JPH0134390Y2 - - Google Patents
Info
- Publication number
- JPH0134390Y2 JPH0134390Y2 JP1982049028U JP4902882U JPH0134390Y2 JP H0134390 Y2 JPH0134390 Y2 JP H0134390Y2 JP 1982049028 U JP1982049028 U JP 1982049028U JP 4902882 U JP4902882 U JP 4902882U JP H0134390 Y2 JPH0134390 Y2 JP H0134390Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- case
- circuit board
- hole
- screw hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 10
- 238000013459 approach Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982049028U JPS58150885U (ja) | 1982-04-05 | 1982-04-05 | 電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982049028U JPS58150885U (ja) | 1982-04-05 | 1982-04-05 | 電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58150885U JPS58150885U (ja) | 1983-10-08 |
| JPH0134390Y2 true JPH0134390Y2 (enEXAMPLES) | 1989-10-19 |
Family
ID=30059920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982049028U Granted JPS58150885U (ja) | 1982-04-05 | 1982-04-05 | 電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58150885U (enEXAMPLES) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018037568A (ja) * | 2016-09-01 | 2018-03-08 | Ｋｙｂ株式会社 | 電子装置 |
-
1982
- 1982-04-05 JP JP1982049028U patent/JPS58150885U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58150885U (ja) | 1983-10-08 |
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