JPH0129802Y2 - - Google Patents

Info

Publication number
JPH0129802Y2
JPH0129802Y2 JP15141983U JP15141983U JPH0129802Y2 JP H0129802 Y2 JPH0129802 Y2 JP H0129802Y2 JP 15141983 U JP15141983 U JP 15141983U JP 15141983 U JP15141983 U JP 15141983U JP H0129802 Y2 JPH0129802 Y2 JP H0129802Y2
Authority
JP
Japan
Prior art keywords
multilayer ceramic
ceramic substrate
chip capacitor
recess
lcc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15141983U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6059561U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15141983U priority Critical patent/JPS6059561U/ja
Publication of JPS6059561U publication Critical patent/JPS6059561U/ja
Application granted granted Critical
Publication of JPH0129802Y2 publication Critical patent/JPH0129802Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP15141983U 1983-09-29 1983-09-29 半導体装置 Granted JPS6059561U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15141983U JPS6059561U (ja) 1983-09-29 1983-09-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15141983U JPS6059561U (ja) 1983-09-29 1983-09-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS6059561U JPS6059561U (ja) 1985-04-25
JPH0129802Y2 true JPH0129802Y2 (US20100223739A1-20100909-C00025.png) 1989-09-11

Family

ID=30335548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15141983U Granted JPS6059561U (ja) 1983-09-29 1983-09-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS6059561U (US20100223739A1-20100909-C00025.png)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714110B2 (ja) * 1988-08-17 1995-02-15 株式会社村田製作所 多層セラミック基板
JP4817110B2 (ja) * 2005-12-26 2011-11-16 株式会社村田製作所 多層回路基板及びicパッケージ
JP2017126710A (ja) * 2016-01-15 2017-07-20 株式会社村田製作所 複合電子部品

Also Published As

Publication number Publication date
JPS6059561U (ja) 1985-04-25

Similar Documents

Publication Publication Date Title
US5440171A (en) Semiconductor device with reinforcement
JPS58159360A (ja) 半導体装置
US8299594B2 (en) Stacked ball grid array package module utilizing one or more interposer layers
US5095407A (en) Double-sided memory board
JP3016910B2 (ja) 半導体モジュール構造
US6414850B1 (en) Method and apparatus for decoupling ball grid array devices
JPH0697317A (ja) 配線基板
JPH0129802Y2 (US20100223739A1-20100909-C00025.png)
JPH0473298B2 (US20100223739A1-20100909-C00025.png)
JPH0821648B2 (ja) 厚膜技術により形成されたピンレスグリッドアレイ電極構造
JP3769881B2 (ja) 電子回路装置
JPH0439668Y2 (US20100223739A1-20100909-C00025.png)
JPH0529538A (ja) 半導体モジユール構造
KR100720410B1 (ko) 수동소자가 패턴된 반도체 패키지용 섭스트레이트
JPH0299394A (ja) メモリーカードモジュール
JPH01217869A (ja) 混成集積回路装置
JPH0652170U (ja) セラミックス多層回路基板
JPS6125240B2 (US20100223739A1-20100909-C00025.png)
JPS61278198A (ja) 電子回路モジユ−ル
JPH0611355U (ja) リードレス・チップ・キャリア
JPH0567014U (ja) 半導体装置
JPS60249389A (ja) マルチチツプパツケ−ジの実装構造
JP2000164461A (ja) チップ部品
JPS6265495A (ja) 混成集積回路の製造方法
JPS6364391A (ja) 電子部品の高密度実装方法