JPH0143949B2 - - Google Patents
Info
- Publication number
- JPH0143949B2 JPH0143949B2 JP58149715A JP14971583A JPH0143949B2 JP H0143949 B2 JPH0143949 B2 JP H0143949B2 JP 58149715 A JP58149715 A JP 58149715A JP 14971583 A JP14971583 A JP 14971583A JP H0143949 B2 JPH0143949 B2 JP H0143949B2
- Authority
- JP
- Japan
- Prior art keywords
- composition
- stripping
- polyethylene glycol
- pyrrolidinone
- clause
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000203 mixture Substances 0.000 claims abstract description 84
- WYURNTSHIVDZCO-UHFFFAOYSA-N tetrahydrofuran Substances C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 22
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 22
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims abstract description 18
- -1 2-pyrrolidinone compound Chemical class 0.000 claims abstract description 15
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims abstract description 13
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 16
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 18
- 239000000758 substrate Substances 0.000 abstract description 16
- 229920002120 photoresistant polymer Polymers 0.000 description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000003153 chemical reaction reagent Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000001627 detrimental effect Effects 0.000 description 2
- 231100000419 toxicity Toxicity 0.000 description 2
- 230000001988 toxicity Effects 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- RSBHKNDSJJBCMN-UHFFFAOYSA-N 1-(1-hydroxyethyl)pyrrolidin-2-one Chemical compound CC(O)N1CCCC1=O RSBHKNDSJJBCMN-UHFFFAOYSA-N 0.000 description 1
- RUECCIUIKFVPPR-UHFFFAOYSA-N 1-(1-hydroxypropyl)pyrrolidin-2-one Chemical compound CCC(O)N1CCCC1=O RUECCIUIKFVPPR-UHFFFAOYSA-N 0.000 description 1
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical class CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- DCALJVULAGICIX-UHFFFAOYSA-N 1-propylpyrrolidin-2-one Chemical compound CCCN1CCCC1=O DCALJVULAGICIX-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- PLXMOAALOJOTIY-FPTXNFDTSA-N Aesculin Natural products OC[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@H]1Oc2cc3C=CC(=O)Oc3cc2O PLXMOAALOJOTIY-FPTXNFDTSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 150000004968 peroxymonosulfuric acids Chemical class 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- NESLWCLHZZISNB-UHFFFAOYSA-M sodium phenolate Chemical compound [Na+].[O-]C1=CC=CC=C1 NESLWCLHZZISNB-UHFFFAOYSA-M 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5013—Organic solvents containing nitrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Epoxy Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/415,161 US4401748A (en) | 1982-09-07 | 1982-09-07 | Stripping compositions and methods of stripping resists |
| US415161 | 1982-09-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5960438A JPS5960438A (ja) | 1984-04-06 |
| JPH0143949B2 true JPH0143949B2 (enExample) | 1989-09-25 |
Family
ID=23644603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58149715A Granted JPS5960438A (ja) | 1982-09-07 | 1983-08-18 | ストリッピング組成物 |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US4401748A (enExample) |
| EP (1) | EP0103808B1 (enExample) |
| JP (1) | JPS5960438A (enExample) |
| AT (1) | ATE25296T1 (enExample) |
| AU (1) | AU555867B2 (enExample) |
| CA (1) | CA1192119A (enExample) |
| DE (1) | DE3369577D1 (enExample) |
| HK (1) | HK51788A (enExample) |
| IE (1) | IE54417B1 (enExample) |
| IL (1) | IL69433A0 (enExample) |
| SG (1) | SG5388G (enExample) |
| ZA (1) | ZA835590B (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4737195A (en) * | 1983-11-18 | 1988-04-12 | Amchem Products | Activator-accelerator mixtures for alkaline paint stripper compositions |
| US4791043A (en) * | 1983-12-20 | 1988-12-13 | Hmc Patents Holding Co., Inc. | Positive photoresist stripping composition |
| EP0163202B1 (en) * | 1984-05-21 | 1991-02-06 | Shipley Company Inc. | Photoresist stripper and stripping method |
| US4617251A (en) * | 1985-04-11 | 1986-10-14 | Olin Hunt Specialty Products, Inc. | Stripping composition and method of using the same |
| ZA87922B (en) * | 1986-02-28 | 1987-09-30 | Macdermid Inc | Photoresist stripper composition |
| JPS6350838A (ja) * | 1986-08-21 | 1988-03-03 | Japan Synthetic Rubber Co Ltd | 剥離液 |
| IE59971B1 (en) * | 1986-11-10 | 1994-05-04 | Baker J T Inc | Stripping compositions and their use for stripping resists from substrates |
| EP0279089A1 (en) * | 1987-02-16 | 1988-08-24 | W.R. Grace & Co.-Conn. | Paper mill wire and felt cleaning |
| WO1988008445A1 (en) * | 1987-04-29 | 1988-11-03 | Coroman Industries, Inc. | Graffiti removal composition and method |
| SE462975B (sv) * | 1987-06-05 | 1990-09-24 | Chemie Consult Scandinavia Ab | Saett och rengoeringsmedel vid rengoering av foeremaal eller ytor med anvaendning av ett laettflytande, vaetskeformigt rengoeringsmedel innehaallande n-metyl-2-pyrrolidon genom neddoppning i ett bad innehaallande medlet |
| US4824763A (en) * | 1987-07-30 | 1989-04-25 | Ekc Technology, Inc. | Triamine positive photoresist stripping composition and prebaking process |
| EP0490726B1 (fr) * | 1990-12-07 | 1995-04-19 | Elf Atochem S.A. | Utilisation d'une composition pour le dépage de peintures |
| US5259993A (en) * | 1992-01-21 | 1993-11-09 | Cook Composites And Polymers Co. | Aqueous cleaner |
| FR2691713B1 (fr) * | 1992-06-02 | 1997-12-26 | Atochem Elf Sa | Composition pour decaper les peintures. |
| US6001192A (en) * | 1992-06-02 | 1999-12-14 | Elf Atochem S.A. | Paint stripping composition |
| US5308745A (en) * | 1992-11-06 | 1994-05-03 | J. T. Baker Inc. | Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins |
| CA2123193A1 (en) * | 1993-05-18 | 1994-11-19 | Shinji Konishi | Cleaning solution for apparatuses used for production of photosensitizer, apparatuses used for preparation of positive resist solutions and spin coater line pipings, and cleaning method using the cleaning solution |
| DE69704298T2 (de) * | 1996-05-31 | 2001-09-27 | Atofina, Puteaux | Abbeizmittelzusammensetzung auf Basis von einem polaren, aprotischen Lösungsmittel, einem Ether und Wasser |
| US6030932A (en) | 1996-09-06 | 2000-02-29 | Olin Microelectronic Chemicals | Cleaning composition and method for removing residues |
| US5759973A (en) * | 1996-09-06 | 1998-06-02 | Olin Microelectronic Chemicals, Inc. | Photoresist stripping and cleaning compositions |
| US5780406A (en) * | 1996-09-06 | 1998-07-14 | Honda; Kenji | Non-corrosive cleaning composition for removing plasma etching residues |
| US5817610A (en) * | 1996-09-06 | 1998-10-06 | Olin Microelectronic Chemicals, Inc. | Non-corrosive cleaning composition for removing plasma etching residues |
| US6413923B2 (en) | 1999-11-15 | 2002-07-02 | Arch Specialty Chemicals, Inc. | Non-corrosive cleaning composition for removing plasma etching residues |
| GB0105718D0 (en) * | 2001-03-08 | 2001-04-25 | Shipley Co Llc | Compositions containing heterocyclic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous material |
| US6677292B2 (en) * | 2002-01-11 | 2004-01-13 | Illinois Tool Works, Inc. | Cleaning solvent and dispenser |
| TW200404829A (en) * | 2002-08-19 | 2004-04-01 | Rohm & Haas | Resin cleaning method |
| US20070000871A1 (en) * | 2005-07-01 | 2007-01-04 | Harris Research, Inc. | Floor-etching solution |
| US8288330B2 (en) * | 2006-05-26 | 2012-10-16 | Air Products And Chemicals, Inc. | Composition and method for photoresist removal |
| US8026201B2 (en) | 2007-01-03 | 2011-09-27 | Az Electronic Materials Usa Corp. | Stripper for coating layer |
| FR2912151B1 (fr) * | 2007-02-05 | 2009-05-08 | Arkema France | Formulation de dimethylsulfoxyde en melange avec un additif permettant d'abaisser le point de cristallisation de ce dernier, et applications de ce melange |
| US8518865B2 (en) | 2009-08-31 | 2013-08-27 | Air Products And Chemicals, Inc. | Water-rich stripping and cleaning formulation and method for using same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1519393A1 (de) * | 1964-03-03 | 1970-12-23 | Telefunken Patent | Verfahren zum Abloesen eines Photolackes |
| NL6800538A (enExample) * | 1968-01-12 | 1969-07-15 | ||
| US3673099A (en) * | 1970-10-19 | 1972-06-27 | Bell Telephone Labor Inc | Process and composition for stripping cured resins from substrates |
| US4055515A (en) * | 1975-12-31 | 1977-10-25 | Borden, Inc. | Developer for printing plates |
| US4171240A (en) * | 1978-04-26 | 1979-10-16 | Western Electric Company, Inc. | Method of removing a cured epoxy from a metal surface |
| US4276186A (en) * | 1979-06-26 | 1981-06-30 | International Business Machines Corporation | Cleaning composition and use thereof |
| US4428871A (en) * | 1981-09-23 | 1984-01-31 | J. T. Baker Chemical Company | Stripping compositions and methods of stripping resists |
-
1982
- 1982-09-07 US US06/415,161 patent/US4401748A/en not_active Expired - Lifetime
-
1983
- 1983-07-20 CA CA000432805A patent/CA1192119A/en not_active Expired
- 1983-07-20 IE IE1701/83A patent/IE54417B1/en not_active IP Right Cessation
- 1983-07-29 AU AU17439/83A patent/AU555867B2/en not_active Ceased
- 1983-07-29 ZA ZA835590A patent/ZA835590B/xx unknown
- 1983-08-04 IL IL69433A patent/IL69433A0/xx unknown
- 1983-08-18 JP JP58149715A patent/JPS5960438A/ja active Granted
- 1983-09-06 EP EP83108772A patent/EP0103808B1/en not_active Expired
- 1983-09-06 AT AT83108772T patent/ATE25296T1/de not_active IP Right Cessation
- 1983-09-06 DE DE8383108772T patent/DE3369577D1/de not_active Expired
-
1988
- 1988-01-16 SG SG53/88A patent/SG5388G/en unknown
- 1988-07-07 HK HK517/88A patent/HK51788A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE3369577D1 (en) | 1987-03-05 |
| JPS5960438A (ja) | 1984-04-06 |
| IL69433A0 (en) | 1983-11-30 |
| CA1192119A (en) | 1985-08-20 |
| ZA835590B (en) | 1984-04-25 |
| AU555867B2 (en) | 1986-10-09 |
| IE54417B1 (en) | 1989-09-27 |
| IE831701L (en) | 1984-03-07 |
| EP0103808B1 (en) | 1987-01-28 |
| US4401748A (en) | 1983-08-30 |
| AU1743983A (en) | 1984-03-15 |
| SG5388G (en) | 1988-06-17 |
| ATE25296T1 (de) | 1987-02-15 |
| EP0103808A1 (en) | 1984-03-28 |
| HK51788A (en) | 1988-07-15 |
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| US4403029A (en) | Stripping compositions and methods of stripping resists | |
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| JPS6026945A (ja) | ストリツピング組成物及びレジストをストリツピングする方法 | |
| JPS6026340A (ja) | ストリツピング組成物及びレジストをストリツピングする方法 | |
| CA1179581A (en) | Stripping compositions and method of stripping resists |