JPH01297801A - チップ部品 - Google Patents
チップ部品Info
- Publication number
- JPH01297801A JPH01297801A JP12811688A JP12811688A JPH01297801A JP H01297801 A JPH01297801 A JP H01297801A JP 12811688 A JP12811688 A JP 12811688A JP 12811688 A JP12811688 A JP 12811688A JP H01297801 A JPH01297801 A JP H01297801A
- Authority
- JP
- Japan
- Prior art keywords
- components
- substrate
- chip
- dimples
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 239000004020 conductor Substances 0.000 abstract description 5
- 238000007665 sagging Methods 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- -1 silver ions Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12811688A JPH01297801A (ja) | 1988-05-25 | 1988-05-25 | チップ部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12811688A JPH01297801A (ja) | 1988-05-25 | 1988-05-25 | チップ部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01297801A true JPH01297801A (ja) | 1989-11-30 |
| JPH0563081B2 JPH0563081B2 (OSRAM) | 1993-09-09 |
Family
ID=14976774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12811688A Granted JPH01297801A (ja) | 1988-05-25 | 1988-05-25 | チップ部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01297801A (OSRAM) |
-
1988
- 1988-05-25 JP JP12811688A patent/JPH01297801A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563081B2 (OSRAM) | 1993-09-09 |
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