JPH01310928A - Resin molding control apparatus - Google Patents

Abstract

PURPOSE:To set the optimum molding condition at every novel mold even by an unskilled person by a method wherein the optimum resin pressure bringing a molded product to an excellent one is calculated on the basis of stored quality at every trial molded product, resin pressure and injection pressure and a resin molding apparatus is controlled on the basis of the calculated optimum resin pressure. CONSTITUTION:A load cell 2 as a resin pressure detection means detects the pressure of a resin during molding applied to the protruding pin for demolding a molded product from a mold and outputs the detection result to an injection pressure altering means and a microcomputer 3 as a control means. A keyboard 4 as a molded product quality input means and a floppy disk device 5 as a memory means are connected to the microcomputer 3 and the resin pressure detected value data due to the load cell 2, the quality data of the molded product and the molding condition data such as the temp. of a molten resin, the temp. of a mold and injection pressure in the molding process of the molded product are stored in the floppy disk device 5. Then, a molding condition is set to the center of a good product range, that is, to a state hardest to generate inferiority.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a control device for a resin molding apparatus such as an injection molding machine or a transfer molding machine.

[Conventional technology 1] Conventionally, when performing resin molding using a newly manufactured mold, an operator would adjust molding conditions such as molten resin temperature, mold temperature, and injection pressure using a trial and error method. After several trial runs, production was carried out using the conditions under which a good product was obtained as the optimum values, but not only did it require skill to adjust the molding conditions, but the conditions under which a good product was obtained by chance were used for production. In order to obtain the optimum value, it is not necessarily possible to use the most stable molding conditions, which poses a problem in that defects such as cracks and short circuits occur during production.

In order to solve this problem, a certain specific molding condition is selected from various molding conditions stored in advance in the storage device based on the time required to reach the maximum injection pressure and the injection amount during that time. It is disclosed in Publication No. 139422/1983.

[Problems to be Solved by the Invention] However, the injection molding machine disclosed in JP-A-60-139422 does not take into consideration the quality of the molded product under the molding conditions, and does not take into account the time required to reach the maximum injection pressure and the injection during that time. Since the system selects a specific molding condition set based on the amount of experience, it is possible to set the molding condition to the optimum value in a new mold that corresponds to this specific molding condition, but other With a new mold, it was difficult to set the molding conditions to optimal values.

This invention was made to solve the above problems, and its purpose is to
It is an object of the present invention to provide a resin molding control device that allows even non-experts to set optimal molding conditions for each new mold.

[Means for Solving the Problems] In order to achieve the above object, the present invention includes an injection pressure changing means for arbitrarily changing the injection pressure of a resin molding device, a resin pressure detecting means for detecting the resin pressure during molding, A molded product quality input means for inputting the quality of each trial molded product changed by the injection pressure changing means and test molded, the quality of each trial molded product, the resin pressure at that time, the injection pressure, etc. and a storage means for storing the molded product, and an optimum resin pressure at which the molded product becomes a good product is determined based on the quality, resin pressure and injection pressure of each trial molded product stored in the storage means, and the resin is determined by the determined optimal resin pressure. The gist of this invention is a resin molding control device equipped with a control means for controlling a molding device.

[Function] Therefore, the injection pressure of the resin molding device is arbitrarily changed by the injection pressure changing means, the resin pressure during molding is detected by the resin pressure detection means, and the molded product quality input means is used to detect the test molded sample. Quality data is input for each stamped product. The storage means stores the quality of each trial molded product, the resin pressure, injection pressure, etc. at that time. Then, the control means determines the optimum resin pressure at which the molded product becomes a good product based on the quality, resin pressure and injection pressure of each trial molded product stored in the storage means, and uses the obtained optimum resin pressure to control the resin molding device. control.

[Example] An example embodying the present invention will be described below with reference to the drawings.

FIG. 1 shows the electrical configuration of a resin molding control device, and in this embodiment, the resin molding device is an injection molding machine 1 for molding thermoplastic resin.

A load cell 2 as a resin pressure detection means detects the resin pressure during molding applied to an ejector bottle for releasing a molded product from a mold, and sends the detection result to a microcomputer 3 as an injection pressure changing means and a control means. It is designed to be output.

A keyboard 4 is connected to the microcomputer 3 as a means for inputting whether the molded product is good or bad, and an operator can manually input whether the molded product is good or not by operating keys. Further, a floppy disk device 5 as a storage means is connected to the microcomputer 3, and the floppy disk device 5 stores the resin pressure detection value data by the load cell 2, the quality data of the molded product, and the molding process of the molded product. Molding condition data such as molten resin temperature, mold temperature, and injection pressure are stored.

Next, the operation of the resin molding control device configured as described above will be explained based on the flowchart shown in FIG. 2.3.

Figure 2 explains the setting of optimal molding conditions in the injection molding machine 1 with a new mold installed.
By operating the keyboard 4, the operator sets molding conditions such as molten resin temperature, mold temperature, and injection pressure to appropriate values based on conventional experience.

Thereafter, when the start switch set on the keyboard 4 is operated, the microcomputer 3 sends a control signal to the injection molding machine 1 in step 11 to perform trial molding. During this molding process, the resin pressure is detected by the load cell 2, and in step 12, the microcomputer 3 stores the resin pressure detection value data in the floppy disk device 5.

Next, when the trial molding is completed and the trial molded product is obtained,
In step 13, the operator determines the quality of the product and inputs quality data by operating the keyboard 4. To enter this quality data, if the product is overfilled and has cracked, press the key defined as "Hard", and if the product is short shot (insufficient filling), it is defined as "Short". This is done by pressing the specified key.

The microcomputer 3 stores the input quality data in the floppy disk device 5 in the same manner as the resin pressure detection value data, and when the microcomputer 3 determines that the product is "short" in the subsequent step 14, the process proceeds to step 22. Then, the shot injection pressure in the next trial molding is changed to a value higher by a predetermined amount than the value set in step 10 above. Also, if the microcomputer 3 determines in step 14 that it is not a "short circuit", it proceeds to step 15 and determines whether it is a "paris", and if it determines that it is a "paris", it proceeds to step 17 to perform the next step. The shot injection pressure in trial molding is changed to a value lower by a predetermined value than the value set in step 10 above. If the microcomputer 3 determines in step 15 that it is not "Paris", it proceeds to step 16, sets the first time non-defective product flag to "1", and proceeds to step 22.

Then, in step 18, the microcomputer 3 sends a signal corresponding to the injection pressure set in step 17 to the injection molding machine 1, performs test molding under conditions different from the previous shot, and proceeds to step 19. Then, the microcomputer 3 causes the floppy disk device 5 to store the resin pressure detection value data during molding. After the trial molding is completed, in step 20, when the worker inputs the quality data of the product by operating the keyboard 4, the microcomputer 3 stores the quality data in the floppy disk device 5, and the process proceeds to step 21. If it is determined that the test molded product is not "short", the process moves to step 17, where the injection pressure is set to a value lower by a predetermined amount than the previous shot, and the processes from step 17 onwards are repeated. If the microcomputer 3 determines in step 21 that the trial molded product is "short", the process proceeds to step 28 and calculates the optimum resin pressure.

On the other hand, if the microcomputer 3 determines that there is a "short circuit" in step 14, or if the first good product flag is set to "1" in step 16,
In step 22, the shot injection pressure in the next trial molding is changed to a value higher by a predetermined amount than the value set with the step knob 10, and then a signal corresponding to the injection pressure set in step 23 is sent to the injection molding machine 1. In step 24, test molding is performed under different conditions from the previous shot.
At this point, the microcomputer 3 stores the resin pressure detection value data during molding in the floppy disk device 5. After the trial molding is completed, when the worker inputs the quality data of the product by operating the keyboard 4 in step 25, the microcomputer 3 stores the quality data in the floppy disk device 5, and the process proceeds to step 26. Microcomputer 3 was used as a trial molded product.
If it is determined that there is no "paris", the process moves to step 22, the injection pressure is set to a value higher than the previous shot by a predetermined amount, and the processes from step 22 onwards are repeatedly executed. If the microcomputer 3 determines in step 26 that the product is "Paris", it proceeds to step 27, and if it determines in step 27 that the initial good product flag is not "1", it proceeds to step 28, in which the optimum resin pressure is Calculate.

Further, when the microcomputer 3 determines that the first good product flag is "1" in step 27, the microcomputer 3 performs the step 1 described above.
7, and the processes of steps 17 to 21 are repeatedly executed.

As a result of the above processing, the floppy disk device 5 stores resin pressure detection value data for shots in each trial molding,
Test-molded product quality data (either parity, good product, or short) and injection pressure data are stored, and based on these data, the microcomputer 3 calculates the optimum resin pressure for this new mold in step 28. That is, as shown in Fig. 4, the average of the resin pressure Pjl that led to the occurrence of flash (resin pressure at the upper limit of the non-defective range) and the resin pressure that led to the occurrence of short shot (resin pressure at the lower limit of the non-defective range) PI3. The value (P j1 + P j2)/2 is set as the optimum resin pressure Pjo, and the shot where this resin pressure Pjo is obtained is selected from the data stored in the floppy disk device 5, or the average value of the resin pressure (P jx +P j2)/2
By substituting into the function f, the injection pressure Ph at which the resin pressure becomes the optimum value.

Determine. Further, the microcomputer 3 calculates the resin pressures Pjx, Pjz at the upper and lower limits with the resin pressure Pjo as the center.
An optimal value range P8 to PB having a width that is one-half of the width between P8 and PB is determined.

FIG. 3 explains the production process using the new mold. In step 30, the microcomputer 3 sets the injection pressure to the optimal value calculated in step 28,
In the following step 31, the microcomputer 3 sends a signal corresponding to the injection pressure set in step 28 to the injection molding machine.
At step 32, the microcomputer 3 causes the floppy disk device 5 to store the resin pressure detection value data during the molding. After molding is completed,
The microcomputer 3 judges the resin pressure detection value data in step 33, and if it judges in step 34 that the resin pressure is within the optimum value range P^ to PB shown in FIG. 5, the process moves to step 31. Then, the subsequent molding process is repeated. Further, if it is determined in step 34 that the resin pressure is not within the optimum value range P^~PB, the process proceeds to step 35, where the injection pressure correction amount is calculated, and step 36
In step 30, the injection pressure set in step 30 is corrected, and the molding process in step 31 and subsequent steps is executed.

In this way, in this embodiment, when setting the molding conditions for a new mold, the resin pressure during trial molding is constantly detected, and the quality data of the trial molded product is collected from the flow chart by the operator's scratching on the keyboard 4. The information is stored in the nobby disc device 5, and the microcomputer 3 changes the injection pressure to a value lower by a predetermined amount than the previous test molding and performs the next test molding when "paris" occurs. If a "short" occurs, the injection pressure is changed to a predetermined value higher than the previous test molding and the next test molding is performed, so even non-experts can perform trial molding. Molding can be easily performed.

Furthermore, in this embodiment, when a "short" occurs in the molded product during trial molding, the microcomputer 3 sequentially changes the injection pressure to a lower value and performs trial molding until a "short" occurs in the molded product. , also, microcomputer 3
When a "short" occurs in a molded product during test molding, the injection pressure is successively lowered and test molding is continued until a "break" occurs in the test molded product. The range can be confirmed, and the molding conditions can be set to the center of the non-defective range, that is, to the state where defects are least likely to occur.

Furthermore, in this embodiment, the microcomputer 3 constantly detects the resin pressure during molding in the production process, and
This resin pressure detection value is configured to be compared with the non-defective range confirmed during test molding, so it is possible to know where the current molding conditions are in the non-defective range, and for example,
As shown in the figure, even if disturbances such as changes in mold temperature or molten resin temperature occur, the resin pressure can be returned to the optimum value based on the relationship between the injection pressure Ph and resin pressure pj confirmed during the trial run. By calculating the necessary injection pressure correction amount and sending it to the injection molding machine 1, the molding conditions can be returned to a state where defects are unlikely to occur, that is, to the center of the non-defective product range, and this can be used in actual production. It is possible to prevent defects from occurring.

In the above embodiment, the keyboard 4 was used as a molded product quality input means, and the operator inputted the quality judgment result of the test molded product. An automatic dimension measuring device that outputs to the eta 3 may be used.

Furthermore, in the embodiment described above, the microcomputer 3 maintains stable molding conditions during production by changing the molding conditions for injection molding II before the next shot. For example, the resin pressure may be controlled to a target value by providing the resin pressure with a control function capable of changing the resin pressure within the shot, thereby keeping the molding conditions stable at all times.

Further, the storage means may be a hard disk device instead of the floppy disk device 5.

Further, in the above embodiments, the resin molding apparatus is an injection molding machine that molds thermoplastic resin, but it may also be implemented in a transfer molding machine that molds thermosetting resin.

[Effects of the Invention] As detailed above, according to the present invention, when determining the molding conditions for a new mold, even an unskilled person can set the optimal molding conditions for each new mold. effective.

[Brief explanation of the drawing]

Fig. 1 is a block diagram showing the electrical configuration of an embodiment embodying the present invention, Fig. 2 is a flowchart for explaining the setting of optimum molding conditions, and Fig. 3 is a flowchart for explaining the production process. , FIG. 4 is a graph showing the relationship between resin pressure and injection pressure, and FIG. 5 is a graph showing the relationship between resin pressure and injection pressure when disturbance is applied in the production process. In the figure, 1 is an injection molding machine as a resin molding device, 2 is a load cell as a resin pressure detection means, 3 is a microcomputer as an injection pressure changing means and a control means, 4 is a keyboard as a molded product quality input means, 5 is a floppy disk device as a storage means. Patent applicant Nippondenso Co., Ltd. Agent Patent attorney On 1) Hironobu PhO Injection pressure Ph Injection pressure ゐ

Claims (1)

[Scope of Claims] 1. Injection pressure changing means for arbitrarily changing the injection pressure of a resin molding device; resin pressure detecting means for detecting the resin pressure during molding; and trial molding changed by the injection pressure changing means. a molded product quality input means for inputting the quality of each trial molded product; a storage means for storing the quality of each trial molded product, resin pressure, injection pressure, etc. at that time; and storage in the storage means. A control means is provided for determining the optimum resin pressure at which the molded product becomes a good product based on the quality, resin pressure and injection pressure of each trial molded product, and controlling the resin molding device based on the determined optimal resin pressure. Characteristic resin molding control device.