JPH01319640A - Oxygen-free copper base alloy and rolled copper foil for flexible printed circuit board - Google Patents
Oxygen-free copper base alloy and rolled copper foil for flexible printed circuit boardInfo
- Publication number
- JPH01319640A JPH01319640A JP15205888A JP15205888A JPH01319640A JP H01319640 A JPH01319640 A JP H01319640A JP 15205888 A JP15205888 A JP 15205888A JP 15205888 A JP15205888 A JP 15205888A JP H01319640 A JPH01319640 A JP H01319640A
- Authority
- JP
- Japan
- Prior art keywords
- oxygen
- printed circuit
- flexible printed
- free copper
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 89
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 52
- 239000010949 copper Substances 0.000 title claims abstract description 52
- 239000011889 copper foil Substances 0.000 title claims description 37
- 239000000956 alloy Substances 0.000 title claims description 35
- 229910045601 alloy Inorganic materials 0.000 title claims description 35
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 10
- 239000012535 impurity Substances 0.000 claims abstract description 9
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 9
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 7
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 7
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 6
- 238000005452 bending Methods 0.000 claims description 22
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 2
- 238000000137 annealing Methods 0.000 abstract description 6
- 229910052725 zinc Inorganic materials 0.000 abstract description 4
- 238000005097 cold rolling Methods 0.000 abstract description 3
- 238000005096 rolling process Methods 0.000 abstract description 3
- 238000005098 hot rolling Methods 0.000 abstract description 2
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 5
- 239000011888 foil Substances 0.000 abstract 4
- 238000010348 incorporation Methods 0.000 abstract 2
- 239000000155 melt Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000005482 strain hardening Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、低温軟化性と耐折疲労強度に優れる無酸素銅
ベース合金およびそれを用いたフレキシブルプリン［一
基板用圧延銅箔に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an oxygen-free copper base alloy having excellent low-temperature softening properties and bending fatigue strength, and a flexible print using the same (rolled copper foil for one substrate).
〈従来の技術〉
各種のフレキシブルプリント基板かその可撓性を生かし
て各種のプリンター、ハードディスクドライブ等に用い
られている。<Prior Art> Various types of flexible printed circuit boards are used in various printers, hard disk drives, etc. by taking advantage of their flexibility.
このようなフレキシブルプリント基板の導体には、通常
、銅箔が用いられることが多い。Copper foil is often used as the conductor of such flexible printed circuit boards.
ところでフレキシブルプリント基板の導体に用いられる
銅箔は、絶縁樹脂を張り合せる工程では作業の容易性か
ら硬質材であることか要求され、一方、最終的にフレキ
シブルプリント基板として使用される際には柔軟性の向
上のため軟質オΔであることか要求される。By the way, the copper foil used for the conductor of flexible printed circuit boards is required to be a hard material for ease of work in the process of laminating insulating resin, but on the other hand, when it is finally used as a flexible printed circuit board, it is required to be a hard material. In order to improve the properties, it is required to have a soft diameter.
このため、銅箔の材料としては、絶縁樹脂を硬化する温
度（約１３０℃）て銅箔か軟化するような銅材料か用い
られている。For this reason, a copper material that softens at the temperature at which the insulating resin is cured (approximately 130° C.) is used as the material for the copper foil.
具体的には、酸素を数百ｐｐｍ含んたタフピッチ銅、ま
たは無酸素銅にＴ１等を添加して軟化温度をタフピッチ
銅よりも低くした無酸素銅ベース合金かフレキシブルプ
リント基板用銅箔の材料として用いられている。Specifically, tough pitch copper containing several hundred ppm of oxygen, oxygen-free copper base alloy made by adding T1, etc. to oxygen-free copper to have a softening temperature lower than that of tough pitch copper, or as a material for copper foil for flexible printed circuit boards. It is used.
〈発明か解決しようとする課題〉
ところか近年、例えば大型コンピューターのハードディ
スクドライブ用のフレキシブルプリント基板のように、
従来のものに比へて非猟に高い耐折疲労強度かフレキシ
ブルプリント基板、特にフレキシブルプリント基板の導
体に要求される場合か多くなっている。<Invention or problem to be solved> In recent years, for example, flexible printed circuit boards for hard disk drives of large computers,
Flexible printed circuit boards, especially conductors of flexible printed circuit boards, are increasingly required to have significantly higher bending fatigue strength than conventional ones.
木質的に、無酸素銅箔はタフピッチ銅箔に比べて耐折強
度の点て優れるものである。 しかし軟化温度かタフピ
ッチ銅箔のそれに比へて約３０〜４０℃高いという欠点
を有する。 これに対し前述したＴｉ等を添加した無酸
素銅箔は軟化温度は非常に低くはなる。 しかし、耐折
強度の点てはタフピッチ銅箔よりは優れるものの、無添
加の無酸素銅箔より劣り、無酸素銅箔本来の耐折強度か
損なわれている。In terms of wood quality, oxygen-free copper foil has superior bending strength compared to tough pitch copper foil. However, it has the disadvantage that the softening temperature is about 30 to 40°C higher than that of tough pitch copper foil. On the other hand, the softening temperature of the oxygen-free copper foil to which Ti or the like is added is very low. However, although it is superior to tough pitch copper foil in terms of folding strength, it is inferior to additive-free oxygen-free copper foil, and the inherent folding strength of oxygen-free copper foil is impaired.
そのため、低温軟化性と、高耐折強度との両方の特性を
兼有１ノだフレキシブルプリント基板用銅箔オΔ料、お
よびそれを用いたフレキシブルプリント基板用銅箔の開
発か望まれている。Therefore, it is desired to develop a copper foil material for flexible printed circuit boards that has both low-temperature softening properties and high bending strength, and a copper foil for flexible printed circuit boards using the same. .
本発明の目的は、前記従来技術の問題点を解決すること
にあり、軟化温度か低く、かつ耐折疲労強度に借れ、大
型コンヒユーターのハードディスクドライブ用のフレキ
シブルプリント基板用銅箔等にも好適に用いることので
きる無酸素銅ベース合金および、それを用いたフレキシ
ブルプリント基板用圧延銅箔を提供することにある。An object of the present invention is to solve the above-mentioned problems of the prior art.It has a low softening temperature and high bending fatigue strength, and is suitable for use as a copper foil for flexible printed circuit boards for hard disk drives of large computers. An object of the present invention is to provide an oxygen-free copper-based alloy that can be used for, and a rolled copper foil for flexible printed circuit boards using the same.
〈課題を解決するための手段〉
前記の問題点を解決するために、本発明の無酸素銅ベー
ス合金はＮｂ、Ｔｉ、Ｚｒ、ＶおよびＴａの内の一種以
上を金側て０００１〜００５重量％、Ｚｎを０．００２
〜０．０４重量％含有し、かつ酸素等の不可避的不純物
の含有量が０．００５重二重量下であることを特徴とす
る無酸素銅ベース合金である。<Means for Solving the Problems> In order to solve the above-mentioned problems, the oxygen-free copper base alloy of the present invention contains one or more of Nb, Ti, Zr, V and Ta on the gold side and has a weight of 0001 to 005. %, Zn 0.002
It is an oxygen-free copper-based alloy characterized by containing ~0.04% by weight and the content of inevitable impurities such as oxygen being 0.005% by weight or less.
また、本発明のフレキシブルプリント基板用圧延銅箔は
、前記の無酸素銅ベース合金を用い、厚みが０．１ｍｍ
以下であることを特徴とするフレキシブルプリント基板
用圧延銅箔である。Further, the rolled copper foil for flexible printed circuit boards of the present invention uses the above-mentioned oxygen-free copper base alloy and has a thickness of 0.1 mm.
This is a rolled copper foil for a flexible printed circuit board characterized by the following characteristics.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明の無酸素銅ベース合金は、基本的に無酸素銅と、
合計でｏ、ｏｏｉ〜００５重量％のＮ ｂ、Ｔ１、Ｚｒ
、ＶおよびＴａの内の一種以上と、０．００２〜００４
重量％のＺｎの組成からなり、酸素等の不可避的不純物
の含有量は０．００５重量％以下である。The oxygen-free copper-based alloy of the present invention basically comprises oxygen-free copper and
Nb, T1, Zr in a total of o, ooi ~ 005% by weight
, one or more of V and Ta, and 0.002 to 004
The composition consists of % by weight of Zn, and the content of inevitable impurities such as oxygen is 0.005% by weight or less.
本発明の無酸素銅ベース合金はＮ ｌ）、Ｔ１、Ｚｒ、
■およびＴａの内の一種以上を含有するものである。
合金中これらのものを含有することにより、合金の軟化
温度を低くすることかてき、低温軟化性、耐折強度等の
優れる無酸素銅ベース合金を実現することかできる。The oxygen-free copper-based alloy of the present invention contains Nl), T1, Zr,
(2) Contains one or more of Ta and Ta.
By including these substances in the alloy, the softening temperature of the alloy can be lowered, and an oxygen-free copper-based alloy with excellent low-temperature softening properties, bending strength, etc. can be realized.
本発明の無酸素銅ベース合金において、Ｎｂ、Ｔｉ、Ｚ
ｒ、■およびＴａの内の一種以上の含有量は、合計で０
００１〜００５重量％である。 これらの元素の含有
量か０００１重量％未満ては本発明の効果かなく、軟化
点の低下か見られず、００５重重景を超えると、軟化温
度をタフピッチ銅なみに低下させることかできないから
である。In the oxygen-free copper-based alloy of the present invention, Nb, Ti, Z
The content of one or more of r, ■ and Ta is 0 in total.
001 to 005% by weight. If the content of these elements is less than 0001% by weight, the present invention has no effect and the softening point is not lowered, and if it exceeds 005% by weight, the softening temperature cannot be lowered to the same level as tough pitch copper. be.
本発明の無酸素銅ベース合金は、前記のＮｂ、Ｔｉ、Ｚ
ｒ、ＶおよびＴａの内の一種以上に加えて、さらにＺｎ
を含有するものである。 合金中にＺｎを含有すること
により、耐折疲労強度の高い無酸素銅ベース合金を実現
することかてぎる。The oxygen-free copper base alloy of the present invention has the above-mentioned Nb, Ti, Z
In addition to one or more of r, V and Ta, Zn
It contains. By containing Zn in the alloy, it is possible to realize an oxygen-free copper-based alloy with high bending fatigue strength.
本発明の無酸素銅ベース合金おいて、Ｚｎの含有量は０
００２〜００４重量％である。In the oxygen-free copper base alloy of the present invention, the Zn content is 0.
002 to 004% by weight.
Ｚｎの含有量か０００２重量％未満では本発明の効果か
なく、００４重量％を超えると軟化温度か上昇し、低温
軟化性か得られないからである。This is because if the Zn content is less than 0.002% by weight, the present invention will not be effective, and if it exceeds 0.004% by weight, the softening temperature will rise and low-temperature softening properties will not be obtained.
また、本発明の無酸素銅ベース合金においては、酸素等
の不可避的不純物の含有量は０００５重量％以下である
。 不可避的不純物、特に酸素の含有量か０．００５重
量％を超えるとＮｂ、Ｚｎ等の添加とあいまって銅の純
度か低下し、無酸素銅のタフピッチ銅に対する特徴であ
る耐折強度か劣化するからである。Further, in the oxygen-free copper base alloy of the present invention, the content of inevitable impurities such as oxygen is 0.005% by weight or less. When the content of unavoidable impurities, especially oxygen, exceeds 0.005% by weight, the purity of copper decreases due to the addition of Nb, Zn, etc., and the bending strength, which is a characteristic of oxygen-free copper compared to tough pitch copper, deteriorates. It is from.
続いて、本発明の無酸素銅ベース合金の製造方法の一例
を述へる。Next, an example of the method for manufacturing the oxygen-free copper base alloy of the present invention will be described.
本発明の無酸素銅ベース合金は原料として銅の純度か９
９９９重量％以上の無酸素銅を用いる。 原料として無
酸素銅を用いることにより、タフピッチ銅等を用いた際
に比べて耐折疲労強度等の点て優れた合金を得ることか
てきる。The oxygen-free copper base alloy of the present invention has copper purity of 9.
Oxygen-free copper of 999% by weight or more is used. By using oxygen-free copper as a raw material, it is possible to obtain an alloy that is superior in terms of bending fatigue strength and the like compared to when tough pitch copper or the like is used.
例えは連続熔解鋳造装置で溶解された酸素等の不可避的
不純物の含有量か０００５重量％以下の無酸素銅の溶湯
に、Ｎｂ、Ｔｉ、Ｚｒ、■およびＴａの内の一種以上、
およびＺｎの必要量を、好ましくは銅母合金の形で添加
して、常法に従って無酸素銅ベース合金のインゴットと
する。 後は焼鈍、圧延等の通常の加工法を用いて所望
の形に加工して、フレキシブルプリント基板用銅箔等の
各種の用途に用いればよい。For example, one or more of Nb, Ti, Zr, ■, and Ta are added to a molten oxygen-free copper containing 0.05% by weight or less of inevitable impurities such as oxygen, which is melted in a continuous melting and casting device.
and Zn, preferably in the form of a copper master alloy, to form an oxygen-free copper-based alloy ingot according to conventional methods. Thereafter, it may be processed into a desired shape using normal processing methods such as annealing and rolling, and used for various purposes such as copper foil for flexible printed circuit boards.
このようにして得られた本発明の無酸素銅ベース合金は
、軟化温度か低く、かつ耐折疲労強度も高いので、前記
のフレキシブルプリント基板用銅箔等の用途に好適に用
いることかてぎる。The oxygen-free copper base alloy of the present invention thus obtained has a low softening temperature and high bending fatigue strength, so it can be suitably used for applications such as the above-mentioned copper foil for flexible printed circuit boards. .
本発明のフレキシブルプリント基板用圧延銅箔は、前述
の無酸素銅ベース合金を原料として用い、これを加工し
て厚みをＯ，１ｍｍ以下にしたものである。 そのため
、本発明のフレキシブルプリント基板用圧延銅箔は、軟
化温度が低く、焼鈍の際の粘着のない生産性に優れたも
のであり、しかも耐折疲労強度か高いもので、コンピュ
ーター用バー）・ディスク用等の耐折疲労強度を要求さ
れるフレキシブルプリント基板の銅箔として好適に用い
られる。The rolled copper foil for flexible printed circuit boards of the present invention uses the aforementioned oxygen-free copper base alloy as a raw material and processes it to a thickness of 0.1 mm or less. Therefore, the rolled copper foil for flexible printed circuit boards of the present invention has a low softening temperature, no stickiness during annealing, and excellent productivity, and has high bending fatigue strength, making it suitable for computer bars). It is suitably used as a copper foil for flexible printed circuit boards that require high bending fatigue strength, such as those for disks.
このような本発明のフレキシブルプリント基板用圧延銅
箔の製造方法は特に制限はなく、前述の本発明の無酸素
銅ベース合金のインゴットを常法に従って熱間圧延した
後、中間焼鈍、冷間圧延を繰返し、目的の厚さの圧延銅
箔とずれはよい。There are no particular restrictions on the method for manufacturing the rolled copper foil for flexible printed circuit boards of the present invention, and the ingot of the oxygen-free copper base alloy of the present invention described above is hot rolled in accordance with a conventional method, followed by intermediate annealing and cold rolling. Repeat to roll the copper foil to the desired thickness and make sure there is no deviation.
このような本発明のフレキシブルプリント基板用銅箔の
厚みは、通常用いられる０、１ｍｍ以下にされる。The thickness of such a copper foil for a flexible printed circuit board of the present invention is set to the commonly used 0.1 mm or less.
ここで、本発明のフレキシブルプリン）・基板用圧延銅
箔においては、最終冷間加工度を５０％以上とすること
が好ましい。Here, in the flexible print/rolled copper foil for substrates of the present invention, the final degree of cold working is preferably 50% or more.
最終冷間加工度を５０％以上とすることにより、さらに
軟化温度か低下する点でより好ましい結果を得る。By setting the final degree of cold working to 50% or more, more favorable results can be obtained in terms of further lowering the softening temperature.
本発明のフレキシブルプリント基板用圧延銅箔を適用す
るフレキシブルプリント基板については特に制限はなく
、公知のフレキシブルプリント基板にはいずれも適用可
能である。 従って、ベースフィルムの系且成、ラミネ
ー）・する才ＭＪ脂および接着樹脂の組成等は、通常の
フレキシブルプリント基板に用いられるものはいずれも
適用可能であり、製造方法も公知の製造方法はいずれも
適用可能である。 また、その形態も片面配線、両面配
線、多層配線いずれであってもよい。There is no particular restriction on the flexible printed circuit board to which the rolled copper foil for flexible printed circuit boards of the present invention is applied, and any known flexible printed circuit board can be applied. Therefore, any of the base film system, lamination), MJ resin and adhesive resin compositions used for ordinary flexible printed circuit boards can be applied, and any known manufacturing method can be used. is also applicable. Further, the form thereof may be one-sided wiring, double-sided wiring, or multilayer wiring.
〈実施例〉
以下、本発明の具体的実施例を挙げ、本発明をより詳細
に説明する。<Example> Hereinafter, the present invention will be explained in more detail by giving specific examples of the present invention.
（実施例）
連続熔解鋳造装置て熔解された酸素等の不可避的不純物
の含有量か０．００５重量％以下の無酸素銅のｍｉ＆に
、表１に示される各元素をそれそれ銅母合金の形て添加
して、無酸素銅ベース合金のインゴットを得た。(Example) Each element shown in Table 1 was added to the copper master alloy to the oxygen-free copper containing 0.005% by weight or less of inevitable impurities such as oxygen, which was melted in a continuous melting and casting apparatus. Then, an ingot of oxygen-free copper-based alloy was obtained.
このインゴットを常法に従って熱間圧延した後、中間焼
鈍、冷間圧延を繰返し、厚さ０．０３５ｍｍの圧延銅箔
を得た。 最終冷間加工度は８０％であった。After hot rolling this ingot according to a conventional method, intermediate annealing and cold rolling were repeated to obtain a rolled copper foil having a thickness of 0.035 mm. The final degree of cold work was 80%.
得られた各圧延銅箔から試料を採取し、各試料について
２４時間での半軟化温度およびＭＴＴ耐折強度を測定し
た。A sample was taken from each of the obtained rolled copper foils, and the half-softening temperature and MTT bending strength at 24 hours were measured for each sample.
結果を表１に示す。The results are shown in Table 1.
なお、ＭＩＴ耐折強度試験はＪ Ｉ ５−Ｐ−８１１５
に準拠し、圧延方向より採取した試料を、１３０℃×２
４時間加熱した後の試験である。The MIT folding strength test is J I 5-P-8115.
130℃ x 2 samples taken from the rolling direction according to
This is a test after heating for 4 hours.
また、表１には無酸素銅、タフピッチ銅について同様の
測定を行なった結果も併記する。Table 1 also shows the results of similar measurements made on oxygen-free copper and tough pitch copper.
表１に示される結果より明らかなように、木発明の無酸
素銅ベース合金を用いた銅箔（試料Ｎｏ、４．５．６．
９および１０）は、軟化温度が低く、耐折強度も高い優
れた特性を有するものである。As is clear from the results shown in Table 1, the copper foil (sample No. 4.5.6.
Nos. 9 and 10) have excellent properties such as low softening temperature and high folding strength.
これに対し、タフピッチ銅は軟化温度か高く、耐折強度
にも劣るものであり、また、無添加の無酸素銅は耐折強
度は高いが軟化温度か非常に高い。 また、無酸素銅に
Ｔ１のみを加えたものは、軟化温度は低いものか得られ
るが、耐折強度か低い。 さらに、無酸素銅にＴｉ、Ｚ
ｎの両方を添加してはいるが、木発明の範囲より外れて
いるもの（試料Ｎｏ、７および８）は、共に耐折強度は
高いものが得られているが、軟化温度が非常に高い。On the other hand, tough pitch copper has a high softening temperature and poor bending strength, and additive-free oxygen-free copper has high bending strength but has a very high softening temperature. In addition, when only T1 is added to oxygen-free copper, the softening temperature is low, but the bending strength is low. Furthermore, Ti, Z
Samples in which both n and n were added but outside the scope of the wood invention (sample Nos. 7 and 8) both had high bending strength, but had very high softening temperatures. .
なお、前記実施例で得られた、本発明の範囲内にある無
酸素銅ベース合金の銅箔について、フレキシブルプリン
ト基板に通常用いられる各種の樹脂および接着樹脂をラ
ミネートした後、それぞれ１３０℃て２４時間熱処理し
て樹脂を硬化させたところ、各銅箔は完全に軟化し、高
い柔軟性と、高い耐折強度を有する、優れた特性を有す
るものか得られた。The copper foils made of oxygen-free copper-based alloys within the scope of the present invention obtained in the above examples were laminated with various resins and adhesive resins commonly used for flexible printed circuit boards, and then heated at 130°C for 24 hours. When the resin was cured by heat treatment for a period of time, each copper foil was completely softened and had excellent properties such as high flexibility and high bending strength.
以上の結果より、本発明の効果は明らかである。From the above results, the effects of the present invention are clear.
〈発明の効果〉
本発明の無産度銅ベース合金は、Ｎｂ、Ｔｉ、ＺｒＶＶ
およびＴａの内の一種以上を台別で０．００１〜０．０
５重量％、Ｚｎを０．００２〜００４重量％含有し、か
つ酸素等の不可避的不純物の含有量が０００５重量％以
下の組成を有する無酸素銅ベース合金である。<Effects of the Invention> The copper-based alloy of the present invention contains Nb, Ti, ZrVV
and one or more of Ta from 0.001 to 0.0 for each vehicle
It is an oxygen-free copper base alloy having a composition containing 5% by weight, 0.002 to 004% by weight of Zn, and 0.005% by weight or less of unavoidable impurities such as oxygen.
そのため、木発明の無酸素銅ベース合金は軟化温度か低
く生産性に優れ、しかも耐折疲労強度も高い優れた特性
を有するちのてあり、フレキシブルプリント基板用の銅
箔等に好適に適用される。Therefore, the oxygen-free copper-based alloy invented by Miki has excellent properties such as low softening temperature, high productivity, and high bending fatigue strength, making it suitable for use in copper foil for flexible printed circuit boards, etc. .
また、本発明のフレキシブルフリント基板用圧延銅箔は
、前記の本発明の無酸素銅ベース合金を用いたもので、
軟化温度か低く、低温での焼鈍か可能であるため、焼鈍
の際に粘着することかなく、生産性に優れる。 しか
も耐折疲労強度か高く、大型コンピューターのハードデ
ィスクドライブ用等の高い耐折疲労強度を要求されるフ
レキシブルプリント基板の導体をはじめとして、各種の
用途のフレキシブルプリント基板の導体等に好適に用い
ることができる。Further, the rolled copper foil for flexible flint substrates of the present invention uses the oxygen-free copper base alloy of the present invention,
It has a low softening temperature and can be annealed at low temperatures, so it does not stick during annealing and has excellent productivity. Moreover, it has a high bending fatigue strength, and can be suitably used as a conductor for flexible printed circuit boards for various uses, including conductors for flexible printed circuit boards that require high bending fatigue strength, such as those used in large computer hard disk drives. can.
Claims (2)
を合計で０．００１〜０．０５ 重量％、Ｚｎを０．００２〜０．０４重量％含有し、か
つ酸素等の不可避的不純物の含有量が０．００５重量％
以下であることを特徴とする低温軟化性と高耐折強度を
備えた無酸素銅ベース合金。(1) Contains a total of 0.001 to 0.05% by weight of one or more of Nb, Ti, Zr, V, and Ta, 0.002 to 0.04% by weight of Zn, and contains unavoidable substances such as oxygen. Impurity content is 0.005% by weight
An oxygen-free copper-based alloy with low-temperature softening properties and high bending strength, characterized by:
みが０．１ｍｍ以下であることを特徴とするフレキシブ
ルプリント基板用圧延銅箔。(2) A rolled copper foil for a flexible printed circuit board, comprising the oxygen-free copper base alloy according to claim 1 and having a thickness of 0.1 mm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15205888A JPH01319640A (en) | 1988-06-20 | 1988-06-20 | Oxygen-free copper base alloy and rolled copper foil for flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15205888A JPH01319640A (en) | 1988-06-20 | 1988-06-20 | Oxygen-free copper base alloy and rolled copper foil for flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01319640A true JPH01319640A (en) | 1989-12-25 |
Family
ID=15532132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15205888A Pending JPH01319640A (en) | 1988-06-20 | 1988-06-20 | Oxygen-free copper base alloy and rolled copper foil for flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01319640A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001095683A1 (en) * | 2000-06-08 | 2001-12-13 | World Properties Inc. | Method of manufacturing circuit laminates |
| US6538211B2 (en) | 2000-08-15 | 2003-03-25 | World Properties, Inc. | Multi-layer circuits and methods of manufacture thereof |
| JP2003089832A (en) * | 2001-09-18 | 2003-03-28 | Nippon Mining & Metals Co Ltd | Copper alloy foil having excellent thermal peeling resistance of plating |
| JP2012089692A (en) * | 2010-10-20 | 2012-05-10 | Hitachi Cable Ltd | Bus bar for solar cell and method of manufacturing the same |
| CN104711448A (en) * | 2013-12-13 | 2015-06-17 | 北京有色金属研究总院 | Copper alloy foil for power battery carrying fluid and processing method thereof |
| JP2016135927A (en) * | 2015-01-09 | 2016-07-28 | Ｊｘ金属株式会社 | Metal base material with plating material |
| JP2016138337A (en) * | 2015-01-09 | 2016-08-04 | Ｊｘ金属株式会社 | Metal base with plating |
-
1988
- 1988-06-20 JP JP15205888A patent/JPH01319640A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001095683A1 (en) * | 2000-06-08 | 2001-12-13 | World Properties Inc. | Method of manufacturing circuit laminates |
| US6538211B2 (en) | 2000-08-15 | 2003-03-25 | World Properties, Inc. | Multi-layer circuits and methods of manufacture thereof |
| JP2003089832A (en) * | 2001-09-18 | 2003-03-28 | Nippon Mining & Metals Co Ltd | Copper alloy foil having excellent thermal peeling resistance of plating |
| JP2012089692A (en) * | 2010-10-20 | 2012-05-10 | Hitachi Cable Ltd | Bus bar for solar cell and method of manufacturing the same |
| CN104711448A (en) * | 2013-12-13 | 2015-06-17 | 北京有色金属研究总院 | Copper alloy foil for power battery carrying fluid and processing method thereof |
| JP2016135927A (en) * | 2015-01-09 | 2016-07-28 | Ｊｘ金属株式会社 | Metal base material with plating material |
| JP2016138337A (en) * | 2015-01-09 | 2016-08-04 | Ｊｘ金属株式会社 | Metal base with plating |
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