JPH0129078B2 - - Google Patents
Info
- Publication number
- JPH0129078B2 JPH0129078B2 JP58109627A JP10962783A JPH0129078B2 JP H0129078 B2 JPH0129078 B2 JP H0129078B2 JP 58109627 A JP58109627 A JP 58109627A JP 10962783 A JP10962783 A JP 10962783A JP H0129078 B2 JPH0129078 B2 JP H0129078B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- metal plate
- prepreg
- resin
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 60
- 229910052751 metal Inorganic materials 0.000 claims description 60
- 239000011347 resin Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 26
- 238000007747 plating Methods 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 239000011889 copper foil Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 239000002131 composite material Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 239000011162 core material Substances 0.000 description 15
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000004744 fabric Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10962783A JPS601892A (ja) | 1983-06-18 | 1983-06-18 | 金属芯印刷配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10962783A JPS601892A (ja) | 1983-06-18 | 1983-06-18 | 金属芯印刷配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS601892A JPS601892A (ja) | 1985-01-08 |
| JPH0129078B2 true JPH0129078B2 (US20050192411A1-20050901-C00012.png) | 1989-06-07 |
Family
ID=14515073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10962783A Granted JPS601892A (ja) | 1983-06-18 | 1983-06-18 | 金属芯印刷配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS601892A (US20050192411A1-20050901-C00012.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0685467B2 (ja) * | 1985-04-01 | 1994-10-26 | 三菱電機株式会社 | 金属芯プリント配線板の製造方法 |
| JPH01208109A (ja) * | 1988-02-15 | 1989-08-22 | Matsushita Electric Works Ltd | 電気積層板の製造方法 |
| JP5345885B2 (ja) * | 2009-03-30 | 2013-11-20 | 新日鐵住金株式会社 | 脆性き裂伝播停止特性評価方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5637720A (en) * | 1979-09-05 | 1981-04-11 | Nippon Gakki Seizo Kk | Channel divider |
-
1983
- 1983-06-18 JP JP10962783A patent/JPS601892A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5637720A (en) * | 1979-09-05 | 1981-04-11 | Nippon Gakki Seizo Kk | Channel divider |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS601892A (ja) | 1985-01-08 |
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