JPH0136582Y2 - - Google Patents

Info

Publication number
JPH0136582Y2
JPH0136582Y2 JP1983027636U JP2763683U JPH0136582Y2 JP H0136582 Y2 JPH0136582 Y2 JP H0136582Y2 JP 1983027636 U JP1983027636 U JP 1983027636U JP 2763683 U JP2763683 U JP 2763683U JP H0136582 Y2 JPH0136582 Y2 JP H0136582Y2
Authority
JP
Japan
Prior art keywords
mold
chase
block
recesses
upper mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983027636U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59134509U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2763683U priority Critical patent/JPS59134509U/ja
Publication of JPS59134509U publication Critical patent/JPS59134509U/ja
Application granted granted Critical
Publication of JPH0136582Y2 publication Critical patent/JPH0136582Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2763683U 1983-02-25 1983-02-25 半導体装置用モールド金型 Granted JPS59134509U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2763683U JPS59134509U (ja) 1983-02-25 1983-02-25 半導体装置用モールド金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2763683U JPS59134509U (ja) 1983-02-25 1983-02-25 半導体装置用モールド金型

Publications (2)

Publication Number Publication Date
JPS59134509U JPS59134509U (ja) 1984-09-08
JPH0136582Y2 true JPH0136582Y2 (pm) 1989-11-07

Family

ID=30158512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2763683U Granted JPS59134509U (ja) 1983-02-25 1983-02-25 半導体装置用モールド金型

Country Status (1)

Country Link
JP (1) JPS59134509U (pm)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2802272B2 (ja) * 1986-05-17 1998-09-24 トーワ株式会社 多品種少量生産に適した半導体装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5431064U (pm) * 1977-08-03 1979-03-01
JPS59129512U (ja) * 1983-02-19 1984-08-31 ロ−ム株式会社 モ−ルド金型

Also Published As

Publication number Publication date
JPS59134509U (ja) 1984-09-08

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