JPH0131700B2 - - Google Patents

Info

Publication number
JPH0131700B2
JPH0131700B2 JP58127492A JP12749283A JPH0131700B2 JP H0131700 B2 JPH0131700 B2 JP H0131700B2 JP 58127492 A JP58127492 A JP 58127492A JP 12749283 A JP12749283 A JP 12749283A JP H0131700 B2 JPH0131700 B2 JP H0131700B2
Authority
JP
Japan
Prior art keywords
thermally conductive
conductive rubber
electronic components
mold release
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58127492A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6018942A (ja
Inventor
Kyoshi Nojima
Kyoshi Ito
Kyoshi Hani
Takahiko Ubabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58127492A priority Critical patent/JPS6018942A/ja
Publication of JPS6018942A publication Critical patent/JPS6018942A/ja
Publication of JPH0131700B2 publication Critical patent/JPH0131700B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58127492A 1983-07-13 1983-07-13 電子部品用放熱部材 Granted JPS6018942A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58127492A JPS6018942A (ja) 1983-07-13 1983-07-13 電子部品用放熱部材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58127492A JPS6018942A (ja) 1983-07-13 1983-07-13 電子部品用放熱部材

Publications (2)

Publication Number Publication Date
JPS6018942A JPS6018942A (ja) 1985-01-31
JPH0131700B2 true JPH0131700B2 (https=) 1989-06-27

Family

ID=14961293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58127492A Granted JPS6018942A (ja) 1983-07-13 1983-07-13 電子部品用放熱部材

Country Status (1)

Country Link
JP (1) JPS6018942A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63289847A (ja) * 1987-05-21 1988-11-28 Nec Corp Ｌｓｉパッケ−ジの放熱構造
US5285108A (en) * 1991-06-21 1994-02-08 Compaq Computer Corporation Cooling system for integrated circuits
JP2003101270A (ja) * 2001-09-27 2003-04-04 Toshiba Corp 電子部品の冷却構造、これを備えた磁気ディスク装置、および冷却構造の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57146347U (https=) * 1981-03-06 1982-09-14

Also Published As

Publication number Publication date
JPS6018942A (ja) 1985-01-31

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