JPH0143868Y2 - - Google Patents
Info
- Publication number
- JPH0143868Y2 JPH0143868Y2 JP18442083U JP18442083U JPH0143868Y2 JP H0143868 Y2 JPH0143868 Y2 JP H0143868Y2 JP 18442083 U JP18442083 U JP 18442083U JP 18442083 U JP18442083 U JP 18442083U JP H0143868 Y2 JPH0143868 Y2 JP H0143868Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal wire
- air
- hole
- air supply
- insertion hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 34
- 238000003780 insertion Methods 0.000 claims description 31
- 230000037431 insertion Effects 0.000 claims description 31
- 239000011148 porous material Substances 0.000 description 14
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18442083U JPS6090836U (ja) | 1983-11-29 | 1983-11-29 | エア−テンシヨン制御装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18442083U JPS6090836U (ja) | 1983-11-29 | 1983-11-29 | エア−テンシヨン制御装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6090836U JPS6090836U (ja) | 1985-06-21 |
| JPH0143868Y2 true JPH0143868Y2 (hu) | 1989-12-19 |
Family
ID=30398882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18442083U Granted JPS6090836U (ja) | 1983-11-29 | 1983-11-29 | エア−テンシヨン制御装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6090836U (hu) |
-
1983
- 1983-11-29 JP JP18442083U patent/JPS6090836U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6090836U (ja) | 1985-06-21 |
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