JPH0132374Y2 - - Google Patents
Info
- Publication number
- JPH0132374Y2 JPH0132374Y2 JP1984195064U JP19506484U JPH0132374Y2 JP H0132374 Y2 JPH0132374 Y2 JP H0132374Y2 JP 1984195064 U JP1984195064 U JP 1984195064U JP 19506484 U JP19506484 U JP 19506484U JP H0132374 Y2 JPH0132374 Y2 JP H0132374Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- board
- multilayer printed
- interior
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 239000011889 copper foil Substances 0.000 description 12
- 238000011179 visual inspection Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984195064U JPH0132374Y2 (US20100223739A1-20100909-C00005.png) | 1984-12-22 | 1984-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984195064U JPH0132374Y2 (US20100223739A1-20100909-C00005.png) | 1984-12-22 | 1984-12-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61109169U JPS61109169U (US20100223739A1-20100909-C00005.png) | 1986-07-10 |
| JPH0132374Y2 true JPH0132374Y2 (US20100223739A1-20100909-C00005.png) | 1989-10-03 |
Family
ID=30752554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984195064U Expired JPH0132374Y2 (US20100223739A1-20100909-C00005.png) | 1984-12-22 | 1984-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0132374Y2 (US20100223739A1-20100909-C00005.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333898A (ja) * | 1986-07-28 | 1988-02-13 | 新神戸電機株式会社 | 電磁シ−ルド両面印刷回路板の製造法 |
-
1984
- 1984-12-22 JP JP1984195064U patent/JPH0132374Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61109169U (US20100223739A1-20100909-C00005.png) | 1986-07-10 |
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