JPH0142516B2 - - Google Patents
Info
- Publication number
- JPH0142516B2 JPH0142516B2 JP57171665A JP17166582A JPH0142516B2 JP H0142516 B2 JPH0142516 B2 JP H0142516B2 JP 57171665 A JP57171665 A JP 57171665A JP 17166582 A JP17166582 A JP 17166582A JP H0142516 B2 JPH0142516 B2 JP H0142516B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- layout
- boards
- information
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 38
- 238000012545 processing Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000005553 drilling Methods 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 10
- 229920002120 photoresistant polymer Polymers 0.000 claims description 7
- 238000013461 design Methods 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 4
- 230000000996 additive effect Effects 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 230000026058 directional locomotion Effects 0.000 claims 1
- 230000033001 locomotion Effects 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 230000007261 regionalization Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011960 computer-aided design Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
Landscapes
- Making Paper Articles (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17166582A JPS5961195A (ja) | 1982-09-30 | 1982-09-30 | プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17166582A JPS5961195A (ja) | 1982-09-30 | 1982-09-30 | プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5961195A JPS5961195A (ja) | 1984-04-07 |
| JPH0142516B2 true JPH0142516B2 (de) | 1989-09-13 |
Family
ID=15927426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17166582A Granted JPS5961195A (ja) | 1982-09-30 | 1982-09-30 | プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5961195A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6093436A (ja) * | 1983-10-28 | 1985-05-25 | Hitachi Tobu Semiconductor Ltd | 電子部品実装配線基板の設計作図装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS48110656U (de) * | 1972-03-24 | 1973-12-19 |
-
1982
- 1982-09-30 JP JP17166582A patent/JPS5961195A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5961195A (ja) | 1984-04-07 |
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