JPH01297895A - Rotary type electronic component mounting apparatus - Google Patents

Abstract

PURPOSE:To redouble mounting speed of electronic components on a board without spoiling the mounting accuracy by arranging 2 mounting sections so that each section mounts half of the total number of components. CONSTITUTION:When boards 5 and 6 are positioned in mounting sections 3 and 4, a rotary head 1 rotates intermittently toward an arrow N. Also, electronic components in a feeder 20 are transferred to the mounting section 3, and electronic components in a feeder 30 are transferred to the mounting section 4 each by transfer heads 2, and are mounted on each substrate 5 and 6. As an example, the mounting is done such that half of the total electronic components to be mounted are mounted on the board at the mounting section 3. Then the board is transferred to the mounting section 4 by a conveyor 10, and the remaining half of the electronic components are mounted. By this method, the mounting speed can essentially be doubled. Further, position trimming of each board 5 and 6 corresponding to inspection results is done by independently driving XY tables 31, 32 and 41, 42 of each mounting section 3 and 4, thereby improving the mounting accuracy.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a rotary type electronic component mounting apparatus, and particularly to a rotary head and a mount portion that can advantageously double the mounting speed of electronic components.

Regarding the arrangement structure of the supply section.

(Prior art) In order to double the mounting speed as a rotary head type electronic component mounting apparatus, two rotary heads 101 and 102 are arranged as shown in Fig. 3, and are arranged on one side. In the supply section 103, each rotary head 101,1
The electronic components are picked up by the transfer head 104 of 02, respectively, and the XY child table 0 arranged on the other side
A substrate 10 positioned on a mount section 106 consisting of 5
It is known that the aircraft is transported and mounted on the 7,108. 109 is a moving device for the electronic component supply unit 110, 112 is a tape unit installed on the supply unit 7 soto 110, and 113 and 114 are conveyors for transporting the substrates 107 and 108.

(Problem to be Solved by the Invention) This type of board generally has board errors due to dimensional variations and deformation, so before mounting electronic components, the appearance of the board is inspected using a camera etc. to check board errors. In some cases, the position of the substrate is corrected by driving the XY child table. However, the above-mentioned conventional one has two substrates 107.
108 are positioned on a common XY table 105, it is not possible to correct the board errors of each board 107 and 108 independently and separately, which causes the problem of poor mounting accuracy of electronic components.

Further, only one conventional supply unit 110 is disposed in the moving device 109, and two rotary heads 10 are provided.
1 and 102 share this supply unit 110, it is difficult to accurately position the electronic components at each of the pick-up positions a and b, resulting in a problem in which there are many tick-up errors. In addition, if an electronic component in the tape unit 112 of the supply unit 110 runs out during mounting work and needs to be replaced, the two rotary heads 1
01 and 102 had to be stopped to completely interrupt the mounting work, which caused a problem that the mounting efficiency was reduced accordingly.

Therefore, an object of the present invention is to provide a rotary electronic component mounting apparatus that can double the mounting speed without reducing the mounting accuracy of electronic components and has a simple structure.

(Means for Solving the Problems) For this purpose, the present invention provides a first mount section and a second mount section below the rotary head in which the transfer heads are arranged in parallel, and the first round 1 A conveyor for carrying in the substrate, a conveyor for conveying the substrate from the first mount part to the second mount part, and a conveyor for carrying out the board from the second mount part are provided, and the first mount part and The second mount section is provided with substrate positioning means each consisting of an XY child table that is driven independently of each other, and an electronic component supply unit is slidably mounted on the moving device on the side of each mount section. Each electronic component supply section is provided with a supply section for electronic components consisting of the following components.

(Function) In the above configuration, the substrate is
The position is corrected and positioned by Y child table drive,
For example, after half of the electronic components are mounted here, they are transported by a conveyor to the second mounting section, positioned there again, and then the remaining half of the electronic components are mounted.

Once all the electronic components have been mounted in this way,
The substrate is carried out to the next process by a conveyor.

(Example) Hereinafter, the present invention will be described in detail with reference to the drawings.

1 and 2 are a plan view and a side view of a rotary type electronic component mounting apparatus, in which 1 is a rotary head rotatably installed at the bottom of a main body box 12 in which a drive device is housed; On its lower surface, a large number of transfer heads 2 are arranged in parallel along the circumferential direction for sucking and transferring electronic components. 3,
4 is the first table consisting of xy child tables 1, 32, 41°42
and a second mount part, which are disposed below the rotary head 1 on a line P of 180° with the rotation center 0 therebetween. The XY child tables 1.32 and 41.42 of each mount section 3, 4 are driven independently and separately to correct the position of the substrates 5, 6. 11 is a board recognition stage, which is provided in front of the first mount section 3, and performs an external appearance inspection of the board 7 on standby while electronic components are mounted on the board 5.6. If the substrate 7 has a substrate error due to dimensional variations or deformation, a correction command is given to the XY child tables 1 to 42 based on the substrate error. 8 is a conveyor for transporting the board to the first mount unit 3; 9 is a conveyor for transporting the board on which electronic components have been mounted to the next process; 10 is a conveyor for transporting the board from the first mount unit 3 to the second mount unit 4. This is a conveyor that transports substrates.

Reference numerals 20 and 30 indicate electronic component supply sections arranged on each side of the mount sections 3 and 4 with the rotary head 1 in between. The resupply units 20 and 30 have the same structure, and each consist of a moving device 21 and an electronic component supplying unit 22 that is slidably mounted on the moving device 21 and reciprocates laterally thereon. ing. In this supply unit 22, a large number of tape units 29 wound with electronic component encapsulating tape are arranged in parallel. 23 is a feed screw, 2
Numeral 4 is a nut screwed onto the feed screw 23, and this nut 24 is attached to the lower surface of the supply unit 22. 25
are guide rails of the supply unit 22 disposed on both sides of the upper surface of the moving device 11 in parallel with the feed screw 23. When the feed screw 23 is driven by a drive unit 26 such as a morph and rotates, the supply unit 22 slides along the feed screw 23, and each electronic component is positioned in the pick-up position a, b in the order of mounting and transferred. It is attracted to the head 2 and transferred and mounted on the substrates 5 and 6. Each of the pick-up positions a and b is on a line Q passing through the center O of the rotary head 2 and orthogonal to the above line P. By arranging the mount parts 3 and 4 and the pick-up positions a and b on the lines P and Q passing through the center O of the rotary head 2 and intersecting each other at right angles, the driving part 26
This makes it possible to perform drive programming and implementation work advantageously. Reference numerals 27 and 28 are magazines or stockers for the tape unit 29 disposed near the supply units 20 and 30.
9 is a tape unit 29 in which electronic components of different types are sealed.
When replacing with the tape unit 29 stored in this magazine 27, 28. This exchange may be performed automatically by configuring a driving means such as a cylinder.

This device has the above-mentioned configuration, and the mounting work will be explained next.

When the substrate 5.6 is positioned on the mount section 3.4, the rotary head 1 rotates intermittently in the direction of arrow N, and the supply section 2
The electronic components of No. 0 are transferred to the mount section 3, and the electronic components of the supply section 30 are transferred to the mount section 4 by the transfer head 2, and mounted on the respective substrates 5 and 6. In this case, for example, half of the total number of electronic components to be mounted is mounted on the board at the first mounting section 3, and once this is finished, this board is transferred to the conveyor 1.
0 to the second mounting section 4, where the remaining half of the electronic components are mounted, and then transported to the next process by the conveyor 9. In this way, the two mount parts 3 and 4
By performing the implementation in half at a time, the implementation speed can be effectively doubled. Furthermore, the position of each substrate 5.6 is corrected based on the inspection results on the substrate recognition stage 11 by independently driving the XY child tables 1 to 42 of each mount section 3.4. 6 can be ensured to be completely corrected, and therefore the mounting accuracy is also extremely good. Of course, if high mounting accuracy is not required, for example, the XY child tables 1 to 42 of each mount section 3.4 may be driven in the same way.

In addition, this device can be operated while responding to various conditions and situations. For example, if there are only a few types of electronic components mounted on the board and the resupply section 20.30 is equipped with electronic components of the same type. If the electronic components of one of the tape units 29 of one of the supply sections (for example, the supply section 20) are exhausted, the operation of this supply section 20 is stopped and the tape unit 29 is replaced. During this time, by supplying electronic components from the other supply section 30 to both mount sections 3 and 4, the mounting work can be continued without interruption. Alternatively, the boards are loaded into each mounting section 3.4 at the same time, all electronic components are mounted on both boards at each mounting section 3 and 4, and when the mounting is completed, both boards are carried out to the next process at the same time. You can also.

In this way, the present device includes each mount section 3.4 and each supply section 2.
0.30 has an extremely high degree of freedom in operation because each can be operated independently, and therefore implementation work can be carried out while flexibly responding to various conditions and situations. In addition, in the conventional device described above, the mount section, which is the mounting position, serves as the recognition stage for the board, resulting in lost inspection time when mounting cannot be performed. By arranging the mounting portion 3.4, the preceding substrates 5, 6
Since the board 7 on standby can be inspected while the mounting work is being carried out, the loss time required for board inspection can be substantially eliminated, and the mounting speed can be increased accordingly.

(Effects of the Invention) As explained above, the present invention provides a first mount section and a second mount section below the rotary head in which the transfer heads are arranged in parallel, and a substrate on the first mount section. A conveyor for carrying in the substrate, a conveyor for carrying the substrate from the first mount part to the second mount part, and a conveyor for carrying out the board from the second mount part. X driven independently of each other
A positioning means for the board consisting of an As a result, the mounting speed can be doubled, and since each mount section and each supply section can be operated independently of each other, the degree of freedom in operation is extremely large. Even when a component runs out and needs to be replaced, the other supply unit can continue supplying electronic components to the dual-port tally head and continue mounting work, making it flexible for various conditions and situations. Implementation work can be carried out while responding.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which Fig. 1 is a plan view of a rotary electronic component mounting apparatus, Fig. 2 is a side view,
FIG. 3 is a plan view of a conventional device. 1...Rotary head 2...Transfer head 3.4...Mount section 31.41...X table 32.42...X table 5.6.7...Substrate 8.9.10 ... Conveyor 21 ... Moving device 20.30 ... Supply section 22 ... Supply unit

Claims (1)

[Claims] A first mount part and a second mount part are arranged below a rotary head in which transfer heads are arranged in parallel, and a conveyor conveys a substrate to the first mount part and a conveyor from the first mount part to a second mount part. a conveyor that conveys the board to the mounting section of the
A conveyor for carrying out the substrate from the second mount section is provided, and a substrate positioning means consisting of an XY table that is driven independently of each other is provided in the first mount section and the second mount section, and each mount section on the side of
1. A rotary type electronic component mounting apparatus, characterized in that a moving device is provided with an electronic component supply section each of which is slidably equipped with an electronic component supply unit.