JPH0140117B2 - - Google Patents
Info
- Publication number
- JPH0140117B2 JPH0140117B2 JP60281217A JP28121785A JPH0140117B2 JP H0140117 B2 JPH0140117 B2 JP H0140117B2 JP 60281217 A JP60281217 A JP 60281217A JP 28121785 A JP28121785 A JP 28121785A JP H0140117 B2 JPH0140117 B2 JP H0140117B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- support
- net
- plating liquid
- pass line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 109
- 239000007788 liquid Substances 0.000 claims description 39
- 238000004804 winding Methods 0.000 claims description 11
- 238000009713 electroplating Methods 0.000 claims 1
- 239000010970 precious metal Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 239000007921 spray Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60281217A JPS62139895A (ja) | 1985-12-16 | 1985-12-16 | 部分メツキ装置 |
DE8686114812T DE3683595D1 (de) | 1985-11-11 | 1986-10-24 | Vorrichtung zum selektiven metallbeschichten von steckverbinderkontaktstiften. |
EP19860114812 EP0222232B1 (en) | 1985-11-11 | 1986-10-24 | Plating device for minute portions of connector terminals |
US06/924,657 US4683045A (en) | 1985-12-16 | 1986-10-29 | Partial plating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60281217A JPS62139895A (ja) | 1985-12-16 | 1985-12-16 | 部分メツキ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62139895A JPS62139895A (ja) | 1987-06-23 |
JPH0140117B2 true JPH0140117B2 (US20020128544A1-20020912-P00008.png) | 1989-08-25 |
Family
ID=17635994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60281217A Granted JPS62139895A (ja) | 1985-11-11 | 1985-12-16 | 部分メツキ装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4683045A (US20020128544A1-20020912-P00008.png) |
JP (1) | JPS62139895A (US20020128544A1-20020912-P00008.png) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4818349A (en) * | 1988-02-01 | 1989-04-04 | Amp Incorporated | Selective plating apparatus for zone plating |
CH684840A5 (fr) * | 1991-06-11 | 1995-01-13 | Electroplating Eng Eesa | Cellule pour plaquer par voie électrolytique sélectivement des zones choisies de pièces métalliques disposées en bande. |
DE19758513C2 (de) * | 1997-02-06 | 2000-07-13 | Schempp & Decker Praezisionste | Vorrichtung zum selektiven galvanischen Beschichten von elektrischen Kontaktelementen |
CN102586826A (zh) * | 2011-01-17 | 2012-07-18 | 欣兴电子股份有限公司 | 连接器的镀金方法及其镀金装置 |
CN104313668B (zh) * | 2014-09-30 | 2017-03-15 | 苏州芯航元电子科技有限公司 | 电子产线用电化学处理槽 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4163704A (en) * | 1975-06-14 | 1979-08-07 | Electroplating Engineers Of Japan, Ltd. | Apparatus for selectively plating rectangular sheet continuously or intermittently |
-
1985
- 1985-12-16 JP JP60281217A patent/JPS62139895A/ja active Granted
-
1986
- 1986-10-29 US US06/924,657 patent/US4683045A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPS62139895A (ja) | 1987-06-23 |
US4683045A (en) | 1987-07-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE2324834B1 (de) | Vorrichtung zum kontinuierlichen selektiven Bandgalvanisieren | |
DE1621184C3 (de) | Vorrichtung zum einseitigen Galvanisieren von Metallbändern | |
CN113249770A (zh) | 一种用于柔性薄膜基材表面电镀加工的水电镀设备 | |
AU779293B2 (en) | An applicator for use in reflexotherapy | |
JPH024678B2 (US20020128544A1-20020912-P00008.png) | ||
JPH0140117B2 (US20020128544A1-20020912-P00008.png) | ||
US4030999A (en) | Stripe on strip plating apparatus | |
JPH0149795B2 (US20020128544A1-20020912-P00008.png) | ||
US3929610A (en) | Electroformation of metallic strands | |
EP0222232A1 (en) | Plating device for minute portions of connector terminals | |
US4163704A (en) | Apparatus for selectively plating rectangular sheet continuously or intermittently | |
JPH0140116B2 (US20020128544A1-20020912-P00008.png) | ||
JPH0125391B2 (US20020128544A1-20020912-P00008.png) | ||
JPH0136913Y2 (US20020128544A1-20020912-P00008.png) | ||
JPH0140114B2 (US20020128544A1-20020912-P00008.png) | ||
JPS62136586A (ja) | 部分メツキ装置 | |
EP0859071B1 (de) | Verfahren zum selektiven galvanischen Beschichten von elektrischen Kontaktelementen | |
US4416756A (en) | Electrotreating apparatus with depletable anode roll | |
JPH0734932Y2 (ja) | ラジアルセル型電解処理装置 | |
JPS61295395A (ja) | コネクタ端子のブラシメツキ方法 | |
JPS596919B2 (ja) | ロ−ルメッキ法 | |
JPH02159393A (ja) | 高速部分めっき装置 | |
JPS61127895A (ja) | 帯状体への片面メッキ方法 | |
JPS6311176Y2 (US20020128544A1-20020912-P00008.png) | ||
DE19704369C2 (de) | Verfahren zum selektiven galvanischen Beschichten von elektrischen Kontaktelementen |