JPH0140189Y2 - - Google Patents
Info
- Publication number
- JPH0140189Y2 JPH0140189Y2 JP5530583U JP5530583U JPH0140189Y2 JP H0140189 Y2 JPH0140189 Y2 JP H0140189Y2 JP 5530583 U JP5530583 U JP 5530583U JP 5530583 U JP5530583 U JP 5530583U JP H0140189 Y2 JPH0140189 Y2 JP H0140189Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- exposed
- metal foil
- capacitor
- metal foils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 239000003990 capacitor Substances 0.000 claims description 23
- 239000011888 foil Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 description 6
- 229910052715 tantalum Inorganic materials 0.000 description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000011162 core material Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5530583U JPS59159939U (ja) | 1983-04-13 | 1983-04-13 | チツプ型コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5530583U JPS59159939U (ja) | 1983-04-13 | 1983-04-13 | チツプ型コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59159939U JPS59159939U (ja) | 1984-10-26 |
| JPH0140189Y2 true JPH0140189Y2 (US07534539-20090519-C00280.png) | 1989-12-01 |
Family
ID=30185627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5530583U Granted JPS59159939U (ja) | 1983-04-13 | 1983-04-13 | チツプ型コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59159939U (US07534539-20090519-C00280.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010165957A (ja) * | 2009-01-19 | 2010-07-29 | Nichicon Corp | チップ状固体電解コンデンサ |
| JP2010278032A (ja) * | 2009-05-26 | 2010-12-09 | Nec Tokin Corp | 表面実装型コンデンサ |
-
1983
- 1983-04-13 JP JP5530583U patent/JPS59159939U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59159939U (ja) | 1984-10-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0140189Y2 (US07534539-20090519-C00280.png) | ||
| EP0196229B1 (en) | A capacitor for surface mounting | |
| JPH02184008A (ja) | ヒューズ付積層コンデンサ | |
| TWI261274B (en) | Battery cell for surface packaging | |
| JP2003309021A (ja) | 表面実装型素子 | |
| JPH06223805A (ja) | 電池一体型プリント基板及びその製造方法 | |
| JP5095107B2 (ja) | 固体電解コンデンサ | |
| JP3142011B2 (ja) | 固体電解コンデンサ | |
| JPS61166149A (ja) | 多層混成集積回路装置 | |
| JPH02146792A (ja) | 半導体装置の実装構造 | |
| JP3096055B2 (ja) | 固体電解コンデンサ | |
| JPS59197120A (ja) | 微小フイルムコンデンサ | |
| CN215991340U (zh) | 一种耐腐蚀高可靠性柔性高密度线路板 | |
| JPS5998597A (ja) | 多層プリント配線板 | |
| JPH0314035Y2 (US07534539-20090519-C00280.png) | ||
| JPH0249702Y2 (US07534539-20090519-C00280.png) | ||
| JPH08273936A (ja) | コイル部品及びコイル内蔵基板 | |
| JPH01102990A (ja) | 小形電子部品実装回路 | |
| JP2000133546A (ja) | 積層セラミックチップ部品及びその製造方法 | |
| JPH0236263Y2 (US07534539-20090519-C00280.png) | ||
| JPH0347341Y2 (US07534539-20090519-C00280.png) | ||
| CN115623687A (zh) | 电路板及其制造方法 | |
| JPS58164130U (ja) | スイツチ回路板 | |
| JPS632130B2 (US07534539-20090519-C00280.png) | ||
| JPS6297315A (ja) | 減結合コンデンサ−及びその形成方法 |
