JPH0132654B2 - - Google Patents
Info
- Publication number
- JPH0132654B2 JPH0132654B2 JP56188839A JP18883981A JPH0132654B2 JP H0132654 B2 JPH0132654 B2 JP H0132654B2 JP 56188839 A JP56188839 A JP 56188839A JP 18883981 A JP18883981 A JP 18883981A JP H0132654 B2 JPH0132654 B2 JP H0132654B2
- Authority
- JP
- Japan
- Prior art keywords
- feed
- rod
- guide path
- feed rod
- drive mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P72/3202—
-
- H10P72/3212—
-
- H10W95/00—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Reciprocating Conveyors (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56188839A JPS5890732A (ja) | 1981-11-25 | 1981-11-25 | 搬送装置 |
| US06/426,754 US4516673A (en) | 1981-11-25 | 1982-09-29 | Apparatus for conveying a lead frame mounting semiconductor pellets |
| GB08228642A GB2111453B (en) | 1981-11-25 | 1982-10-07 | Apparatus for conveying a lead frame mounting semiconductor pellets |
| DE19823237617 DE3237617A1 (de) | 1981-11-25 | 1982-10-11 | Vorrichtung zur foerderung einer eine anzahl von halbleiterpellets tragenden leiterplatte |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56188839A JPS5890732A (ja) | 1981-11-25 | 1981-11-25 | 搬送装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5890732A JPS5890732A (ja) | 1983-05-30 |
| JPH0132654B2 true JPH0132654B2 (OSRAM) | 1989-07-10 |
Family
ID=16230737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56188839A Granted JPS5890732A (ja) | 1981-11-25 | 1981-11-25 | 搬送装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4516673A (OSRAM) |
| JP (1) | JPS5890732A (OSRAM) |
| DE (1) | DE3237617A1 (OSRAM) |
| GB (1) | GB2111453B (OSRAM) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4624358A (en) * | 1983-03-07 | 1986-11-25 | Tokyo Shibaura Denki Kabushiki Kaisha | Device for transferring lead frame |
| US4747479A (en) * | 1985-07-19 | 1988-05-31 | Jakob Herrman | Device for the testing and/or processing of small component parts |
| DE3703920A1 (de) * | 1987-02-09 | 1988-09-01 | Krupp Gmbh | Transfersystem |
| IT1204967B (it) * | 1987-03-30 | 1989-03-10 | Mario Scavino | Dispositivo ad assi ortogonali,con motori lineari per il posizionamento e lavorazione di pezzi,in particolare per la microsaldatura di fili su composnenti elettronici |
| JPH0646645B2 (ja) * | 1988-08-25 | 1994-06-15 | 株式会社東芝 | リードフレーム搬送装置 |
| US5264002A (en) * | 1990-04-23 | 1993-11-23 | Mitsubishi Danki Kabushiki Kaisha | Method for conveying semiconductor lead frame strip with an apparatus having vertically movable guide rails |
| JPH0770550B2 (ja) * | 1990-04-23 | 1995-07-31 | 三菱電機株式会社 | 半導体フレームの搬送装置および搬送方法 |
| US5113565A (en) * | 1990-07-06 | 1992-05-19 | International Business Machines Corp. | Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames |
| NL9001999A (nl) * | 1990-09-11 | 1992-04-01 | Asm Fico Tooling | Stelsel van bewerkingsinrichtingen. |
| US5538125A (en) * | 1990-11-05 | 1996-07-23 | Mcneil-Ppc, Inc. | Indexing and feeding systems for apparatus for gelatin coating tablets |
| US5173338A (en) * | 1991-04-04 | 1992-12-22 | Ak Technology, Inc. | Lead frame workholder and transport apparatus and method |
| US5339939A (en) * | 1992-08-31 | 1994-08-23 | Cna Manufacturing Systems, Inc. | Pocket tape feeder system |
| US5813590A (en) | 1995-12-18 | 1998-09-29 | Micron Technology, Inc. | Extended travel wire bonding machine |
| US6405430B1 (en) * | 1996-02-07 | 2002-06-18 | Micron Technology, Inc. | Workpiece moving methods |
| NL1003997C2 (nl) * | 1996-09-10 | 1998-03-16 | Ps Systems B V | Pers voor het bewerken van voorwerpen van micro-elektronica. |
| JP4046391B2 (ja) * | 1997-11-28 | 2008-02-13 | 松下電器産業株式会社 | プリント基板の搬送装置および搬送方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2001520A (en) * | 1932-12-01 | 1935-05-14 | Lucy F Pratt | Printing machine |
| US2817515A (en) * | 1956-01-20 | 1957-12-24 | Teletype Corp | Tape feeder |
| US3466514A (en) * | 1967-06-26 | 1969-09-09 | Ibm | Method and apparatus for positioning objects in preselected orientations |
| US3581375A (en) * | 1969-03-07 | 1971-06-01 | Ibm | Method and apparatus for manufacturing integrated circuits |
| US3961413A (en) * | 1973-01-02 | 1976-06-08 | Texas Instruments Incorporated | Method and apparatus for the assembly of semiconductor devices |
| US3958682A (en) * | 1973-11-05 | 1976-05-25 | Martin Paul S | Coordination of robot and conveyor |
| US4103718A (en) * | 1977-10-06 | 1978-08-01 | Honeywell Information Systems Inc. | Apparatus for cutting and forming flexible beam leads of an integrated circuit chip |
| JPS5588351A (en) * | 1978-12-27 | 1980-07-04 | Hitachi Ltd | Conveying method and device for lead frame |
| JPS55154740A (en) * | 1979-05-23 | 1980-12-02 | Hitachi Ltd | Wire bonding device |
-
1981
- 1981-11-25 JP JP56188839A patent/JPS5890732A/ja active Granted
-
1982
- 1982-09-29 US US06/426,754 patent/US4516673A/en not_active Expired - Fee Related
- 1982-10-07 GB GB08228642A patent/GB2111453B/en not_active Expired
- 1982-10-11 DE DE19823237617 patent/DE3237617A1/de not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5890732A (ja) | 1983-05-30 |
| DE3237617A1 (de) | 1983-06-01 |
| GB2111453B (en) | 1985-08-21 |
| GB2111453A (en) | 1983-07-06 |
| US4516673A (en) | 1985-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0132654B2 (OSRAM) | ||
| US3813022A (en) | Wire bonder apparatus | |
| EP0162115B1 (en) | Method of mounting elements | |
| JPS61279490A (ja) | ロボツトハンドのコンプライアンス装置 | |
| JPH0258842A (ja) | リードフレーム搬送装置 | |
| DE69007708T2 (de) | Drahtverbindungsapparat. | |
| US5048816A (en) | Workpiece registration system and method for determining the position of a sheet | |
| US5210933A (en) | Circuit assembly robot | |
| US3783488A (en) | Film mounted electronic component insertion machine | |
| JPH0252500A (ja) | ラジアルテーピング電子部品の供給装置 | |
| JPS6311756Y2 (OSRAM) | ||
| US3492713A (en) | Apparatus and method for forming and positioning | |
| US5951283A (en) | Substrate transporting device | |
| US2778232A (en) | Precision carriage displacement device | |
| JPS62264694A (ja) | 多極電子部品の曲つたリ−ド線を整列させる方法および装置 | |
| JPH0694092B2 (ja) | フープフレームの搬送および位置決め機構 | |
| JP2853059B2 (ja) | プリント基板の位置規正装置 | |
| JPS61160999A (ja) | 部品実装方法 | |
| JP2800950B2 (ja) | 半導体部品製造用短冊状リードフレームの間欠移送装置 | |
| JPH0546269Y2 (OSRAM) | ||
| JP3024209B2 (ja) | 部品供給装置 | |
| JPS59163897A (ja) | テ−ピングされた部品の送り機構 | |
| JPS59231827A (ja) | ワイヤボンデイング装置 | |
| JPH0314246A (ja) | ワイヤボンディング位置決め機構 | |
| JPH0560258B2 (OSRAM) |