JPH0140196Y2 - - Google Patents

Info

Publication number
JPH0140196Y2
JPH0140196Y2 JP17846283U JP17846283U JPH0140196Y2 JP H0140196 Y2 JPH0140196 Y2 JP H0140196Y2 JP 17846283 U JP17846283 U JP 17846283U JP 17846283 U JP17846283 U JP 17846283U JP H0140196 Y2 JPH0140196 Y2 JP H0140196Y2
Authority
JP
Japan
Prior art keywords
collet
contact
die
movable body
contact terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17846283U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6085842U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17846283U priority Critical patent/JPS6085842U/ja
Publication of JPS6085842U publication Critical patent/JPS6085842U/ja
Application granted granted Critical
Publication of JPH0140196Y2 publication Critical patent/JPH0140196Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP17846283U 1983-11-18 1983-11-18 ダイボンダ−のコレツトタツチ検出機構 Granted JPS6085842U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17846283U JPS6085842U (ja) 1983-11-18 1983-11-18 ダイボンダ−のコレツトタツチ検出機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17846283U JPS6085842U (ja) 1983-11-18 1983-11-18 ダイボンダ−のコレツトタツチ検出機構

Publications (2)

Publication Number Publication Date
JPS6085842U JPS6085842U (ja) 1985-06-13
JPH0140196Y2 true JPH0140196Y2 (cs) 1989-12-01

Family

ID=30387451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17846283U Granted JPS6085842U (ja) 1983-11-18 1983-11-18 ダイボンダ−のコレツトタツチ検出機構

Country Status (1)

Country Link
JP (1) JPS6085842U (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102399934B1 (ko) * 2018-08-06 2022-05-19 가부시키가이샤 신가와 본딩 헤드

Also Published As

Publication number Publication date
JPS6085842U (ja) 1985-06-13

Similar Documents

Publication Publication Date Title
EP0297244A3 (en) Single lead automatic clamping and bonding system
CN103207293A (zh) 探针针压校正方法及其校正设备
JPH0140196Y2 (cs)
JPH0964100A (ja) 導電性ボールの搭載装置および搭載方法
CN115043210A (zh) 一种柔性自动dbc上料防错机构
CN111360885B (zh) 一种驾驶证自助申领制证机器人的证芯正副本分离模块
CN219321327U (zh) 邦头吸嘴
JPS6021533A (ja) 回路素子の圧着方法およびその装置
JPH01199443A (ja) ワイヤボンデイング装置
JP3172268B2 (ja) ペレット突き上げ針の設定方法及びペレットボンディング装置
JP3590196B2 (ja) ペレットボンディング方法及び装置
JPS5826524Y2 (ja) ハンドウタイワイヤボンダソウチ
JP2558717B2 (ja) ワイヤボンディング装置
JP3399261B2 (ja) フリップチップのボンディング装置
JP3303684B2 (ja) 導電性ボール搭載装置及び導電性ボール搭載方法
CN218109900U (zh) 一种压合机
CN212075638U (zh) 一种电路板电性能测试机用送料装置
CN114783910B (zh) Led芯片的转移装置、芯片的装配工艺和显示屏
CN215219227U (zh) 一种plc分路器封装用芯片定位夹具
JPH06283894A (ja) 電子部品の搭載装置
JPH0124931Y2 (cs)
KR920004165Y1 (ko) 칩 본딩 장치
JP3319320B2 (ja) 導電性ボールの搭載装置および搭載方法
JPH08107124A (ja) ワイヤボンディング方法
JP2921164B2 (ja) リードのボンディング装置