second wafer storage case in a substantially parallel manner by means of a pressing member. In the wafer transfer apparatus for transferring the wafers to the second or first wafer storage case in a lump, the first and second wafers are arranged so that the wafer inlet / outlet portions of the first and second wafer storage cases face each other. A base plate having a wafer storage case mounting portion for mounting the storage case, and a base plate side end portion on which the first wafer storage case is mounted are slidable in the direction of the second wafer storage case. And a first wafer pressing member having a wafer contact portion that contacts the edge of the wafer, and a horizontal surface and an inclined surface formed on the wafer contact portion of the first wafer pressing member. A plurality of grooves and a wafer contact that is slidable in the direction toward the first wafer storage case from the base plate side end portion on which the second wafer storage case is placed and that contacts the edge of the wafer A second wafer pressing member having a portion, and a plurality of grooves formed on a wafer contact portion of the second wafer pressing member, each having a horizontal surface and an inclined surface, and the first wafer pressing member and The horizontal plane of the groove in the second wafer pressing member is formed at a position lower than the transfer surface of the abutting wafer .
[0013]
In this way, two wafer pressing members are disposed at both ends of the base plate, and one of the first and second wafer storage cases is used as a sending-side wafer storage case, and the other is a receiving-side wafer storage case. As described above, it is desirable that the wafer can be transferred from either wafer storage case side to the other wafer storage case side.
[0014]
In particular, it is desirable that the horizontal surface of the groove is formed at a position lower than the wafer transfer surface that abuts. Thus, since the height of the horizontal plane of the groove is formed at a position lower than the wafer to be in contact with, the wafer is transferred in a state where the rear edge of the wafer is in contact with the inclined surface of the groove. As a result, troubles such as catching on the receiving case guide due to lowering of the tip of the wafer are avoided, and smooth transfer of the wafer is achieved.
[0015]
Furthermore, a delivery guide for preventing the wafer from dropping during wafer transfer is disposed between the wafer entrance / exit portions of the first and second wafer storage cases disposed on the wafer storage case mounting portion. Preferably, the transfer guide includes a column provided on both sides of the base plate orthogonal to the wafer transfer direction, and a short columnar guide protruding so as to face each other at a predetermined pitch in the vertical direction of the both columns. It is desirable to consist of By providing the delivery guide in this way, even when the wafer entrance / exit portions of the first and second wafer storage cases are separated, the transfer of wafers between cases can be performed smoothly and reliably.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a perspective view showing an embodiment of a push-type wafer transfer apparatus according to the present invention. The embodiment in FIG. 1 shows a wafer transfer apparatus in which two pressing members are disposed at both ends of the base plate.
2A is a plan view of the wafer transfer apparatus of FIG. 1, FIG. 2B is a side view of FIG. 1, and FIG. 2C is a front view of FIG. 3 shows the shape of the wafer contact portion of the wafer pressing member in the wafer transfer apparatus according to the present invention, FIG. 3 (a) is a front view, and FIG. 3 (b) is a side view.
4 is a perspective view schematically showing the operation of the wafer pushing member and the moving state of the wafer when the wafer is moved between the storage cases using the wafer transfer apparatus according to the present invention. (A), (b), (c) is the schematic for demonstrating temporally the movement state of the wafer after contact | abutting to a pushing member.
[0017]
As shown in FIGS. 1 and 2, the wafer transfer apparatus according to the present invention includes two types of wafer storage cases in which one side is a sending side wafer storage case 5 for the wafer 7 and the other side is a receiving side wafer storage case 6. The wafer storage case mounting portions 5a and 6a provided on the substantially rectangular base plate 3 are arranged so that the wafer inlet / outlet portions of the cases 5 and 6 face each other.
A wafer pressing member 1 having a wafer abutting portion 11 facing the rear side end of the feed-side wafer storage case 5 is provided at the end of the base plate 3. A pressing portion base plate 2 is provided at a lower portion of the wafer pressing member 1, and the pressing portion base plate 2 is slidably attached to a guide groove 8 a of a guide plate 8 of the pressing portion base. It is configured to be slidable in the direction of the receiving side wafer storage case 6).
[0018]
Further, as shown in FIGS. 3A and 3B, the wafer abutting portion 11 of the wafer pressing member 1 which is a characteristic part of the wafer transfer apparatus according to the present invention has a horizontal surface 10a on the lower surface side and an upper surface side on the upper surface side. The V-shaped groove 10 formed in the inclined surface 10b is provided in a sawtooth shape, and the horizontal surface 10a on the lower surface side of the groove 10 is brought into contact with the transfer surface of the wafer 7 (the sending wafer on which the wafer is placed). It is formed so as to be located slightly below the guide height of the storage case 5.
[0019]
In addition, a wafer drop prevention delivery guide, which is illustrated as 4, is disposed between the installation positions of the sending-side wafer storage case 5 and the receiving-side wafer storage case 6. The delivery guide 4 has support columns 4a provided on both sides of the base plate 3 orthogonal to the transfer direction of the wafer 7, and a predetermined pitch equivalent to the guides of the wafer storage cases 5 and 6 in the vertical direction of the support columns 4a. And short cylindrical guides 4b arranged so as to face each other.
[0020]
The delivery guide 4 (short cylindrical guide 4b) is for transferring the wafer 7 away from the guide of the sending side wafer storage case 5, thereby achieving smoother and more reliable transfer of the wafer between the storage cases. can do.
In particular, the delivery guide 4 is arranged in such a positional relationship that the front end of the wafer 7 is placed on the short cylindrical guide 4b before the center of gravity of the wafer 7 is separated from the guide of the sending wafer storage case 5. It is preferable. Similarly, the delivery guide 4 is disposed in such a positional relationship that the center of gravity of the wafer 7 leaves the short cylindrical guide 4b after the tip of the wafer 7 is placed on the guide of the receiving-side wafer storage case 6. Is preferred.
By disposing the delivery guide 4 (short cylindrical guide 4b) in such a positional relationship, the height of the guide of the feed-side wafer storage case 5 is used as the transfer surface of the wafer 7, and the wafer 7 is maintained in a substantially horizontal state. Can be transported.
[0021]
Even when the delivery guide 4 (short cylindrical guide 4b) is not arranged in the positional relationship, the tip of the wafer 7 is caused by the groove 10 of the wafer contact portion 11 of the push member 1 as described later. It can be transferred without lowering the part. A plurality of the delivery guides 4 may be provided in series. In particular, when the arrangement interval between the sending side wafer storage case and the receiving side wafer storage case is separated due to the shape of the wafer storage case and other reasons. It is effective for.
[0022]
Further, in the embodiment shown in FIG. 1, two pressing members are arranged at both ends of the base plate, and the receiving side wafer storage case is provided at the end of the base plate 3 on the receiving side wafer storage case 6 side. A wafer pressing member 1 ′ having a wafer contact portion 11 ′ opposed to the rear side end portion 6 of the wafer 6 is provided. Similar to the wafer pressing member 1, a pressing portion base plate 2 ′ is provided below the wafer pressing member 1 ′. The pressing portion base plate 2 ′ is formed in the guide groove 8 ′ a of the pressing portion base guide plate 8 ′. The base plate 3 is slidably attached and is slidable in the longitudinal direction of the base plate 3.
Note that the wafer contact portion 11 ′ of the wafer pressing member 1 ′ is also applied to the wafer contact portion 11 ′ as shown in FIG. 3A (front view) and FIG. 3B (side view). Similar to the contact portion 11, a V-shaped groove 10 having a horizontal surface on the lower surface side and an inclined surface on the upper surface side is disposed in a sawtooth shape, and the horizontal surface on the lower surface side of the groove 10 is in contact with the transfer height of the abutting wafer. It is configured to be located slightly below.
[0023]
As described above, when two pressing members are provided at both ends of the base plate, the receiving side wafer storage case 6 moves from the receiving side wafer storage case 5 side to the receiving side wafer storage case 5 side. The wafer can be transferred to the storage case 6.
[0024]
In order to transfer a wafer using the wafer transfer apparatus according to the present invention, as shown in FIGS. 1, 2, and 4, first, a sending wafer storage case 5 containing a wafer and a receiving wafer storage case. 6 are set on the wafer storage case mounting portions 5a and 5b on the base plate 3.
Next, while the pressing member 1 is slid along the guide groove 8 a of the pressing portion base guide plate 8, the wafer contact of the wafer pressing member 1 is placed on the rear side edge of the wafer 7 stored in the feeding-side wafer storage case 5. The contact portion 11 is brought into contact. Then, the wafer pressing member 1 is further slid to move the wafer 7 from the sending side wafer storage case 5 to the receiving side wafer storage case 6.
The pushing member 1 moves along the guide groove 8a of the guide plate 8, and the wafer 7 moves into the receiving side case 6 after passing through the transfer guide 4, and is stored in the receiving side case 6 so that the wafer is moved. Transfer between cases is completed.
[0025]
By the way, when the wafers are transferred between the cases, the guides formed on both side surfaces of the feeding-side wafer storage case 5 are first transferred to the wafers 7 as the wafer pressing member 1 advances as shown in FIG. Slide on 71a (see FIG. 6). At this time, the rear edge of the wafer 7 is in contact with the inclined surface 10 b of the groove 10.
When the center of gravity of the wafer 7 passes the front end portion of the guide 71a, the front end portion of the wafer 7 tends to fall, but the rear end edge of the wafer 7 is in contact with the inclined surface 10b of the groove 10, so that the wafer The tip of 7 is not lowered and is transferred in the state shown in FIG. If the front end of the wafer 7 is placed on the guide of the delivery guide 4 or the receiving side wafer storage case 6 before the center of gravity of the wafer 7 passes through the front end of the guide 71a, As described above, the transfer is performed while maintaining the substantially horizontal state with the guide height of the sending side wafer storage case 5 as the transfer surface.
[0026]
As the transfer is performed, the front end portion of the wafer 7 is placed on the short cylindrical guide 4b of the delivery guide 4, and then the rear end portion of the wafer 7 is separated from the guide 71a. At this time, since the wafer 7 is supported by the short cylindrical guide 4b, the rear edge of the wafer 7 moves downward on the inclined surface 10b of the groove 10 as shown in FIG. As a result, the tip of the wafer 7 is transferred in a state where it is raised from the horizontal state. Finally, as shown in FIG. 5C, the rear edge of the wafer 7 moves to the corner formed by the horizontal surface 10a and the inclined surface 10b of the groove 10, and is transferred in that state.
[0027]
That is, since the groove 10 is configured to be positioned slightly below the transfer height of each wafer 7 with which the groove 10 abuts, as shown in FIG. 5A, first, the rear edge of the wafer is the inclined surface of the groove 10a. Abut.
When the short cylindrical guide 4b of the delivery guide 4 is provided , the rear edge of the wafer is an inclined surface of the groove 10 as shown in FIG. In order to descend 10b, the wafer 7 is gradually inclined upward with respect to the traveling direction. Then, as shown in FIG. 5C, the rear edge of the wafer 7 is sandwiched between the horizontal surface 10a on the lower surface side of the groove 10 and the inclined surface 10b on the upper surface side, and the wafer 7 is inclined upward with respect to the traveling direction. It is made into a state and transferred.
[0028]
As described above, since the wafer is transferred with the wafer inclined upward with respect to the traveling direction, the leading edge of the wafer is not caught by the receiving-side wafer storage case guide, and the corresponding guide of the receiving-side wafer storage case opening is supported. It is inserted smoothly inside. Further, even when the receiving-side wafer storage case guide is at a higher position than the sending-side wafer storage case guide, it can be smoothly inserted into the corresponding guide in the receiving-side wafer storage case opening.
[0029]
Further, as shown by a two-dot chain line in FIG. 1, in the wafer transfer apparatus in which two pressing members are arranged at both ends of the base plate, the feeding-side wafer storage case 5 in the above case is used as the receiving-side wafer storage case. The wafer can be transferred and transferred in the reverse direction using the receiving-side wafer storage case 6 as the sending-side wafer storage case. At this time, the push member 1 'on the opposite side is slid in place of the push member 1 and the wafer 7 is transferred by the same operation as described above.
[0030]
The degree of inclination of the wafer is set mainly in consideration of the wafer diameter, the pitch of the wafer storage case guide, and other factors.
In general, the height of the horizontal surface 10a on the lower surface of the groove 10 is set to 1 to 5 mm, more preferably 2 to 3 mm lower than the position of the feed side wafer storage case guide (the height of the fulcrum) when the pitch is 10 mm. It is preferable.
Further, the inclination angle of the inclined surface 10b in the groove 10 of the wafer contact portion 11 is not necessarily limited as long as it is an acute angle, but smooth transition to the corner portion of the groove 10 at the edge of the wafer contacted is not limited. From the viewpoint, it is desirable that the inclination angle is 30 to 60 degrees, more preferably about 45 degrees with respect to the horizontal plane 10a.
[0031]
【The invention's effect】
As described above in detail, the wafer transfer apparatus according to the present invention does not require any special skill when transferring a wafer from case to case, and easily and reliably transfers a plurality of wafers at a time. The efficiency of the transfer work can be greatly improved.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a wafer transfer apparatus according to the present invention.
2 is a plan view (FIG. 2A), a side view (FIG. 2B), and a front view (FIG. 2C) of the wafer transfer apparatus of FIG. 1;
3 is a side view (FIG. 3 (a)) and a plan view (FIG. 3 (b)) showing the shape of a wafer contact portion of a wafer pressing member in the wafer transfer apparatus of FIG.
FIG. 4 is a perspective view schematically showing the operation of the wafer pressing member and the moving state of the wafer when the wafer is moved between cases using the wafer transfer apparatus according to the present invention.
FIG. 5 is a schematic diagram for explaining the moving state of the wafer after coming into contact with the pressing member over time.
FIG. 6 is a perspective view showing an example of the shape and structure of a wafer storage case.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1, 1 'Push member 2, 2' Push member Base plate 3 Base plate 4 Delivery guide 4a Support | pillar 4b Guide 5 Feed side wafer storage case 6 Reception side wafer storage case 7 Wafer 8, 8 'Guide plate 10 Groove 10a Horizontal surface 10b Inclined surface 11 Wafer contact portion 70 Wafer storage case 71a guide

Claims (4)

In a wafer transfer apparatus for moving a plurality of wafers stored in a first wafer storage case in parallel by a pressing member and transferring the wafers collectively to a second wafer storage case,
A base plate having a wafer storage case mounting portion for mounting the first and second wafer storage cases with the wafer inlet / outlet portions of the first and second wafer storage cases facing each other;
A wafer pusher having a wafer contact portion provided so as to be slidable in the direction toward the second wafer storage case from a base plate side end portion on which the first wafer storage case is placed and in contact with the edge of the wafer Members,
A plurality of grooves formed of a horizontal surface and inclined surfaces formed in the wafer contact portion of the wafer pressing member ;
The wafer transfer apparatus is characterized in that a horizontal surface of the groove is formed at a position lower than a transfer surface of a wafer to be abutted . In a wafer transfer apparatus, wherein a plurality of wafers stored in a first or second wafer storage case are moved in parallel by a pressing member, and the wafers are collectively transferred to the second or first wafer storage case. ,
A base plate having a wafer storage case mounting portion for mounting the first and second wafer storage cases with the wafer inlet / outlet portions of the first and second wafer storage cases facing each other;
A first contact portion is provided that is slidable in the direction toward the second wafer storage case from the base plate side end portion on which the first wafer storage case is placed, and has a wafer contact portion that contacts the edge of the wafer. Wafer pressing member,
A plurality of grooves formed on the wafer contact portion of the first wafer pressing member, each having a horizontal surface and an inclined surface;
A second contact portion is provided that is slidable in the direction toward the first wafer storage case from the base plate side end portion on which the second wafer storage case is placed, and has a wafer contact portion that contacts the edge of the wafer. Wafer pressing member,
A plurality of grooves formed of a horizontal surface and inclined surfaces formed in a wafer contact portion of the second wafer pressing member;
A wafer transfer apparatus, wherein a horizontal plane of a groove in the first wafer pressing member and the second wafer pressing member is formed at a position lower than a transfer surface of the wafer to be abutted . The delivery guide for preventing the wafer from dropping when the wafer is transferred is disposed between the wafer entrance / exit portions of the first and second wafer storage cases. The wafer transfer apparatus according to claim 1 or 2, wherein the wafer transfer apparatus is characterized in that: The delivery guide is composed of columns provided on both sides of the base plate orthogonal to the wafer transfer direction, and short columnar guides protruding so as to face each other at a predetermined pitch in the vertical direction of both columns. 4. The wafer transfer apparatus according to claim 3, wherein

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