JPH0134712B2 - - Google Patents

Info

Publication number
JPH0134712B2
JPH0134712B2 JP58027077A JP2707783A JPH0134712B2 JP H0134712 B2 JPH0134712 B2 JP H0134712B2 JP 58027077 A JP58027077 A JP 58027077A JP 2707783 A JP2707783 A JP 2707783A JP H0134712 B2 JPH0134712 B2 JP H0134712B2
Authority
JP
Japan
Prior art keywords
jet
solder
printed circuit
circuit board
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58027077A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59153570A (ja
Inventor
Kenji Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP2707783A priority Critical patent/JPS59153570A/ja
Publication of JPS59153570A publication Critical patent/JPS59153570A/ja
Publication of JPH0134712B2 publication Critical patent/JPH0134712B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0653Solder baths with wave generating means, e.g. nozzles, jets, fountains

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2707783A 1983-02-22 1983-02-22 はんだ槽 Granted JPS59153570A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2707783A JPS59153570A (ja) 1983-02-22 1983-02-22 はんだ槽

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2707783A JPS59153570A (ja) 1983-02-22 1983-02-22 はんだ槽

Publications (2)

Publication Number Publication Date
JPS59153570A JPS59153570A (ja) 1984-09-01
JPH0134712B2 true JPH0134712B2 (ko) 1989-07-20

Family

ID=12211004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2707783A Granted JPS59153570A (ja) 1983-02-22 1983-02-22 はんだ槽

Country Status (1)

Country Link
JP (1) JPS59153570A (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2549618B2 (ja) * 1985-05-18 1996-10-30 株式会社東芝 噴流式半田付け装置
JPS63248566A (ja) * 1987-04-03 1988-10-14 Kenji Kondo プリント基板のはんだ付け方法およびその装置
JPH01266793A (ja) * 1988-04-19 1989-10-24 Kenji Kondo プリント基板のはんだ付け方法およびその装置
US5148961A (en) * 1991-12-23 1992-09-22 Motorola, Inc. Selective wave solder apparatus
CN108650806B (zh) * 2018-05-04 2020-12-01 义乌市倩飞科技有限公司 一种小型电路板回流焊设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4517151Y1 (ko) * 1969-07-15 1970-07-15
JPS575396A (en) * 1980-06-12 1982-01-12 Tokyo Shibaura Electric Co Soldering method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4517151Y1 (ko) * 1969-07-15 1970-07-15
JPS575396A (en) * 1980-06-12 1982-01-12 Tokyo Shibaura Electric Co Soldering method

Also Published As

Publication number Publication date
JPS59153570A (ja) 1984-09-01

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