JPH0141258B2 - - Google Patents

Info

Publication number
JPH0141258B2
JPH0141258B2 JP5608783A JP5608783A JPH0141258B2 JP H0141258 B2 JPH0141258 B2 JP H0141258B2 JP 5608783 A JP5608783 A JP 5608783A JP 5608783 A JP5608783 A JP 5608783A JP H0141258 B2 JPH0141258 B2 JP H0141258B2
Authority
JP
Japan
Prior art keywords
semiconductor chip
semiconductor
envelope
positioning
notch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5608783A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59181700A (ja
Inventor
Ikuo Nibari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP5608783A priority Critical patent/JPS59181700A/ja
Publication of JPS59181700A publication Critical patent/JPS59181700A/ja
Publication of JPH0141258B2 publication Critical patent/JPH0141258B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP5608783A 1983-03-31 1983-03-31 半導体外囲器の取付部形成装置 Granted JPS59181700A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5608783A JPS59181700A (ja) 1983-03-31 1983-03-31 半導体外囲器の取付部形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5608783A JPS59181700A (ja) 1983-03-31 1983-03-31 半導体外囲器の取付部形成装置

Publications (2)

Publication Number Publication Date
JPS59181700A JPS59181700A (ja) 1984-10-16
JPH0141258B2 true JPH0141258B2 (enrdf_load_stackoverflow) 1989-09-04

Family

ID=13017307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5608783A Granted JPS59181700A (ja) 1983-03-31 1983-03-31 半導体外囲器の取付部形成装置

Country Status (1)

Country Link
JP (1) JPS59181700A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3519848C2 (de) * 1985-06-03 1987-05-14 Veit GmbH & Co, 8910 Landsberg Dampfbügelstation

Also Published As

Publication number Publication date
JPS59181700A (ja) 1984-10-16

Similar Documents

Publication Publication Date Title
JP3493282B2 (ja) 切削方法
CN108723599B (zh) 聚光点位置检测方法
US6825680B1 (en) Automated semiconductor probing device
JP3162580B2 (ja) ダイシング装置
US7337939B2 (en) Bonding apparatus
USRE28798E (en) Methods of and apparatus for aligning and bonding workpieces
JP2005311033A (ja) 切削ブレードの位置ずれ検出方法
JPH0141258B2 (enrdf_load_stackoverflow)
JPH1174228A (ja) 精密切削装置
JP2004128384A (ja) 部品実装装置および部品実装方法
US5561386A (en) Chip tester with improvements in handling efficiency and measurement precision
JP2888429B1 (ja) 穿孔機ユニットのダイセッター
JP2000164626A (ja) 部品のボンディング方法および装置
JP2844409B2 (ja) 半導体位置決め方法
JP3280736B2 (ja) ダイシング溝の位置測定方法
JP3201271B2 (ja) ボンディング装置におけるボンディングツール交換方法
JP2021000700A (ja) 加工装置及び加工方法
JP3359323B2 (ja) 電子部品実装ヘッドのガイド機構およびそれを用いた電子部品実装装置
EP3879563A1 (en) High precision bonding apparatus comprising heater
JP4783521B2 (ja) 面合わせ装置及び面合わせ方法
JPH069215B2 (ja) 位置決め装置
JP3194328B2 (ja) ダイボンド装置
JPS6227760B2 (enrdf_load_stackoverflow)
JP3343867B2 (ja) 接合レンズの心出し装置
JPH0274048A (ja) 微小部品位置決め装置および方法