JPH0141027B2 - - Google Patents
Info
- Publication number
- JPH0141027B2 JPH0141027B2 JP11316882A JP11316882A JPH0141027B2 JP H0141027 B2 JPH0141027 B2 JP H0141027B2 JP 11316882 A JP11316882 A JP 11316882A JP 11316882 A JP11316882 A JP 11316882A JP H0141027 B2 JPH0141027 B2 JP H0141027B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- master
- master pattern
- matching
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Image Analysis (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11316882A JPS594130A (ja) | 1982-06-30 | 1982-06-30 | マスタ−パタ−ンの採取方式 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11316882A JPS594130A (ja) | 1982-06-30 | 1982-06-30 | マスタ−パタ−ンの採取方式 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS594130A JPS594130A (ja) | 1984-01-10 |
| JPH0141027B2 true JPH0141027B2 (enrdf_load_stackoverflow) | 1989-09-01 |
Family
ID=14605272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11316882A Granted JPS594130A (ja) | 1982-06-30 | 1982-06-30 | マスタ−パタ−ンの採取方式 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS594130A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0754549B2 (ja) * | 1984-09-19 | 1995-06-07 | 株式会社日立製作所 | パターンマッチング用標準パターンの作成方法 |
-
1982
- 1982-06-30 JP JP11316882A patent/JPS594130A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS594130A (ja) | 1984-01-10 |
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