JPS646041U - - Google Patents
Info
- Publication number
- JPS646041U JPS646041U JP1987099366U JP9936687U JPS646041U JP S646041 U JPS646041 U JP S646041U JP 1987099366 U JP1987099366 U JP 1987099366U JP 9936687 U JP9936687 U JP 9936687U JP S646041 U JPS646041 U JP S646041U
- Authority
- JP
- Japan
- Prior art keywords
- electrode body
- chip
- lead frame
- lead wire
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/50—
-
- H10W72/07141—
-
- H10W72/07551—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/5366—
-
- H10W72/5445—
-
- H10W72/5449—
-
- H10W72/5473—
-
- H10W72/581—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987099366U JPH0546271Y2 (cg-RX-API-DMAC10.html) | 1987-06-30 | 1987-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987099366U JPH0546271Y2 (cg-RX-API-DMAC10.html) | 1987-06-30 | 1987-06-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS646041U true JPS646041U (cg-RX-API-DMAC10.html) | 1989-01-13 |
| JPH0546271Y2 JPH0546271Y2 (cg-RX-API-DMAC10.html) | 1993-12-03 |
Family
ID=31326458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987099366U Expired - Lifetime JPH0546271Y2 (cg-RX-API-DMAC10.html) | 1987-06-30 | 1987-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0546271Y2 (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037239A (ja) * | 2001-07-24 | 2003-02-07 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
| WO2021060161A1 (ja) * | 2019-09-27 | 2021-04-01 | 株式会社村田製作所 | モジュール |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60210845A (ja) * | 1984-04-05 | 1985-10-23 | Toshiba Corp | 樹脂封止型半導体装置 |
-
1987
- 1987-06-30 JP JP1987099366U patent/JPH0546271Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60210845A (ja) * | 1984-04-05 | 1985-10-23 | Toshiba Corp | 樹脂封止型半導体装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037239A (ja) * | 2001-07-24 | 2003-02-07 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
| WO2021060161A1 (ja) * | 2019-09-27 | 2021-04-01 | 株式会社村田製作所 | モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0546271Y2 (cg-RX-API-DMAC10.html) | 1993-12-03 |