JPH0131297B2 - - Google Patents

Info

Publication number
JPH0131297B2
JPH0131297B2 JP60172342A JP17234285A JPH0131297B2 JP H0131297 B2 JPH0131297 B2 JP H0131297B2 JP 60172342 A JP60172342 A JP 60172342A JP 17234285 A JP17234285 A JP 17234285A JP H0131297 B2 JPH0131297 B2 JP H0131297B2
Authority
JP
Japan
Prior art keywords
wire bonding
bonding
wire
wedge
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60172342A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61105852A (ja
Inventor
Kazuhisa Takashima
Tokio Iguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP60172342A priority Critical patent/JPS61105852A/ja
Publication of JPS61105852A publication Critical patent/JPS61105852A/ja
Publication of JPH0131297B2 publication Critical patent/JPH0131297B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07533—
    • H10W72/5363—

Landscapes

  • Wire Bonding (AREA)
JP60172342A 1985-08-07 1985-08-07 ワイヤボンダ Granted JPS61105852A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60172342A JPS61105852A (ja) 1985-08-07 1985-08-07 ワイヤボンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60172342A JPS61105852A (ja) 1985-08-07 1985-08-07 ワイヤボンダ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP12683979A Division JPS5651832A (en) 1979-10-03 1979-10-03 Method and apparatus for wire bonding

Publications (2)

Publication Number Publication Date
JPS61105852A JPS61105852A (ja) 1986-05-23
JPH0131297B2 true JPH0131297B2 (cg-RX-API-DMAC10.html) 1989-06-26

Family

ID=15940126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60172342A Granted JPS61105852A (ja) 1985-08-07 1985-08-07 ワイヤボンダ

Country Status (1)

Country Link
JP (1) JPS61105852A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009206407A (ja) * 2008-02-29 2009-09-10 Morioka Seiko Instruments Inc ワイヤーボンド方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5651832A (en) * 1979-10-03 1981-05-09 Hitachi Ltd Method and apparatus for wire bonding

Also Published As

Publication number Publication date
JPS61105852A (ja) 1986-05-23

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