JPH01291434A - 樹脂封止型電子部品の製造方法 - Google Patents
樹脂封止型電子部品の製造方法Info
- Publication number
- JPH01291434A JPH01291434A JP12262288A JP12262288A JPH01291434A JP H01291434 A JPH01291434 A JP H01291434A JP 12262288 A JP12262288 A JP 12262288A JP 12262288 A JP12262288 A JP 12262288A JP H01291434 A JPH01291434 A JP H01291434A
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- resin
- mold
- plate
- slide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000011347 resin Substances 0.000 claims abstract description 66
- 229920005989 resin Polymers 0.000 claims abstract description 66
- 238000007789 sealing Methods 0.000 claims abstract description 39
- 238000000465 moulding Methods 0.000 claims description 34
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 239000011800 void material Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 241000208140 Acer Species 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 101100224748 Caenorhabditis elegans pir-1 gene Proteins 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12262288A JPH01291434A (ja) | 1988-05-19 | 1988-05-19 | 樹脂封止型電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12262288A JPH01291434A (ja) | 1988-05-19 | 1988-05-19 | 樹脂封止型電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01291434A true JPH01291434A (ja) | 1989-11-24 |
| JPH0514423B2 JPH0514423B2 (enrdf_load_stackoverflow) | 1993-02-25 |
Family
ID=14840521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12262288A Granted JPH01291434A (ja) | 1988-05-19 | 1988-05-19 | 樹脂封止型電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01291434A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5920768A (en) * | 1996-12-19 | 1999-07-06 | Denso Corporation | Manufacturing method for a resin sealed semiconductor device |
-
1988
- 1988-05-19 JP JP12262288A patent/JPH01291434A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5920768A (en) * | 1996-12-19 | 1999-07-06 | Denso Corporation | Manufacturing method for a resin sealed semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514423B2 (enrdf_load_stackoverflow) | 1993-02-25 |
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