JPH0138395B2 - - Google Patents
Info
- Publication number
- JPH0138395B2 JPH0138395B2 JP1141982A JP1141982A JPH0138395B2 JP H0138395 B2 JPH0138395 B2 JP H0138395B2 JP 1141982 A JP1141982 A JP 1141982A JP 1141982 A JP1141982 A JP 1141982A JP H0138395 B2 JPH0138395 B2 JP H0138395B2
- Authority
- JP
- Japan
- Prior art keywords
- basket
- plating
- printed circuit
- electroplating
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 53
- 238000009713 electroplating Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 19
- 239000000126 substance Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 description 36
- 239000007788 liquid Substances 0.000 description 11
- 238000012545 processing Methods 0.000 description 7
- 238000005192 partition Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1141982A JPS58128792A (ja) | 1982-01-26 | 1982-01-26 | プリント基板の一次銅メツキ方法及び装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1141982A JPS58128792A (ja) | 1982-01-26 | 1982-01-26 | プリント基板の一次銅メツキ方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58128792A JPS58128792A (ja) | 1983-08-01 |
| JPH0138395B2 true JPH0138395B2 (enrdf_load_stackoverflow) | 1989-08-14 |
Family
ID=11777531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1141982A Granted JPS58128792A (ja) | 1982-01-26 | 1982-01-26 | プリント基板の一次銅メツキ方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58128792A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02117193A (ja) * | 1988-09-30 | 1990-05-01 | Molex Inc | パッド印刷されたリモートコントローラ |
| JPH02144987A (ja) * | 1988-11-26 | 1990-06-04 | Sumitomo Metal Mining Co Ltd | プリント配線板の製造方法 |
-
1982
- 1982-01-26 JP JP1141982A patent/JPS58128792A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58128792A (ja) | 1983-08-01 |
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