JPH0133938B2 - - Google Patents

Info

Publication number
JPH0133938B2
JPH0133938B2 JP55143806A JP14380680A JPH0133938B2 JP H0133938 B2 JPH0133938 B2 JP H0133938B2 JP 55143806 A JP55143806 A JP 55143806A JP 14380680 A JP14380680 A JP 14380680A JP H0133938 B2 JPH0133938 B2 JP H0133938B2
Authority
JP
Japan
Prior art keywords
bonding
stage
die
temperature
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55143806A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5768041A (en
Inventor
Kunihiko Hayashi
Haruo Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14380680A priority Critical patent/JPS5768041A/ja
Publication of JPS5768041A publication Critical patent/JPS5768041A/ja
Publication of JPH0133938B2 publication Critical patent/JPH0133938B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP14380680A 1980-10-15 1980-10-15 Die bonding method Granted JPS5768041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14380680A JPS5768041A (en) 1980-10-15 1980-10-15 Die bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14380680A JPS5768041A (en) 1980-10-15 1980-10-15 Die bonding method

Publications (2)

Publication Number Publication Date
JPS5768041A JPS5768041A (en) 1982-04-26
JPH0133938B2 true JPH0133938B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-07-17

Family

ID=15347404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14380680A Granted JPS5768041A (en) 1980-10-15 1980-10-15 Die bonding method

Country Status (1)

Country Link
JP (1) JPS5768041A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727624Y2 (ja) * 1988-02-12 1995-06-21 九州日本電気株式会社 加熱治具
JP3164283B2 (ja) * 1992-02-29 2001-05-08 芝浦メカトロニクス株式会社 リードフレームの加熱方法および装置
US6107606A (en) * 1998-01-05 2000-08-22 Texas Instruments Incorporated Method and apparatus for measuring temperatures during electronic package assembly

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105336A (en) * 1979-02-07 1980-08-12 Nec Corp Die-bonding apparatus for semiconductor

Also Published As

Publication number Publication date
JPS5768041A (en) 1982-04-26

Similar Documents

Publication Publication Date Title
US6214718B1 (en) Semiconductor assembling method and apparatus
JPH0133938B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
US20100025453A1 (en) Method and device for controlling the generation of ultrasonic wire bonds
JPS6096378A (ja) フラツシユバツト溶接法
KR930001264B1 (ko) 와이어 본딩방법 및 그 장치
JP2003273152A (ja) ボンドワイヤ結合の生成と品質検査のための方法並びに装置
JPH0424198B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH04133442A (ja) ワイヤボンディング装置
JPH0275489A (ja) 焦点距離自動調整装置
JP2001038809A (ja) 自動溶着装置
JP3324468B2 (ja) ワークの熱圧着装置および熱圧着方法
JP3178518B2 (ja) リードフレームの加熱装置
JPH04106942A (ja) 半導体装置の製造方法
JPS5826524Y2 (ja) ハンドウタイワイヤボンダソウチ
JP3164283B2 (ja) リードフレームの加熱方法および装置
JP3280890B2 (ja) パルスヒート式接合装置およびその制御方法
JPH01161727A (ja) ワイヤーボンデイング装置
JPS6256658B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH03171640A (ja) 半導体チップの接合装置
JPS6040955B2 (ja) スポツト溶接監視装置
JPS63283140A (ja) ワイヤボンディング装置
JPS5491176A (en) Temperature monitoring method of semiconductor element bonder unit
JPH02179376A (ja) レーザ加工装置
JPH0414843A (ja) ボンディング装置
JPH02241671A (ja) 半田付け装置