JPH0138373B2 - - Google Patents

Info

Publication number
JPH0138373B2
JPH0138373B2 JP58073212A JP7321283A JPH0138373B2 JP H0138373 B2 JPH0138373 B2 JP H0138373B2 JP 58073212 A JP58073212 A JP 58073212A JP 7321283 A JP7321283 A JP 7321283A JP H0138373 B2 JPH0138373 B2 JP H0138373B2
Authority
JP
Japan
Prior art keywords
lid
welding
pair
electrode
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58073212A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59198735A (ja
Inventor
Hisashi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58073212A priority Critical patent/JPS59198735A/ja
Publication of JPS59198735A publication Critical patent/JPS59198735A/ja
Publication of JPH0138373B2 publication Critical patent/JPH0138373B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Butt Welding And Welding Of Specific Article (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP58073212A 1983-04-26 1983-04-26 シ−ム溶接法 Granted JPS59198735A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58073212A JPS59198735A (ja) 1983-04-26 1983-04-26 シ−ム溶接法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58073212A JPS59198735A (ja) 1983-04-26 1983-04-26 シ−ム溶接法

Publications (2)

Publication Number Publication Date
JPS59198735A JPS59198735A (ja) 1984-11-10
JPH0138373B2 true JPH0138373B2 (ko) 1989-08-14

Family

ID=13511622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58073212A Granted JPS59198735A (ja) 1983-04-26 1983-04-26 シ−ム溶接法

Country Status (1)

Country Link
JP (1) JPS59198735A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010201509A (ja) * 2010-06-21 2010-09-16 Akim Kk 溶接異常検出方法、シーム溶接異常検出装置、シーム溶接装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4926397B2 (ja) * 2004-12-15 2012-05-09 株式会社Ｆｔｓ シーム溶接機の溶接制御装置
JP2007075857A (ja) * 2005-09-14 2007-03-29 Nippon Dempa Kogyo Co Ltd シーム溶接機
CN113996992B (zh) * 2021-11-17 2024-04-19 新疆冶金建设(集团)有限责任公司 一种可调高度的护窗栏杆安装定位辅助工具

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5744437A (en) * 1980-09-01 1982-03-12 Toyo Seikan Kaisha Ltd Manufacture of cover capable to open easily

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5744437A (en) * 1980-09-01 1982-03-12 Toyo Seikan Kaisha Ltd Manufacture of cover capable to open easily

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010201509A (ja) * 2010-06-21 2010-09-16 Akim Kk 溶接異常検出方法、シーム溶接異常検出装置、シーム溶接装置

Also Published As

Publication number Publication date
JPS59198735A (ja) 1984-11-10

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