JPH0140046B2 - - Google Patents
Info
- Publication number
- JPH0140046B2 JPH0140046B2 JP55142315A JP14231580A JPH0140046B2 JP H0140046 B2 JPH0140046 B2 JP H0140046B2 JP 55142315 A JP55142315 A JP 55142315A JP 14231580 A JP14231580 A JP 14231580A JP H0140046 B2 JPH0140046 B2 JP H0140046B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- general formula
- epoxy resin
- formula
- above formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14231580A JPS5765722A (en) | 1980-10-11 | 1980-10-11 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14231580A JPS5765722A (en) | 1980-10-11 | 1980-10-11 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5765722A JPS5765722A (en) | 1982-04-21 |
JPH0140046B2 true JPH0140046B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-08-24 |
Family
ID=15312488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14231580A Granted JPS5765722A (en) | 1980-10-11 | 1980-10-11 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5765722A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995035336A1 (fr) * | 1994-06-17 | 1995-12-28 | Kansai Paint Company, Limited | Composition thermodurcissable et procede de constitution d'une pellicule de finition |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56160054A (en) * | 1980-05-15 | 1981-12-09 | Toshiba Corp | Resin sealing type semiconductor device |
-
1980
- 1980-10-11 JP JP14231580A patent/JPS5765722A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5765722A (en) | 1982-04-21 |