JP4265386B2 - 両面金属材張り積層板及びプリント配線板 - Google Patents
両面金属材張り積層板及びプリント配線板 Download PDFInfo
- Publication number
- JP4265386B2 JP4265386B2 JP2003394666A JP2003394666A JP4265386B2 JP 4265386 B2 JP4265386 B2 JP 4265386B2 JP 2003394666 A JP2003394666 A JP 2003394666A JP 2003394666 A JP2003394666 A JP 2003394666A JP 4265386 B2 JP4265386 B2 JP 4265386B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- clad laminate
- double
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007769 metal material Substances 0.000 claims description 63
- 239000012790 adhesive layer Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 239000011889 copper foil Substances 0.000 claims description 18
- 229920001187 thermosetting polymer Polymers 0.000 claims description 14
- 239000011342 resin composition Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 12
- 230000017525 heat dissipation Effects 0.000 description 10
- 239000010410 layer Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- 238000005488 sandblasting Methods 0.000 description 4
- 229920003051 synthetic elastomer Polymers 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000001588 bifunctional effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000010903 husk Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Description
金属材1、2として、250μmの圧延銅箔にサンドブラストによって片側の表面が十点平均粗さ35μmとなる処理を施し、圧延銅箔を2枚作製した。
金属材1、2である250μmの電解銅箔に厚み45μmのプリプレグ(R1661)を接着層3を配置し、180℃、30MPaにて60分加熱加圧し、図1と同様の銅張り積層板を得た。この電解銅箔の十点平均粗さを測定したところ、12μmであった。
2 金属材
3 接着層
4 回路パターン
5 回路パターン
A 両面金属材張り積層板
B プリント配線板
Claims (5)
- 厚み70μmを超える二枚の金属材が厚み50μm以下の接着層で接着されて一体化されると共に金属材の接着層側の表面の十点平均粗さが30μm以上であることを特徴とする両面金属材張り積層板。
- 二枚の金属材を部分的に接触させて成ることを特徴とする請求項1に記載の両面金属材張り積層板。
- 金属材として圧延銅箔又は電解銅箔の少なくとも一方を用いて成ることを特徴とする請求項1又は2に記載の両面金属材張り積層板。
- 接着層として熱硬化性樹脂組成物又はプリプレグの少なくとも一方を用いて成ることを特徴とする請求項1乃至3のいずれかに記載の両面金属材張り積層板。
- 請求項1乃至4のいずれかに記載の両面金属材張り積層板の少なくとも一方の金属材を回路パターンに形成して成ることを特徴とするプリント配線板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003394666A JP4265386B2 (ja) | 2003-11-25 | 2003-11-25 | 両面金属材張り積層板及びプリント配線板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003394666A JP4265386B2 (ja) | 2003-11-25 | 2003-11-25 | 両面金属材張り積層板及びプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005153299A JP2005153299A (ja) | 2005-06-16 |
JP4265386B2 true JP4265386B2 (ja) | 2009-05-20 |
Family
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Family Applications (1)
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JP2003394666A Expired - Lifetime JP4265386B2 (ja) | 2003-11-25 | 2003-11-25 | 両面金属材張り積層板及びプリント配線板 |
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JP (1) | JP4265386B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101473859B1 (ko) * | 2008-09-26 | 2014-12-17 | 심천 워트 어드밴스드 머티리얼즈 주식회사 | 프리프레그, 프리프레그 적층체, 및 상기 프리프레그 또는 프리프레그 적층체를 채용한 금속박 적층판과 프린트 배선판 |
JP2011230308A (ja) * | 2010-04-23 | 2011-11-17 | Panasonic Electric Works Co Ltd | フレキシブル銅張積層板及びフレキシブルプリント配線板 |
-
2003
- 2003-11-25 JP JP2003394666A patent/JP4265386B2/ja not_active Expired - Lifetime
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