JPH0132795Y2 - - Google Patents

Info

Publication number

JPH0132795Y2

JPH0132795Y2 JP15198284U JP15198284U JPH0132795Y2 JP H0132795 Y2 JPH0132795 Y2 JP H0132795Y2 JP 15198284 U JP15198284 U JP 15198284U JP 15198284 U JP15198284 U JP 15198284U JP H0132795 Y2 JPH0132795 Y2 JP H0132795Y2

Authority

JP

Japan

Prior art keywords

grounding

conductive

peeling

shielding plate

electromagnetic shielding

Prior art date

1984-10-08

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000000758 substrate Substances 0.000 claims description 17
• 239000010410 layer Substances 0.000 description 17
• 229920003002 synthetic resin Polymers 0.000 description 5
• 239000000057 synthetic resin Substances 0.000 description 5
• 238000009413 insulation Methods 0.000 description 3
• 239000003973 paint Substances 0.000 description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 239000004593 Epoxy Substances 0.000 description 2
• YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
• 229910052782 aluminium Inorganic materials 0.000 description 2
• 238000010586 diagram Methods 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 239000011737 fluorine Substances 0.000 description 2
• 229910052731 fluorine Inorganic materials 0.000 description 2
• 230000007257 malfunction Effects 0.000 description 2
• 229920000728 polyester Polymers 0.000 description 2
• 239000012790 adhesive layer Substances 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 235000012489 doughnuts Nutrition 0.000 description 1
• 239000011888 foil Substances 0.000 description 1
• 238000009434 installation Methods 0.000 description 1
• 229910052742 iron Inorganic materials 0.000 description 1
• 239000002245 particle Substances 0.000 description 1
• 229920001296 polysiloxane Polymers 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1
• 239000011347 resin Substances 0.000 description 1