JPH0141501B2 - - Google Patents
Info
- Publication number
- JPH0141501B2 JPH0141501B2 JP57027041A JP2704182A JPH0141501B2 JP H0141501 B2 JPH0141501 B2 JP H0141501B2 JP 57027041 A JP57027041 A JP 57027041A JP 2704182 A JP2704182 A JP 2704182A JP H0141501 B2 JPH0141501 B2 JP H0141501B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- copper
- resin varnish
- glass cloth
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002966 varnish Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 11
- 239000004744 fabric Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 5
- 210000003746 feather Anatomy 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005253 cladding Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000009941 weaving Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57027041A JPS58145444A (ja) | 1982-02-22 | 1982-02-22 | 銅張積層板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57027041A JPS58145444A (ja) | 1982-02-22 | 1982-02-22 | 銅張積層板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58145444A JPS58145444A (ja) | 1983-08-30 |
| JPH0141501B2 true JPH0141501B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-09-06 |
Family
ID=12209976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57027041A Granted JPS58145444A (ja) | 1982-02-22 | 1982-02-22 | 銅張積層板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58145444A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1982
- 1982-02-22 JP JP57027041A patent/JPS58145444A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58145444A (ja) | 1983-08-30 |