JPH0137830B2 - - Google Patents
Info
- Publication number
- JPH0137830B2 JPH0137830B2 JP55107679A JP10767980A JPH0137830B2 JP H0137830 B2 JPH0137830 B2 JP H0137830B2 JP 55107679 A JP55107679 A JP 55107679A JP 10767980 A JP10767980 A JP 10767980A JP H0137830 B2 JPH0137830 B2 JP H0137830B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- module
- module board
- wiring board
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Multi-Conductor Connections (AREA)
Description
【発明の詳細な説明】
本発明は、配線基板への接続を容易ならしめる
電気回路モジユールの接続方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for connecting an electric circuit module that facilitates connection to a wiring board.
従来において、第１図ａのようなモジユール基
板１を第１図ｂのように配線基板２に接続を行う
にはモジユール基板１に予め設けてあるリード端
子３を配線基板の挿入孔に挿入した後、側面電極
４とリード線３部分を半田５によつて固定する方
法が行われている。しかしながらこの方法は、第
２図に示すようにモジユール基板１に対し予めリ
ード端子３を半田付け等により設けておく必要が
あるため、工程が増加する欠点がある。また自動
化も困難であり、さらに高さの点で第２図のＨ以
下にはならないため、薄形化、小形化の要求に応
じられない等の欠点を有している。 Conventionally, in order to connect a module board 1 as shown in FIG. 1a to a wiring board 2 as shown in FIG. 1b, lead terminals 3 provided in advance on the module board 1 were inserted into insertion holes in the wiring board. After that, a method is used in which the side electrode 4 and the lead wire 3 are fixed with solder 5. However, this method has the disadvantage of increasing the number of steps because it is necessary to provide the lead terminals 3 on the module board 1 in advance by soldering or the like, as shown in FIG. Further, automation is difficult, and since the height cannot be smaller than H in FIG. 2, it has drawbacks such as not being able to meet demands for thinning and miniaturization.
本発明は以上の欠点を除去するためなされた
もので、モジユール基板に対するリード端子の取
付けを不要となしまたモジユール基板に対して新
たに枠を設けることにより配線基板への接続方法
を容易ならしめんとするものである。 The present invention has been made to eliminate the above-mentioned drawbacks, and makes it unnecessary to attach lead terminals to the module board, and also simplifies the method of connecting to the wiring board by providing a new frame for the module board. That is.
以下第３図を参照して本発明実施例を説明す
る。第３図ａ乃至ｄにおいて、６はモジユール基
板１に取付けられた電気部品、７はモジユール基
板１の周囲に設けられた鍔状枠、８はモジユール
基板１の端部側面に形成された端子電極、９は配
線基板２に設けられたモジユール基板挿入口、１
０は配線基板１のCu等からなる側面電極である。 An embodiment of the present invention will be described below with reference to FIG. In FIGS. 3a to 3d, 6 is an electrical component attached to the module board 1, 7 is a collar-shaped frame provided around the module board 1, and 8 is a terminal electrode formed on the end side surface of the module board 1. , 9 is a module board insertion slot provided in the wiring board 2, 1
0 is a side electrode made of Cu or the like of the wiring board 1.
モジユール基板１に設けられた枠７はモジユー
ル基板１を配線基板２に接続する時の固定用のも
のであり、また挿入口９に挿入する際の挿入長を
決めるためのものであり接着剤等により取付け
る。 The frame 7 provided on the module board 1 is for fixing the module board 1 when connecting it to the wiring board 2, and is also for determining the insertion length when inserting it into the insertion slot 9, and is used for adhesive, etc. Attach by.
またモジユール基板１の端部側面に設けられる
端子電極８は片面のみでも、あるいは両面でも良
い。 Further, the terminal electrode 8 provided on the end side surface of the module substrate 1 may be provided on only one side or both sides.
以上の構成において、第３図ａはモジユール基
板１を第３図ｂの配線基板２に対して、挿入口９
にモジユール基板１の端部側面を挿入し第３図ｃ
のようにモジユール基板１の枠７が配線基板２に
接する位置迄挿入する。１１はモジユール基板１
の端子電極８と配線基板２の側面電極１０とを接
続するための半田で、この半田１１によつてモジ
ユール基板１は配線基板２に固定される。第３図
ｄは半田付け後のモジユール基板の正面図を示す
ものである。 In the above configuration, FIG. 3a shows how the module board 1 is inserted into the insertion slot 9 with respect to the wiring board 2 shown in FIG. 3b.
Insert the end side of the module board 1 into the
Insert the module board 1 until the frame 7 contacts the wiring board 2 as shown in FIG. 11 is the module board 1
The module board 1 is fixed to the wiring board 2 by solder 11 for connecting the terminal electrode 8 and the side electrode 10 of the wiring board 2. FIG. 3d shows a front view of the module board after soldering.
以上説明して明らかなように本発明によれば、
モジユール基板の端子電極と配線基板の側面電極
とが直接接続されるのでリード端子は不良とな
り、リード端子取付けに要する工程が省かれるの
でコストダウンが可能となる。また精度の良い端
子電極がリード端子の代りとなり、かつモジユー
ル基板に枠を設けることによりモジユール基板の
配線基板に対する位置決めが容易となるため自動
化が可能となるばかりでなく、モジユール基板が
配線基板に斜めに取付けられる危険性が無く確実
な取付けが行なえる。さらに端子電極がリード線
代りとなることで、高さの点で低いモジユール基
板の形成が可能となるため薄形化、小形化の要求
に応じられるようになり広範囲への適用が可能と
なる。 As is clear from the above explanation, according to the present invention,
Since the terminal electrodes of the module board and the side electrodes of the wiring board are directly connected, the lead terminals become defective, and the process required for attaching the lead terminals is omitted, making it possible to reduce costs. In addition, highly accurate terminal electrodes can replace lead terminals, and by providing a frame on the module board, the positioning of the module board with respect to the wiring board becomes easy, which not only makes automation possible, but also makes it possible to position the module board diagonally to the wiring board. It can be installed reliably without the risk of being attached to the Furthermore, since the terminal electrodes can be used in place of lead wires, it is possible to form modular substrates that are low in height, making it possible to meet demands for thinning and miniaturization, and making it possible to apply them to a wide range of areas.
モジユール基板は能動素子および受動素子を含
む広範囲な電気部品からなるもので、全体が樹脂
等によりモールドされたものからなつていても良
い。 The module board is made up of a wide range of electrical components including active elements and passive elements, and may be entirely molded with resin or the like.
第１図ａ，ｂおよび第２図ａ，ｂは従来例を示
す斜視図、断面図および正面図、断面図、第３図
は本発明実施例を示すものでａ，ｂは斜視図、ｃ
は断面図、ｄは正面図である。
１……モジユール基板、２……配線基板、３…
…リード端子、５，１１……半田、６……電気部
品、７……枠、８……端子電極、９……モジユー
ル基板挿入口、４，１０……側面電極。
Fig. 1 a, b and Fig. 2 a, b are perspective views, sectional views, front views, and sectional views showing a conventional example, Fig. 3 is an embodiment of the present invention, a and b are perspective views, c
is a sectional view, and d is a front view. 1...Module board, 2...Wiring board, 3...
... Lead terminal, 5, 11 ... Solder, 6 ... Electrical component, 7 ... Frame, 8 ... Terminal electrode, 9 ... Module board insertion slot, 4, 10 ... Side electrode.
Claims (1)
を形成しかつ周囲に鍔状枠を有するモジユール基
板と、モジユール基板挿入口および側面電極を有
する配線基板とを用意し、上記配線基板のモジユ
ール基板挿入口に上記モジユール基板の端部側面
部を上記鍔状枠が配線基板に接する迄挿入するこ
とを特徴とする電気回路モジユールの接続方法。 ２ 上記モジユール基板の端子電極と上記配線基
板の側面電極とを半田付けすることを特徴とする
特許請求の範囲第１項記載の電気モジユールの接
続方法。[Scope of Claims] 1. Prepare a module board to which electrical components are attached, terminal electrodes are formed on the side surfaces of the ends, and a flange-shaped frame around the periphery, and a wiring board having a module board insertion opening and side electrodes, A method for connecting an electric circuit module, comprising inserting the end side surface of the module board into the module board insertion opening of the wiring board until the flanged frame contacts the wiring board. 2. A method for connecting an electrical module according to claim 1, characterized in that the terminal electrodes of the module board and the side electrodes of the wiring board are soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10767980A JPS5732579A (en) | 1980-08-07 | 1980-08-07 | Method of connecting electric circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10767980A JPS5732579A (en) | 1980-08-07 | 1980-08-07 | Method of connecting electric circuit module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5732579A JPS5732579A (en) | 1982-02-22 |
| JPH0137830B2 true JPH0137830B2 (en) | 1989-08-09 |
Family
ID=14465221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10767980A Granted JPS5732579A (en) | 1980-08-07 | 1980-08-07 | Method of connecting electric circuit module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5732579A (en) |
-
1980
- 1980-08-07 JP JP10767980A patent/JPS5732579A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5732579A (en) | 1982-02-22 |
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