JPH0140189Y2 - - Google Patents

Description

[Detailed explanation of the idea] Industrial applications The present invention relates to improvements in chip-type capacitors.

Conventional Technology Demand for chip-type capacitors is increasing in order to improve the packaging density of electronic components. Chip-type capacitors include tantalum capacitors and multilayer ceramic capacitors, but we will explain using tantalum capacitors as an example.

In conventional chip-type tantalum capacitors, as shown in FIGS. 1 and 2, U-shaped metal plates 2 are fixed to both ends of an insulating substrate 1, or
Using substrates 4 and 5, a through hole is provided in a part of the substrate and an H-shaped conductive layer 3 is formed using the through hole.
The cathode part 7 of the capacitor element 6 and the anode lead 8 led out from the element were electrically connected by soldering or a conductive adhesive 9. 10 is an insulating resin for protecting the element.

Problems to be solved by the invention Substrates 4 and 5 used in the conventional capacitor 10
Since the metal plate 2 is fixed to the insulating substrate 1, the thickness is large.

Means to Solve the Problems The chip-type capacitor of the present invention provides a thinner substrate for the capacitor, making it compatible with thinner capacitors, and uses metal foil as the core material, making the capacitor element thinner. To provide a chip type capacitor that can be easily bent for protection.

In the capacitor of the present invention, two metal foils are provided with their bent lines facing each other so that a space is created in the center.

These metal foils are integrated by pasting insulating films on both the front and back sides. This insulating film has an exposed portion, and the capacitor element and the terminal portion are electrically connected to the exposed portion.

Embodiment An embodiment of the present invention will be described based on the drawings. Solderable metal foils 11 and 12 are used, and one surface of these metal foils 11 and 12 has a bent line 13 in the shape of a key.
are formed, and the bent lines 13 are arranged on the same plane so as to face each other, and the metal foils 11, 1
A space 14 is provided between the two for electrical insulation.

Note that this fold line 13 is for imparting rigidity to the metal foil and improving workability when integrating the metal foils 11 and 12.

An insulating film 18 is pasted over the entire surface portions 15 of the metal foils 11, 12 arranged as shown in FIG. 3, leaving exposed portions 16, 17 where the metal foils 11, 12 are exposed at predetermined locations. Further, an insulating film 20 is bonded to the back surface portion 19 of the metal foils 11, 12 at the center of the metal foils 11, 12. The metal foils 11 and 12 are integrated by insulating films 18 and 20 attached to the front and back surfaces.

To explain the case where the capacitor is a tantalum capacitor, the element 21 is a tantalum sintered body formed with an oxide film by chemical conversion, and a cathode part 2 made of manganese dioxide, carbon, and silver paint is formed on the tantalum sintered body.
2 are formed sequentially. 23 is an anode terminal partially buried in the element 21.

The cathode part 22 of the capacitor element is electrically connected to the exposed part 16 exposed through the cutout of the insulating film 18 bonded to the surface of the metal foil 11 by soldering or with a conductive adhesive 24. The exposed portion 17 exposed through the notch of the insulating film 18 pasted on the surface of the foil 12 has the terminal portion 2 of the capacitor.
3 are electrically connected by soldering or with a conductive adhesive 24.

Effects of the invention The chip-type capacitor of the present invention has the structure described above, and is made by integrating a thin metal foil as a core material with insulating tape pasted on the front and back surfaces of the metal foil. This device is designed to be thinner than the previous one, and is flexible, so it can be easily bent, so if the L-shape processing 25 is performed, the device can be protected reliably.

[Brief explanation of drawings]

Figures 1 and 2 are cross-sectional views of a conventional capacitor, Figure 3 is a plan view of the metal foil of the present invention, Figure 4 is a plan view showing the surface portion to which an insulating film is pasted, and Figure 5 is the same. The bottom view and FIG. 6 are cross-sectional views of the device mounted on a printed circuit board. In the drawing, 11 and 12 are metal foils, 13 is a polygonal line, 14 is a space, 15 is a surface, and 16, 17
18 is the insulating film, 19 is the back side,
20 is an insulating film, 21 is an element, and 23 is a terminal.

Claims (1)

[Scope of utility model registration request] Two sheets of metal foil each having one side formed by a polygonal line are used, and these metal foils are placed on the same plane so that the polygonal lines are facing each other, and there is a space between them. Insulating film is laminated on both the front and back sides of the metal foil and integrated.
The insulating film bonded to the front and back surfaces has an exposed portion where the front and back surfaces of each metal foil are exposed.
A chip type capacitor characterized in that a capacitor element and a terminal part are electrically connected to the exposed part on the surface side.