JPH0143453B2 - - Google Patents
Info
- Publication number
- JPH0143453B2 JPH0143453B2 JP56070078A JP7007881A JPH0143453B2 JP H0143453 B2 JPH0143453 B2 JP H0143453B2 JP 56070078 A JP56070078 A JP 56070078A JP 7007881 A JP7007881 A JP 7007881A JP H0143453 B2 JPH0143453 B2 JP H0143453B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- organic material
- etching
- pattern
- material thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Drying Of Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7007881A JPS57186335A (en) | 1981-05-12 | 1981-05-12 | Forming method for pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7007881A JPS57186335A (en) | 1981-05-12 | 1981-05-12 | Forming method for pattern |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57186335A JPS57186335A (en) | 1982-11-16 |
JPH0143453B2 true JPH0143453B2 (en, 2012) | 1989-09-20 |
Family
ID=13421141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7007881A Granted JPS57186335A (en) | 1981-05-12 | 1981-05-12 | Forming method for pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57186335A (en, 2012) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2720763B2 (ja) * | 1993-09-17 | 1998-03-04 | 日本電気株式会社 | 半導体装置の製造方法 |
US6696366B1 (en) * | 1998-08-17 | 2004-02-24 | Lam Research Corporation | Technique for etching a low capacitance dielectric layer |
KR100800165B1 (ko) | 2006-12-28 | 2008-02-01 | 주식회사 하이닉스반도체 | 반도체 소자의 제조방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5851412B2 (ja) * | 1975-03-19 | 1983-11-16 | 株式会社日立製作所 | 半導体装置の微細加工方法 |
JPS5497373A (en) * | 1978-01-19 | 1979-08-01 | Mitsubishi Electric Corp | Removal method of resist |
JPS5623752A (en) * | 1979-08-01 | 1981-03-06 | Matsushita Electronics Corp | Manufacture of semiconductor device |
-
1981
- 1981-05-12 JP JP7007881A patent/JPS57186335A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57186335A (en) | 1982-11-16 |
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