JPH0142345Y2 - - Google Patents

Info

Publication number
JPH0142345Y2
JPH0142345Y2 JP1983187219U JP18721983U JPH0142345Y2 JP H0142345 Y2 JPH0142345 Y2 JP H0142345Y2 JP 1983187219 U JP1983187219 U JP 1983187219U JP 18721983 U JP18721983 U JP 18721983U JP H0142345 Y2 JPH0142345 Y2 JP H0142345Y2
Authority
JP
Japan
Prior art keywords
chip
wire
lead
distance
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983187219U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6094836U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983187219U priority Critical patent/JPS6094836U/ja
Publication of JPS6094836U publication Critical patent/JPS6094836U/ja
Application granted granted Critical
Publication of JPH0142345Y2 publication Critical patent/JPH0142345Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50
    • H10W72/01515
    • H10W72/075
    • H10W72/07551
    • H10W90/754

Landscapes

  • Wire Bonding (AREA)
JP1983187219U 1983-12-02 1983-12-02 半導体装置 Granted JPS6094836U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983187219U JPS6094836U (ja) 1983-12-02 1983-12-02 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983187219U JPS6094836U (ja) 1983-12-02 1983-12-02 半導体装置

Publications (2)

Publication Number Publication Date
JPS6094836U JPS6094836U (ja) 1985-06-28
JPH0142345Y2 true JPH0142345Y2 (cg-RX-API-DMAC10.html) 1989-12-12

Family

ID=30404181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983187219U Granted JPS6094836U (ja) 1983-12-02 1983-12-02 半導体装置

Country Status (1)

Country Link
JP (1) JPS6094836U (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0754840B2 (ja) * 1986-01-17 1995-06-07 株式会社日立製作所 半導体装置およびそのリ−ドフレ−ム

Also Published As

Publication number Publication date
JPS6094836U (ja) 1985-06-28

Similar Documents

Publication Publication Date Title
JPS5827935U (ja) 混成集積回路装置
JPH0142345Y2 (cg-RX-API-DMAC10.html)
JPH0256942A (ja) 半導体装置
JPH07321160A (ja) 半導体装置
JPS62195Y2 (cg-RX-API-DMAC10.html)
JPH06252329A (ja) 半導体装置
JPS6155770B2 (cg-RX-API-DMAC10.html)
JP2504538Y2 (ja) Ledアレイ装置
JPH0142346Y2 (cg-RX-API-DMAC10.html)
JPS6228780Y2 (cg-RX-API-DMAC10.html)
JPS6223674B2 (cg-RX-API-DMAC10.html)
KR900010673Y1 (ko) 고체 촬영소자의 패키지 구조
JPS58106950U (ja) 半導体装置のパツケ−ジ
JPS646041U (cg-RX-API-DMAC10.html)
JP2682072B2 (ja) 混成集積回路装置
JPH1187557A (ja) 半導体チップを備えた半導体装置の構造
JPS58184844U (ja) セラミツクパツケ−ジ
JPS5965553U (ja) 集積回路装置
JP2000307027A (ja) 半導体装置とそれに用いるリードフレーム
JPS63170983U (cg-RX-API-DMAC10.html)
JPS64332U (cg-RX-API-DMAC10.html)
JPS5858354U (ja) 半導体装置用リ−ドフレ−ム
JPS6192064U (cg-RX-API-DMAC10.html)
JPS58195445U (ja) 半導体集積回路パツケ−ジ
JPS6066030U (ja) ボンデイング装置