JPH0141258B2 - - Google Patents
Info
- Publication number
- JPH0141258B2 JPH0141258B2 JP5608783A JP5608783A JPH0141258B2 JP H0141258 B2 JPH0141258 B2 JP H0141258B2 JP 5608783 A JP5608783 A JP 5608783A JP 5608783 A JP5608783 A JP 5608783A JP H0141258 B2 JPH0141258 B2 JP H0141258B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- semiconductor
- envelope
- positioning
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5608783A JPS59181700A (ja) | 1983-03-31 | 1983-03-31 | 半導体外囲器の取付部形成装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5608783A JPS59181700A (ja) | 1983-03-31 | 1983-03-31 | 半導体外囲器の取付部形成装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59181700A JPS59181700A (ja) | 1984-10-16 |
JPH0141258B2 true JPH0141258B2 (enrdf_load_stackoverflow) | 1989-09-04 |
Family
ID=13017307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5608783A Granted JPS59181700A (ja) | 1983-03-31 | 1983-03-31 | 半導体外囲器の取付部形成装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59181700A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3519848C2 (de) * | 1985-06-03 | 1987-05-14 | Veit GmbH & Co, 8910 Landsberg | Dampfbügelstation |
-
1983
- 1983-03-31 JP JP5608783A patent/JPS59181700A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59181700A (ja) | 1984-10-16 |
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