KR20030068703A - Semiconductor chip package multi feeding apparatus comprising multi heads and a rotary table - Google Patents

Abstract

PURPOSE: A semiconductor chip package multiple supply device is provided to reduce a pickup time by performing semiconductor chip package pickup operations at the same time and to supply a semiconductor chip package rapidly and exactly by removing a mechanical error at a transfer operation. CONSTITUTION: A tray supply part(220) supplies a package tray(23), and a tray transfer part(240) transfers the package tray. The first head part(250) has a plurality of first pickup heads(255) which are spaced by intervals between semiconductor chip packages(20) in the package tray and perform a pickup operation at the same time. The first head shift part(260) has the first head part and two shift shafts(265,267) configured to shift a location of the first head part in all directions. A rotary table(270) has a plurality of package beds(276) where the semiconductor chip packages are placed at an edge of a top surface of a rotation body. A vacuum absorption hole(278) is formed at the package bed to absorb the semiconductor chip package. The second head part(280) has a plurality of second pickup heads(285) which are spaced by intervals between semiconductor chip packages transferred from the rotary table and perform a pickup operation at the same time. The second head shift part(290) has the second head part and two shift shafts(295,297) configured to shift a location of the second head part in all directions.

Description

Semiconductor chip package multi feeding apparatus including multi heads and a rotary table

The present invention relates to a semiconductor chip package multi-supply device, and more particularly, to a semiconductor chip package multi-supply device having a multi-head and a turn table.

BACKGROUND OF THE INVENTION Semiconductor chip packages, which are widely used in electronic devices, may be directly mounted on circuit boards of electronic devices, or may be used in a module as another component having a specific function. The semiconductor chip package may be mounted on a circuit board or configured as a module one by one for tasks such as mounting a semiconductor chip package on a circuit board or configuring a module, but such a method is very inefficient in a production site for mass production. It can not be the way. Therefore, in a production site, a semiconductor chip package is supplied to be suitable for mass production using a semiconductor chip package multi-supply apparatus using a robot or the like. However, in such a conventional semiconductor chip package multi-supply device, since the package tray on which the semiconductor chip package is loaded is manually fixed to a pallet and then supplied to the semiconductor chip package multi-supply device, there is a problem of manual time loss and complicated process. Pick-up heads that were present and also pick up the semiconductor chip package from the package tray fixed to the pallets were selected for the pickup of the semiconductor chip package because the spacing between the respective pickup heads was different from the spacing between the semiconductor chip packages in the package tray. Since the heads had to move their positions sequentially and pick them up one by one, there was a problem in that the pickup took a long time. In addition, since the semiconductor chip package is transferred from the pick-up point to the mounting point by the upper pick-up method using the pickup heads, if the transfer distance is relatively long, the semiconductor chip package falls down from the pick-up head due to the weak vacuum suction force for pickup. Problem could occur, and mechanical errors such as shaft misalignment may occur due to the length of the moving shafts for the movement of the pickup heads, thereby reducing the accuracy of the feeding.

Hereinafter, a semiconductor chip package multi-supply apparatus according to the related art will be described with reference to the accompanying drawings.

1 is a view illustrating a semiconductor chip package multi-supply apparatus according to the related art, FIG. 2 is an enlarged view of a portion A of FIG. 1, and FIG. 3 is a view showing a pallet on which a package tray is mounted.

As shown in FIG. 1 to FIG. 3, the semiconductor chip package multi-supply apparatus 100 according to the related art is fixed with a package tray 13 and a package tray 13 on which a plurality of semiconductor chip packages 10 are loaded. Pallet 15, pallet supply unit 120 for supplying the pallet 15, pallet conveyer 140, pallet (for example, conveying device such as conveyor 145, for conveying the supplied pallet 15, etc.) The first head portion 150 is configured to have a wider interval than the semiconductor chip package 10 in the package tray 13 mounted on the 15 and each of the plurality of first pickup heads 155 sequentially performing the pick-up operation. , Located after the pallet transfer unit 140, the first head unit 150 is configured, and includes at least the x1 axis 165 and the y1 axis 167 such that the position of the first head unit 150 can be moved back, front, left, and right. Two moving axes are combined The first head has a structure which comprises a mobile unit (160). In the conventional semiconductor chip package multi-supply apparatus 100 having such a structure, the package tray 13 on which the semiconductor chip package 10 is loaded is mounted on the pallet 15 by manual labor and supplied to the pallet supply unit 120. The pallets 15 sequentially supplied from the pallet supply unit 120 are moved to the pickup point of the first head unit 150 through the pallet transfer unit 140. At the pickup point, the pickup heads 155 of the first head part 150 perform the pickup of the semiconductor chip package 10, and the interval between the pickup heads 155 is the interval between the semiconductor chip packages 10. As it is wider, pickup is performed with each pickup head 155 sequentially moving position.

As such, there has been a problem in that a package tray has to be manually fixed to a pallet, and thus, a time loss and a complicated process are required, and each pickup head has to sequentially move its position to pick up a semiconductor chip package one by one. There has been a problem that the time taken for a long time. In addition, the semiconductor chip package may be dropped from the pickup head during the transfer of the semiconductor chip package through the pickup head, and mechanical errors such as shaft twist may occur due to the length of the moving shafts for the movement of the pickup heads. Therefore, there could be problems such as reduced accuracy due to the transfer.

Accordingly, the present invention solves the problems of time loss and process increase due to the pallet mounting of the package tray and the problems such as increase of pickup time due to sequential pick-up of pickup heads, reduction of reliability and accuracy due to transfer, and the like. An object of the present invention is to provide a chip package multi-supply apparatus.

1 illustrates a semiconductor chip package multi-supply apparatus according to the prior art;

2 is an enlarged view of a portion A of FIG. 1;

3 shows a pallet equipped with a package tray, FIG.

4 illustrates a semiconductor chip package multi-supply apparatus according to the present invention;

5 is an enlarged view of a portion B of FIG. 4;

6 shows a package tray, and

7 is a view showing a rotary table in the present invention.

<Description of the symbols for the main parts of the drawings>

10, 20: semiconductor chip package

100, 200: semiconductor chip package multi-supply device

13, 23: package tray 15: pallet

220: tray supply unit 120: pallet supply unit

240: tray transfer unit 140: pallet transfer unit

145 and 245 Conveyor 150 and 250 First head portion

155 and 255: first pick-up head 160 and 260: first head moving part

165, 265: x1 axis 167, 267: y1 axis

270: rotation table 272: central axis

274: rotating body 276: package bed

278: vacuum suction port 280: second head portion

285: second pickup head 290: second head moving part

295: x2 axis 297: y2 axis

In order to achieve the above object, the present invention comprises a package tray in which a plurality of semiconductor chip packages are stacked, a tray supply unit supplying a package tray, a tray transfer unit transferring a supplied package tray, and an interval corresponding to a semiconductor chip package interval in the package tray. And at least two moving shafts for moving the position of the first head portion forward, backward, left, and right, the first head portion comprising a plurality of first pick-up heads configured to perform a pick-up operation and positioned next to a tray conveying portion, and having a first head portion. A plurality of package beds in which the semiconductor chip package is placed on a predetermined edge of the upper surface of the rotating body which is positioned after the first head moving portion and the first head moving portion, which are combined with each other, and rotates by a predetermined angle about a central axis each time. Is formed and the package bed has a semiconductor chip A rotary table having a vacuum suction port for adsorption and fixation of the package, a second head portion composed of a plurality of second pickup heads configured at intervals corresponding to the semiconductor chip package intervals carried from the rotary table and simultaneously performing a pickup operation; And a second head moving part which is positioned next to the table and includes a second head moving part configured to combine at least two moving axes to move the position of the second head part forward, backward, left and right. Provided is a semiconductor chip package multiple supply apparatus having a table.

Hereinafter, a semiconductor chip package multiple supply apparatus having a multi head and a turn table according to the present invention will be described in detail with reference to the accompanying drawings.

Figure 4 is a view showing a semiconductor chip package multi-supply device according to the present invention, Figure 5 is an enlarged view of a portion B of Figure 4, Figure 6 shows a package tray, Figure 7 is a rotary table in the present invention Is a diagram showing.

As shown in FIGS. 4 to 7, in the semiconductor chip package multi-supply apparatus 200 having multiple heads and a turntable according to the present invention, a package tray 23 in which a plurality of semiconductor chip packages 20 is stacked is a tray. The package tray 23 sequentially supplied and supplied from the supply unit 220 is transferred to the pick-up point through a tray transfer unit 240 formed of a transfer device such as a conveyor 245, and the like. First pick-up heads 255 of the first head part 250 pick up the semiconductor chip package 20 from the 23. The first head part 250 that has picked up the semiconductor chip package 20 is moved by the first head moving part 260 formed by combining a moving axis of the x1 axis 265 and the y1 axis 267. The semiconductor chip package 20 is laid down on the package bed 276 formed on the upper surface of the rotating body 274 of the rotary table 270 that rotates by a predetermined angle about the central axis 272. At this time, the semiconductor chip package 20 is placed so as to be sucked and fixed by the action of a vacuum by the vacuum suction port 278 on the package bed 276. When the semiconductor chip package 20 is placed on the package bed 276, a vacuum is supplied to the vacuum inlet 278 so that the semiconductor chip package 20 is sucked and fixed to the package bed 276 and the rotating body 274 rotates to the next. The semiconductor chip package 20 is transferred to the pickup point. At the next pick-up point, the semiconductor chip package 20 is simultaneously picked up from the package bed 276 by the second pick-up heads 285 of the second head portion 280 and the x-axis 295 and the y2-axis 297 The second head unit 280 is moved to a point for the next process by the second head moving unit 290 having a combination of the moving axes.

The present invention is not limited to the above-described structure, and the application of the present invention can be recognized with respect to the structure conforming to the intention of the present invention.

As described above, according to the structure of the semiconductor chip package multi-supply device having the multi-head and the turntable of the present invention, the package tray mounting process on the pallet can be eliminated by manually supplying the package tray without using the pallet. As a result, the problem of time loss and process increase can be solved, and the pickup heads can be simultaneously picked up at intervals corresponding to the intervals between the semiconductor chip packages loaded in the package tray. A shortening effect can also be obtained. In addition, the use of a rotary table for transfer to the next pick-up point of the semiconductor chip package eliminates mechanical errors in the transfer through the use of the moving shaft, thereby providing the effect of rapid and accurate supply of the semiconductor chip package. You can get it.

Claims (1)

A package tray in which a plurality of semiconductor chip packages are stacked; A tray supply unit supplying the package tray; A tray transfer unit which transfers the supplied package tray; A first head portion configured with a plurality of first pickup heads configured at intervals corresponding to the semiconductor chip package intervals in the package tray and simultaneously performing a pickup operation; A first head moving part positioned next to the tray conveying part and configured with the first head part and having at least two moving axes combined to move the position of the first head part forward, backward, left and right; A plurality of package beds in which the semiconductor chip package is placed are formed at predetermined edges of the upper surface of the rotatable body which is positioned after the first head moving part and rotates by a predetermined angle about a central axis each time. A rotary table having a vacuum suction port capable of suction fixing the chip package; A second head portion configured with a plurality of second pickup heads configured at intervals corresponding to the semiconductor chip package intervals carried from the rotating table and simultaneously performing a pickup operation; And And a second head moving part positioned next to the rotating table and configured to combine the at least two moving axes to move the position of the second head part forward, backward, left and right. The semiconductor chip package multiple supply apparatus provided with the multiple head and the rotary table.