JPH0135498B2 - - Google Patents

Info

Publication number
JPH0135498B2
JPH0135498B2 JP57012123A JP1212382A JPH0135498B2 JP H0135498 B2 JPH0135498 B2 JP H0135498B2 JP 57012123 A JP57012123 A JP 57012123A JP 1212382 A JP1212382 A JP 1212382A JP H0135498 B2 JPH0135498 B2 JP H0135498B2
Authority
JP
Japan
Prior art keywords
solder
lead member
piece
lead
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57012123A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58128748A (ja
Inventor
Shigemi Ono
Susumu Akyama
Shigeo Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP57012123A priority Critical patent/JPS58128748A/ja
Publication of JPS58128748A publication Critical patent/JPS58128748A/ja
Publication of JPH0135498B2 publication Critical patent/JPH0135498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5449—
    • H10W72/5475—
    • H10W72/5525—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP57012123A 1982-01-28 1982-01-28 半導体素子のリ−ド部材の接続方法 Granted JPS58128748A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57012123A JPS58128748A (ja) 1982-01-28 1982-01-28 半導体素子のリ−ド部材の接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57012123A JPS58128748A (ja) 1982-01-28 1982-01-28 半導体素子のリ−ド部材の接続方法

Publications (2)

Publication Number Publication Date
JPS58128748A JPS58128748A (ja) 1983-08-01
JPH0135498B2 true JPH0135498B2 (en:Method) 1989-07-25

Family

ID=11796757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57012123A Granted JPS58128748A (ja) 1982-01-28 1982-01-28 半導体素子のリ−ド部材の接続方法

Country Status (1)

Country Link
JP (1) JPS58128748A (en:Method)

Also Published As

Publication number Publication date
JPS58128748A (ja) 1983-08-01

Similar Documents

Publication Publication Date Title
US6164523A (en) Electronic component and method of manufacture
CN1312748C (zh) 制造半导体集成电路器件的方法
US20080087996A1 (en) Semiconductor device and manufacturing method of the same
JP2008227131A (ja) 半導体装置及びその製造方法
CN1041065A (zh) 功率器件的自对准电报
US12394769B2 (en) Batch soldering of different elements in power module
KR100343150B1 (ko) 금속터미널을구비하는전력반도체모쥴,전력반도체모쥴의금속터미널제조방법및전력반도체모쥴의제조방법
JP2005129886A (ja) 半導体装置およびその製造方法
JP4557804B2 (ja) 半導体装置及びその製造方法
JP2009147123A (ja) 半導体装置及びその製造方法
JP2002076254A (ja) パワー半導体モジュール及びその製造方法
JPH0135498B2 (en:Method)
JP3446829B2 (ja) 半導体装置
JPH0136702B2 (en:Method)
JPS5842764A (ja) メツキ方法
JP2008270846A (ja) 半導体装置の製造方法
JPS5927537A (ja) 半導体装置
JP2538394B2 (ja) 半導体装置の製造方法
JPH0149021B2 (en:Method)
JPS6225899Y2 (en:Method)
JPS58161355A (ja) 半導体整流素子
JPS624331A (ja) ワイヤボンデイング方法
JPH05145004A (ja) 半導体装置の製造方法
JPS6244545Y2 (en:Method)
JPS63318744A (ja) 半導体装置